Friday, March 06, 2015
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Three People Charged with One of the Largest Reported Data Breaches in U.S. History
GIGABYTE Launches New X99 Champion Series Motherboards
ASUS Announces New GR8S Steam Machine
Windows Also Vulnerable to FREAK Encryption Flaw
Fujitsu Technology Recognizes Faces Appearing In Low-Resolution Images
Apple Allowed App Developers Fine-tune Apps Before Watch Debut
Google Introduces Insurance Shopping Site
U.S. Trade Office Releases Latest Notorious Markets List
Active Discussions
Hello
Newbie
Need serious help!!!!
burning
nvidia 6200 review
Burning Multimedia in track 0
I'm lazy. Please help.
sanyo e6 camera
 Home > News > General Computing > TSMC To...
Last 7 Days News : SU MO TU WE TH FR SA All News

Thursday, February 02, 2012
TSMC To Launch 3-D IC Assembly in 2013


Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) will announce 3-D IC assembly service as a general offering at the beginning of next year.

The technology is called COWOS, standing for chip on wafer on substrate, Maria Marced, president of TSMC Europe, told the EETimes web site.

TSMC is already working with companies on the use of silicon interposer layers to carry multiple die. However, when the 3-D IC assembly service is offered TSMC plans that for most customers the 3-D assembly is done by TSMC.

3-D IC packaging allows for using wide I/O DRAM, which relieves bandwidth issues and reduced energy consumption.

The use of multiple die in components would likely change the nature of IC logic and SoC design. It would allow different functions to be developed on different optimized processes and brought together making use of through silicon vias (TSVs) created in thinned wafers. TSMC is offering a TSV-first approach to 3-D IC stacking.


Previous
Next
Worldwide Mobile Phone Market Maintains Its Growth in the Fourth Quarter        All News        Updated Google Docs for Android Offers Offline Access
Germany Rejects Apple's Sales Ban Bid     General Computing News      Updated Google Docs for Android Offers Offline Access

Get RSS feed Easy Print E-Mail this Message

Related News
TSMC Achieves EUV Productivity Milestone
TSMC Selling Sold ASML Stake
TSMC Sells LED Unit to Epistar
TSMC Chairman Sees Technical Hurdles In keeping Up With Moore's Law
TSMC To Make Intel's SoFIA Handset Chips
TSMC 16FinFET Plus Process Achieves Risk Production Milestone
TSMC Said To Make New iPad Processor
ARM and TSMC Unveil Roadmap for 64-bit ARM-based Processors on 10FinFET Process
TSMC and ARM Announce 16nm FinFET Silicon with 64-bit ARM big.LITTLE Technology
TSMC Launches Ultra-Low Power Technology Platform for IoT and Wearable Devices
TSMC Delivers First 16FinFET Networking Processor
TSMC Acquires EUV Machines For 10nm Chips

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2015 - All rights reserved -
Privacy policy - Contact Us .