Friday, August 18, 2017
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Google Home Now Supports Free Calls
Asus Unveils the ZenFone 4 Pro, ZenFone 4, ZenFone 4 Selfie Pro, and ZenFone 4 Selfie
Nokia 8 Shipped With ZEISS Optics
Apple is Getting Serious in TV Shows and Film Prospect
Acer's New 4K Projectors Bring the Benefits of Cinema Home
Fiat Chrysler Joins BMW, Intel, Mobileye in Autonomous Driving Team
Kingston Adds Lower 4GB and 8GB Capacities to DataTraveler 2000 Encrypted USB
Intel Ice Lake Architecture Will Find its Way to 10nm+ Chips
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > General Computing > Toshiba...
Last 7 Days News : SU MO TU WE TH FR SA All News

Thursday, December 01, 2011
Toshiba to Reorganize Japanese Semiconductor Production Facilities


Toshiba has announced a reorganization of its semiconductor production facilities in Japan, in an effort to reinforce the operating structure and profitability of the discrete, analog and imaging IC businesses.

The reorganization will concentrate the front- and back-end production processes of six discrete semiconductor facilities into three major facilities: Hijimeji Operations-Semiconductor (Ibo-gun, Hyogo prefecture); Kaga Toshiba Electronics Corporation (Nomi, Ishikawa prefecture); and Buzen Toshiba Electronics Corporation (Buzen, Fukuoka prefecture).

In parallel with this, Toshiba will phase out production at three facilities during the first half fiscal year of 2012: Kitakyushu Operations (Kitakyushu, Fukuoka prefecture) and Hamaoka Toshiba Electronics Corporation (Omaezaki, Shizuoka prefecture), which carry out front-end production of optical semiconductors; and Toshiba Components Co., Ltd. (Mobara, Chiba prefecture), an assembly facility for power semiconductors.

Toshiba believes that the concentration of domestic production of discrete products at three major facilities will strengthen the company's cost competitiveness and help it focus on higher value added products.

Following the reorganization, Himeji Semiconductor Operations will continue to strengthen its function as a development center for power semiconductors and small signal devices. Kaga Toshiba Electronics Corporation, as a main facility for the power semiconductor front-end process, will increase capacity on its current 8-inch wafer product line and expand production to include the front-end process for optical semiconductors.

Buzen Toshiba will assume the new function of development center for assembly and packaging technologies for optical semiconductors. It will increase consignment to overseas pursuing cost competitiveness, and its production will be limited to focused products.

In the analog and imaging IC businesses, Toshiba will continue to promote a shift to production on larger wafers to improve manufacturing efficiency and cost competitiveness. Oita Operations will halve production on its 6-inch wafer line during the first half of fiscal year 2012.

Toshiba has been implementing a series of measures to restructure and strengthen its discrete and analog and imaging IC businesses, including accelerating the transfer of assembly and test operations to overseas facilities, outsourcing, shifting to larger diameter wafer production lines and halving its product line-up.

Regular employees at the affected facilities will, in principle, be redeployed within Toshiba Group.

In addition to the above, Toshiba is responding to the current economic slowdown and fall in demand for consumer products, most notably for PCs and TVs in Europe and the United States, by cutting production at some of its semiconductor facilities from late November 2011 to early January 2012.

Production will be affected at six facilities in all: three Toshiba Corporation facilities - Oita Operations, which produces analog semiconductors and image sensors; Himeji Operations-Semiconductor, which produces discrete semiconductors; and Kitakyushu Operations, which produces optical semiconductor devices - and three Toshiba Group companies, Iwate Toshiba Electronics, which produces ASICs and MCUs; and Kaga Toshiba Electronics and Hamaoka Toshiba electronics, which produces discrete semiconductors.

"Temporary reductions in working and operating hours will give Toshiba the flexibility it needs to respond to the fall off in demand for consumer products," the company said in a statement. Toshiba will monitor the market and demand to make decisions on its operations and production levels after the turn of the year.


Previous
Next
Researcher Claims Carrier IQ Smartphone Software Is a Rootkit        All News        Yahoo Spotlights 2011's Perplexing Newsmakers
EU, Tech Companies to Make Internet Safer For Kids     General Computing News      Yahoo Spotlights 2011's Perplexing Newsmakers

Get RSS feed Easy Print E-Mail this Message

Related News
Toshiba's SG6 SSD Client SSD Uses 64-Layer 3D Flash Memory
Toshiba Announces NVMe over Fabrics Software Technology, Enterprise-Class SSDs with 64-Layer 3D Flash Memory
Toshiba Stops Blocking Western Digital Access to Chip JV, Invests in new chip line without Western Digital
Toshiba Unveils Single Package NVMe Client SSD Utilizing 64-Layer, 3D Flash Memory
Toshiba to Notify Western Digital Before Closing a Memory Sale
Toshiba TR200 SSD Series Uses 64-Layer 3D Flash Memory
Toshiba Resumed Blocking Western Digital Access to JV Database
Court Says Western Digital Should Have Access Toshiba's Technical Databases
Toshiba in Talks with Western Digital, Foxconn Over Memory Unit Sale
Western Digital Responds to Toshiba's Actions
Toshiba Delays Chip Unit Deal, Sues Western Digital
Western Digital Resubmits Bid for Toshiba Chip Unit

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2017 - All rights reserved -
Privacy policy - Contact Us .