Saturday, October 25, 2014
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Google's Pichai to Become Head of Product at Google: report
Internet Explorer 11 Toolkit Allows Enterprise Admins "Spy" On Their Employees
FCC Says Airwave Auction To Delay Until 2016
HP Broadens Moonshot Portfolio With Intel-powered Models
Microsoft To Keep Nokia Brand For Low-end Smartphones
LG Introduces Its First Octa-Core Application Processor
Cloud and Surface 3 Drive Microsoft's Revenue
Micron Urges Investors To Reject TRC Capital's Unsolicited Tender Offer
Active Discussions
Copied dvd's say blank in computer only
How to generate lots of different CDs quickly
Yamaha CRW-F1UX
help questions structure DVDR
Made video, won't play back easily
Questions durability monitor LCD
Questions fungus CD/DVD Media, Some expert engineer in optical media can help me?
CD, DVD and Blu-ray burning for Android in development
 Home > News > Mobiles > Japanes...
Last 7 Days News : SU MO TU WE TH FR SA All News

Friday, February 24, 2012
Japanese Companies Develop LSI IP For For Multi-standard Modems


NTT DOCOMO, NEC Corp., Panasonic Mobile Communications and Fujitsu Ltd. have jointly developed the software and hardware intellectual property for an (LSI) chip that will enable small modems to support the GSM, W-CDMA, HSPA+ and LTE mobile standards.

The companies have already completed performance evaluation of the LSI engineering sample chip along with all testing required to confirm interconnectivity to the mobile networks of major vendors.

The single chip solution for modems reduces power consumption by about 20% during both communication and stand-by, as well as decreases the production cost for mobile devices.

All mobile broadband standards supported by the chip meet 3rd Generation Partnership Project (3GPP) specifications. The LTE standard supports FDD (Frequency Division Duplexing) mode adopted by DOCOMO and TDD (Time Division Duplexing) mode expected to be adopted for LTE networks in China and other markets.

The four partners, in addition to other layers in the mobile technology field, aim to commercialize the chip in Japan and other countries as quickly as possible in response to market demands for smaller and more affordable mobile devices.

The group additionally plans to pursue development of a multi-standard chip that is also compliant with the LTE-Advanced next-generation transmission standard.


Previous
Next
Q4 Graphics Shipments Decreased Over Last Quarter, Increased Over Last Year        All News        Visual Studio 11 Beta and .NET Framework 4.5 Beta Make Software Development Faster
Dropbox Unveils Photo Upload Feature For Mobiles     Mobiles News      T-Mobile USA To Offer 4G LTE in US Next Year

Get RSS feed Easy Print E-Mail this Message

Related News
Microsoft Releases New Kinect SDK And Adapter Kit
NEC Technology Helps Take Less Stressful Blood Pressure Measurements
Samsung, Intel, Dell, Boradcom Team Up On Standards For Internet of Things
NTT Docomo Replaces Phone SIMs With Portable Device
LG U+ Demonstrates 300MBps Wireless Network in Seoul
NTT DOCOMO To Trail 5g With Fujitsu, Ericsson
NEC Releases Face-authentication Software For PCs
Microsoft Reveals Kinect for Windows v2
Altera and Intel To Make Multi-Die Devices
ZTE Announces LTE Advanced CAT6 Mobile Hotspot Device
Qualcomm and Deutsche Telekom Collaborate on LTE Direct Operator Trial
NTT DoCoMo To Offer Smart Clothing

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2014 - All rights reserved -
Privacy policy - Contact Us .