Saturday, November 01, 2014
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Amazon's Workforce Is Mainly Male, White
HP Smartwatch Looks Classic, Coming Next Week
North Korea Blocks Foreigners' Access To Facebook, Twitter
Pirate Bay Co-founder Sentenced To 42 Months Imprisonment
SEL Showcases 1058ppi And Foldable OLED Displays
New Outlook for Mac Available Now, Office for Mac Coming In 2015
Updated BBM Offers More Privacy, Control and More
Panasonic Raises Profit Outlook
Active Discussions
DVD/DL for Optiarc 7191S at 8X
Copied dvd's say blank in computer only
Made video, won't play back easily
New Features In Firefox 33
updated tests for dvd and cd burners
How to generate lots of different CDs quickly
Yamaha CRW-F1UX
help questions structure DVDR
 Home > News > PC Parts > New Spe...
Last 7 Days News : SU MO TU WE TH FR SA All News

Wednesday, April 11, 2012
New Specs To Extend USB 3.0 Capabilities


The USB 3.0 Promoter Group today announced that the USB Power Delivery specification and SuperSpeed USB Inter-Chip (SSIC) specification are both on track for completion by the end of Q2 2012.

Both specifications are currently at a 0.9 draft completion level, essentially the equivalent of final specifications that implementers can use to start developing products. Prototyping activities to help validate the major technical elements of each specification are well underway and will be completed prior to the final release of these specifications.

The USB power delivery specification will enable increased power delivery via USB cables and connectors, expanding cable bus power capabilities in USB applications. The specification enables higher voltage and current to deliver power up to 100 Watts. It also enables a switchable source of power delivery without changing cable direction. The specification is compatible with existing cables and connectors and will coexist with the USB Battery Charging 1.2 specification and existing USB bus-powered applications.

The SSIC specification will define a chip-to-chip USB based interconnect optimized for mobile device internal use. The specification will bring the MIPI Alliance?s M-PHY high bandwidth and low power capabilities combined with the performance enhancements of SuperSpeed USB.

The USB 3.0 Promoter Group intends to transition the final specifications to the USB Implementers Forum (USB-IF) for publication and establishment of the ecosystems and associated compliance programs by the end of Q2 2012.


Previous
Next
Buffalo And IO Data Release First 14x Blu-ray Disc Burners        All News        Nokia 900 Smartphone Bug Identified
IBM Targets Rivals With Highly-inegrated PureSystems     PC Parts News      Intel Announces Small Business Advantage, Collaborations With Chinese Technology Insitutes And The PCIe 910 Series Of SSDs at IDF

Get RSS feed Easy Print E-Mail this Message

Related News
Researchers Say USB Critically Flawed
Silicon Motion Introduces the High-Performance USB 3.0 Controller
New SuperSpeed USB Developments Increase Speed and Power Delivery
Renesas Introduces Second Generation USB 3-SATA3 Bridge SoC
USB 3.0 To Offer 10 Gbps Speeds
Renesas Introduces Compact USB 3.0 Hub Controller
USB Power Delivery Specification Finalized
New SuperSpeed USB Inter-Chip Specification Available
New USB 3.0-Compliant USB Flash Memory by Toshiba
Renesas Receives USB-IF Certification for its USB 3-SATA3 Bridge SoC
Bring USB 3.0 Performance to Your existing HDD
Renesas Introduces First USB 3.0-SATA 3 Bridge SoC Supporting The UASP Protocol

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2014 - All rights reserved -
Privacy policy - Contact Us .