Tuesday, December 12, 2017
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Facebook to Book Advertising Revenue Locally Following Pressure
New Radeon Software Adrenalin Edition Provides Amped-Up Connected Gaming
Nintendo Says Switch Sells 10 Million Worldwide
Toshiba Unveils Embedded NAND Flash Memory Products for Automotive Applications
FCC to Hand Over Internet Oversight to FTC
Japan Display Develops 803ppi LCD Designed for Virtual Reality Applications
Samsung TVs to Start Streaming Amazon HDR10 Plus Video Content
Toshiba and Western Digital Close to Agreement Over Memory Chip Sale
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > PC Parts > GLOBALF...
Last 7 Days News : SU MO TU WE TH FR SA All News

Thursday, March 22, 2012
GLOBALFOUNDRIES Dresden Fab Ships 250,000th 32nm HKMG Wafer


GLOBALFOUNDRIES announced that its Fab 1 in Dresden, Germany has shipped a quarter of a million semiconductor wafers based on 32nm High-k Metal Gate (HKMG) technology.

According to the company, on a unit basis, cumulative 32nm shipments for the first five quarters of wafer production are more than double that achieved during the same period of the 45nm technology ramp, demonstrating that the overall 32nm ramp has significantly outpaced the 45nm ramp, despite the integration of a number of new and complex elements in both design and process technologies.

"AMD and GLOBALFOUNDRIES worked in close partnership during 2011, and today's announcement is a testament to the progress we have made together," said AMD president and CEO Rory Read. "In just one quarter, we were able to see more than a doubling of yields on 32nm, allowing us to exit 2011 having exceeded our 32nm product shipment requirements. Based on this successful ramp of 32nm HKMG, we are committed to moving ahead on 28nm with GLOBALFOUNDRIES."

"Early in 2011 we met significant challenges in early yield learning on 32nm HKMG," said GLOBALFOUNDRIES CEO Ajit Manocha. "However, we made several organizational and operational changes in the second half of the year that led to a dramatic increase in production velocity and major breakthroughs in yield learning. And since our 28nm technology uses the same HKMG implementation as 32nm, AMD and other customers will benefit greatly from our high-volume ramp of leading-edge APUs at 32nm."

At Fab 1 in Dresden, GLOBALFOUNDRIES recently completed construction of an additional wafer manufacturing facility designed to add capacity at 45nm and below, which has the potential to increase the overall output of the Fab 1 campus to 80,000 wafers per month once fully ramped. The expansion project is adding more than 110,000 square feet of cleanroom space to the site, making Fab 1 the largest wafer fab in Europe for leading-edge technology. More than 50 percent of Fab 1's production is now on HKMG technology. In addition to the 32nm technology, GLOBALFOUNDRIES says that its 28nm HKMG offerings are qualified and ready for design-in today.


Previous
Next
Samsung to Update GALAXY Note        All News        MediaTek Launches New Audio-video Compression Software
Super Talent Releases New RAIDDrive upStream PCI3 SSD     PC Parts News      TDK eSSD Series Chip Integrates NAND And Flash Memory Controller Into a Single Package

Get RSS feed Easy Print E-Mail this Message

Related News
Intel Uses Cobalt Interconnect for 10nm, Global Foundries Detail EUV Lithography for 7nm
Globalfoundries and Intel to Talk About 10, 7nm at IEDM
GLOBALFOUNDRIES Introduces AutoPro Automotive Platform for Connected Cars
Globalfoundries Asks EU to Probe TSMC
GLOBALFOUNDRIES Introduces New 12nm FinFET Technology
GLOBALFOUNDRIES and IBM Develop Custom 14nm FinFET Technology That Leverages both FinFET and SOI
GLOBALFOUNDRIES Says New 7LP Technology Offers 40 Percent Performance Boost Over 14nm FinFET
GLOBALFOUNDRIES and Chengdu Invest in China-based FDX FD-SOI Design Centers
GLOBALFOUNDRIES Invests For Capacity Growth In The US, Germany, China and Singapore
KAIST Sues Samsung, Qualcomm And Globalfoundries Over FinFET Patent Infringement
TSMC, GlobalFoundries/Samsung To Present Their 7nm Platforms At IEDM
GLOBALFOUNDRIES Debuts 7nm FinFET Technology, Embedded MRAM

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2017 - All rights reserved -
Privacy policy - Contact Us .