Tuesday, October 21, 2014
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
China Denies Apple's iCloud Hack Allegations
Samsung Galaxy KNOX Devices Approved for U.S. Government Classified Use
iPhone 6 Demand Help ARM's Growth
SK Hynix Develops High Density 16GB NVDIMM
Samsung Mass Produces 8-Gigabit DDR4 Based on 20 Nanometer Process Technology
Strong iPhone, Mac And App Store Sales Drive Apple's Record September Quarter Revenue And Earnings
Apple iOS 8.1 Available For Download
E FUN To Relase $179 Windows tablet
Active Discussions
Copied dvd's say blank in computer only
How to generate lots of different CDs quickly
Yamaha CRW-F1UX
help questions structure DVDR
Made video, won't play back easily
Questions durability monitor LCD
Questions fungus CD/DVD Media, Some expert engineer in optical media can help me?
CD, DVD and Blu-ray burning for Android in development
 Home > News > General Computing > Xilinx ...
Last 7 Days News : SU MO TU WE TH FR SA All News

Tuesday, March 13, 2012
Xilinx and Micron Demonstrate Hardware Interoperability of FPGA and RLDRAM 3 Memory Interface Standard


Xilinx and Micron today announced the first public hardware demonstration of an FPGA interfacing with RLDRAM 3 memory, a new and emerging memory standard for high-end networking applications such as packet buffering and inspection, linked lists, and lookup tables.

Operating with Virtex-7 and Kintex-7 FPGAs at data rates up to 1600 megabits per second (Mb/s), Micron's RLDRAM 3 memory combines high density, high bandwidth and fast SRAM-like random access to enable a 60 percent higher data rate and memory bandwidth compared to that of the previous generation (Virtex-6 FPGAs/RLDRAM2 memory standard). RLDRAM 3 memory enables 40G and 100G networking systems that require higher speed, higher density, lower power and lower latency.

Virtex-7 and Kintex-7 FPGAs are designed with the necessary IO standards and architectural components for optimal interfacing with RLDRAM 3, providing a significant boost to system performance for wireless and wired networking systems. RLDRAM 3 memory uses innovative circuit design to minimize the time between the beginning of an access cycle and the instant that the first data is available. Ultra-low bus turnaround time enables higher sustainable bandwidth with near-term balanced read-to-write ratios.

Availability/Ordering Information Hardware demonstrations of the Xilinx RLDRAM 3 Memory interface IP core are available now with user configurable IP cores available in ISE Design Suite 13.4 in September 2012. Qualified Micron RLDRAM 3 memory devices are available now in x18 and x36 organizations across all speed grades from 800 to 1066MHz.


Previous
Next
NVIDIA Begins Windows 8 Driver Updates        All News        Sony Introduces The Xperia Sola Smartphone
Mozilla Launches Firefox 11     General Computing News      Apple Patches Many Safari Bugs With Latest update

Get RSS feed Easy Print E-Mail this Message

Related News
Micron Launches SDK For Its Automata Processor
Micron M600 SSD Released With Dynamic SLC Cache
Tessera and Micron Execute New Technology and Patent License Agreements
Micron Announces Monolithic 8Gb DDR3 SDRAM
Micron, SK Hynix May Invest In Taiwan SSD Controller Companies
Micron to Discuss Emerging Memories at 2014 Symposia on VLSI Technology and Circuits
Crucial Starts Sampling DDR4 Server Memory
Micron Releases New Solid State Drive For Data Centers
Micron, MediaTek Consider Investments In Kingston Solutions
Micron and Wave Systems Collaborate to Secure Connected Devices
Micron Reports Second-Quarter Profit
Micron To Offer DDR4 Modules for Future Intel Xeon Systems

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2014 - All rights reserved -
Privacy policy - Contact Us .