The USB 3.0 Promoter Group today announced that the USB
Power Delivery specification and SuperSpeed USB
Inter-Chip (SSIC) specification are both on track for
completion by the end of Q2 2012.
Both specifications are currently at a 0.9 draft
completion level, essentially the equivalent of final
specifications that implementers can use to start
developing products. Prototyping activities to help
validate the major technical elements of each
specification are well underway and will be completed
prior to the final release of these specifications.
The USB power delivery specification will enable
increased power delivery via USB cables and connectors,
expanding cable bus power capabilities in USB
applications. The specification enables higher voltage
and current to deliver power up to 100 Watts. It also
enables a switchable source of power delivery without
changing cable direction. The specification is compatible
with existing cables and connectors and will coexist with
the USB Battery Charging 1.2 specification and existing
USB bus-powered applications.
The SSIC specification will define a chip-to-chip USB
based interconnect optimized for mobile device internal
use. The specification will bring the MIPI Alliance?s
M-PHY high bandwidth and low power capabilities combined
with the performance enhancements of SuperSpeed USB.
The USB 3.0 Promoter Group intends to transition the
final specifications to the USB Implementers Forum
(USB-IF) for publication and establishment of the
ecosystems and associated compliance programs by the end
of Q2 2012.