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 Home > News > General Computing > Rambus ...
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Thursday, December 15, 2011
Rambus and ITRI to Develop Interconnect and Advanced 3D Packaging Technologies


Rambus is engaging with the Industrial Technology Research Institute (ITRI) in Taiwan, one of the world's leading research institutes, on the development of interconnect and 3D packaging technologies.

In addition, Rambus has joined the Advanced Stacked-System Technology and Application Consortium (Ad-STAC), a multinational research association led by ITRI. Rambus and ITRI will work together as members of Ad-STAC on the development of system integration using silicon interposer technology.

Initially, the two companies will work together on the development of system integration using silicon interposer technology.

"Collaborating with leading research institutions, such as ITRI, is an effective way for us to advance 3D packaging technology for the broader manufacturing community," said John Kent, vice president of Technology Development at Rambus. "Combining Rambus experience in high-performance system design and ITRI package research experience can enable new breakthroughs in 3D IC system integration and design."

"This collaboration brings together Rambus' advanced high-bandwidth and low-power device designs and ITRI's know-how in fabrication with our 12-inch equipment," said Dr. Ian Chan, VP and general director of the Electronics and Optoelectronics Research Laboratories at ITRI. "We expect to achieve some compelling and useful results through our joint efforts."


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