Saturday, June 24, 2017
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Google Promises to Stop Reading Your Emails in Gmail
BlackBerry's Software and Services Sales Fell in Q1
Handsets Expected to be Largest Market for ICs
G.SKILL Announces New DDR4 for the Intel X299 HEDT Platform
Toshiba Open to Further Talks With Western Digital About Chip Unit Sale
Foxconn Confirms US Investment Plan
Tesla Could Enter the Music-Streaming Business
Youtube Unveils New VR180 Format
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > General Computing > Toshiba...
Last 7 Days News : SU MO TU WE TH FR SA All News

Thursday, December 01, 2011
Toshiba to Reorganize Japanese Semiconductor Production Facilities


Toshiba has announced a reorganization of its semiconductor production facilities in Japan, in an effort to reinforce the operating structure and profitability of the discrete, analog and imaging IC businesses.

The reorganization will concentrate the front- and back-end production processes of six discrete semiconductor facilities into three major facilities: Hijimeji Operations-Semiconductor (Ibo-gun, Hyogo prefecture); Kaga Toshiba Electronics Corporation (Nomi, Ishikawa prefecture); and Buzen Toshiba Electronics Corporation (Buzen, Fukuoka prefecture).

In parallel with this, Toshiba will phase out production at three facilities during the first half fiscal year of 2012: Kitakyushu Operations (Kitakyushu, Fukuoka prefecture) and Hamaoka Toshiba Electronics Corporation (Omaezaki, Shizuoka prefecture), which carry out front-end production of optical semiconductors; and Toshiba Components Co., Ltd. (Mobara, Chiba prefecture), an assembly facility for power semiconductors.

Toshiba believes that the concentration of domestic production of discrete products at three major facilities will strengthen the company's cost competitiveness and help it focus on higher value added products.

Following the reorganization, Himeji Semiconductor Operations will continue to strengthen its function as a development center for power semiconductors and small signal devices. Kaga Toshiba Electronics Corporation, as a main facility for the power semiconductor front-end process, will increase capacity on its current 8-inch wafer product line and expand production to include the front-end process for optical semiconductors.

Buzen Toshiba will assume the new function of development center for assembly and packaging technologies for optical semiconductors. It will increase consignment to overseas pursuing cost competitiveness, and its production will be limited to focused products.

In the analog and imaging IC businesses, Toshiba will continue to promote a shift to production on larger wafers to improve manufacturing efficiency and cost competitiveness. Oita Operations will halve production on its 6-inch wafer line during the first half of fiscal year 2012.

Toshiba has been implementing a series of measures to restructure and strengthen its discrete and analog and imaging IC businesses, including accelerating the transfer of assembly and test operations to overseas facilities, outsourcing, shifting to larger diameter wafer production lines and halving its product line-up.

Regular employees at the affected facilities will, in principle, be redeployed within Toshiba Group.

In addition to the above, Toshiba is responding to the current economic slowdown and fall in demand for consumer products, most notably for PCs and TVs in Europe and the United States, by cutting production at some of its semiconductor facilities from late November 2011 to early January 2012.

Production will be affected at six facilities in all: three Toshiba Corporation facilities - Oita Operations, which produces analog semiconductors and image sensors; Himeji Operations-Semiconductor, which produces discrete semiconductors; and Kitakyushu Operations, which produces optical semiconductor devices - and three Toshiba Group companies, Iwate Toshiba Electronics, which produces ASICs and MCUs; and Kaga Toshiba Electronics and Hamaoka Toshiba electronics, which produces discrete semiconductors.

"Temporary reductions in working and operating hours will give Toshiba the flexibility it needs to respond to the fall off in demand for consumer products," the company said in a statement. Toshiba will monitor the market and demand to make decisions on its operations and production levels after the turn of the year.


Previous
Next
Researcher Claims Carrier IQ Smartphone Software Is a Rootkit        All News        Yahoo Spotlights 2011's Perplexing Newsmakers
EU, Tech Companies to Make Internet Safer For Kids     General Computing News      Yahoo Spotlights 2011's Perplexing Newsmakers

Get RSS feed Easy Print E-Mail this Message

Related News
Toshiba Open to Further Talks With Western Digital About Chip Unit Sale
Japan-led Consortium Wins Toshiba Memory Bidding
Toshiba Applies Spintronics Technology to Strain-gauge Sensor Element to Boost Sensitivity
Western Digital's SanDisk Subsidiaries Seek Injunctive Relief Against Toshiba in the Superior Court of California
Toshiba Faces New Lawsuit Over Accounting Scandal
Toshiba Announces Next Generation 15,000rpm AL14SX HDD
Apple, Dell, Kingston, Amazon, Could Join Foxconn In Bid for Toshiba Chip Business
Western Digital Said to Sweeten Offer For Toshiba's Memory Unit
Foxconn, Apple and Amazon to join Bid for Toshiba Chip Business: report
Toshiba Buys Back Stake in Toshiba Memory Corporation to Pressure WD
Toshiba, Western Digital Still in Spat Over Chip Unit Auction
New Toshiba XG5 of NVMe SSDs are Using 64-Layer 3D Flash Memory

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2017 - All rights reserved -
Privacy policy - Contact Us .