Thursday, September 29, 2016
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
CORSAIR Launches DOMINATOR PLATINUM Special Edition DDR4 Memory
Apple Partners With Deloitte In New Enterprise Push
Europol Says Ransomware Is A Top Cybercrime Threat
New Amazon Fire TV Stick Comes With Alexa Voice Remote
Qualcomm Snapdragon 600E and 410E For Embedded Applications Now Available Through Arrow Electronics
NVIDIA Launches New AI Technology At Third Regional GPU Tech Conference
Blackberry Offifially Stops Making Smartphones, Outsources Mobile Business To Indonesian BB Merah Putih
SpaceX Chief Envisions Ships Flying to City On Mars
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > General Computing > TSMC To...
Last 7 Days News : SU MO TU WE TH FR SA All News

Thursday, February 02, 2012
TSMC To Launch 3-D IC Assembly in 2013


Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) will announce 3-D IC assembly service as a general offering at the beginning of next year.

The technology is called COWOS, standing for chip on wafer on substrate, Maria Marced, president of TSMC Europe, told the EETimes web site.

TSMC is already working with companies on the use of silicon interposer layers to carry multiple die. However, when the 3-D IC assembly service is offered TSMC plans that for most customers the 3-D assembly is done by TSMC.

3-D IC packaging allows for using wide I/O DRAM, which relieves bandwidth issues and reduced energy consumption.

The use of multiple die in components would likely change the nature of IC logic and SoC design. It would allow different functions to be developed on different optimized processes and brought together making use of through silicon vias (TSVs) created in thinned wafers. TSMC is offering a TSV-first approach to 3-D IC stacking.


Previous
Next
Worldwide Mobile Phone Market Maintains Its Growth in the Fourth Quarter        All News        Updated Google Docs for Android Offers Offline Access
Germany Rejects Apple's Sales Ban Bid     General Computing News      Updated Google Docs for Android Offers Offline Access

Get RSS feed Easy Print E-Mail this Message

Related News
TSMC To Use Different Processes And 3D Packages Across Future Design Platforms
TSMC 7nm Volume Production To Start In 1Q18
TSMC Foundry Market Share Drops in 2016
Samsung, TSMC And Intel Set To Expand Their Chip Production Capacities In 2H
TSMC To Follow The Extreme Ultraviolet Approach For 5nm
TSMC 2Q16 Profits Fall, Revenue Grew
TSMC to Boost R&D Spending To Accelerate Development Of More Advanced Chips
ARM And TSMC Validate First Multicore Test Chip Based on 10FinFET Technology
TSMC On Track To Move InFO Packaging Technology to Volume Production
TSMC Forecasts Slow Sales Amid Smartphone Slowdown
TSMC To Build 12-inch Fab In China
ARM and TSMC To Collaborate on 7nm FinFET Process Technology

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2016 - All rights reserved -
Privacy policy - Contact Us .