Tuesday, July 07, 2015
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Entertainment in Windows 10
AMD Lowers Second Quarter Outlook, Moves To FinFet
Instagram To Show HD Photos
Polaroid And GoPro Launch New Action Cams
Samsung's s 2TB 850 PRO SSDs Are Rolling Out Globally
JDI Touts Energy Efficient Reflective Display
LG Display Launches Slimmer LCD Panels with Advanced In-Cell Touch Technology for Notebook PCs
Minecraft Windows 10 Edition Beta Revealed
Active Discussions
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
How to burn a backup copy of The Frozen Throne
Help make DVDInfoPro better with dvdinfomantis!!!
Copied dvd's say blank in computer only
menu making
Optiarc AD-7260S review
 Home > News > General Computing > Rambus ...
Last 7 Days News : SU MO TU WE TH FR SA All News

Thursday, December 15, 2011
Rambus and ITRI to Develop Interconnect and Advanced 3D Packaging Technologies


Rambus is engaging with the Industrial Technology Research Institute (ITRI) in Taiwan, one of the world's leading research institutes, on the development of interconnect and 3D packaging technologies.

In addition, Rambus has joined the Advanced Stacked-System Technology and Application Consortium (Ad-STAC), a multinational research association led by ITRI. Rambus and ITRI will work together as members of Ad-STAC on the development of system integration using silicon interposer technology.

Initially, the two companies will work together on the development of system integration using silicon interposer technology.

"Collaborating with leading research institutions, such as ITRI, is an effective way for us to advance 3D packaging technology for the broader manufacturing community," said John Kent, vice president of Technology Development at Rambus. "Combining Rambus experience in high-performance system design and ITRI package research experience can enable new breakthroughs in 3D IC system integration and design."

"This collaboration brings together Rambus' advanced high-bandwidth and low-power device designs and ITRI's know-how in fabrication with our 12-inch equipment," said Dr. Ian Chan, VP and general director of the Electronics and Optoelectronics Research Laboratories at ITRI. "We expect to achieve some compelling and useful results through our joint efforts."


Previous
Next
Nokia Lumia 710 Windows Phone Coming In U.S. at T-Mobile        All News        LG and Intel Collaborate on Intel WiDi
Tech Execs Write Open Letter Opposing SOPA     General Computing News      GLOBALFOUNDRIES and ARM Deliver 28nm SoC Solution Based on ARM Cortex-A Series Processors

Get RSS feed Easy Print E-Mail this Message

Related News
Rambus and SK Hynix Extend Their License Agreement
Rambus Develops R+ DDR4/3 PHY on Samsung 28nm LPP Process
Citrix Introduces New XenServer
Rambus Signs License Agreement with Qualcomm
Rambus and Nanya Sign Patent License Agreement
Rambus CMOS Sensor Fits In Cameras Without Lens
Rambus Signs Agreement with Samsung
Rambus Settles Patent Disputes With Micron
Rambus Signs Agreement with STMicroelectronics
Rambus and SK Hynix Sign Patent License Agreement
NVIDIA GRID vGPU Now Integrated into Citrix XenDesktop 7
Rambus Pleased With Court Ruling In SK Hynix Case

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2015 - All rights reserved -
Privacy policy - Contact Us .