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Wednesday, February 08, 2012
IBM, Samsung and GLOBALFOUNDRIES to Showcase Next-Generation Chip Technology at Forum

IBM, Samsung and GLOBALFOUNDRIES will preview their latest developments in silicon technology at the 2012 Common Platform Technology Forum to be held at the Santa Clara Convention Center on March 14.

The companies will address next-generation semiconductor innovation covering critical topics such as 28-, 20- and 14-nanometer processes, as well as innovations beyond 14nm and 450mm wafer manufacturing. Technology jointly developed by the Common Platform companies -- including more than 20 additional member companies -- power the majority of the world's mobile devices and consumer electronics.

Panasonic Expands Full HD Projector Lineup        All News        Researchers Claim 100-fold Increase In Data Storage Speeds Using Laser-heated Magnetic Disks
Engineers Boost Processor Performance By Over 20 Percent Using GPUs     PC Parts News      IBM boosts XIV Storage System Gen3 Performance with SSD Caching Option

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