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Wednesday, November 02, 2011
VIA Brings Fanless Dual Core Computing to Embedded Devices


VIA Technologies today announced the latest Em-ITX form factor board, the VIA EITX-3002, which combines rich I/O with multimedia capabilities.

Partnered with the new VIA AMOS-5002 industrial chassis kit, the VIA EITX-3002 provides a solution for a wide range of durable and fanless next generation devices in medical, healthcare, industrial and building automation, digital signage, kiosk, POI/POS, gaming and surveillance applications.

The VIA EITX-3002 combines the VIA VX900H media system processor with the choice of a 1.2GHz VIA Nano X2 E-Series or 1.0GHz VIA Eden X2 dual core processor offering multimedia capabilities. When combined with the rugged VIA AMOS-5002 Industrial Chassis kit, absolute stability is provided within a wide temperature range in a low profile system less than 36mm high for fanless devices.

The VIA EITX-3002 is based on the 17cm x 12cm Em-ITX form factor, and is powered by a choice of a 1.2GHz VIA Nano X2 E-Series or 1.0GHz VIA Eden X2 dual core processor. The VIA EITX-3002 takes advantage of the VIA VX900H media system processor, a feature packed all-in-one digital media chipset that brings hardware acceleration for the latest HD video formats including MPEG-2, H.264, VC-1, WMV9 and HDCP for Blu-ray content protection in 1080p display. The VIA EITX-3002 supports dual independent display, allowing different content to be shown in different resolutions for superior digital signage displays.

The design of the Em-ITX form factor places the VIA processor and VIA VX900H MSP on the reverse side of the board, optimizing the available real estate for a rich I/O configuration and facilitating slim fanless chassis designs. The VIA EITX-3002 includes an onboard DC-to-DC converter supporting both AT and ATX power modes, and power input voltages of DC 7V to DC 36V. An on board built-in 5-wire/4-wire USB Touch interface makes the EITX-3002 suited for high-end interactive touch screen multimedia applications.

Designed for stability at extreme temperatures, fanless devices based on the VIA EITX-3002 can enjoy stability at temperatures ranging from -10oC to 65oC. Comprehensive functional I/O support in dual I/O coastlines include an HDMI port, VGA port, two Gigabit Ethernet ports, dual COM ports supporting RS-232/422/485 jumper-less by BIOS setting, two USB ports, two USB 3.0 ports (optional), and power and HDD activity LEDs. Onboard connectors included 2 RS-232, four USB 2.0, 8-bit digital I/O, one parallel port, 24-bit LVDS interface, 5-wire resistive touch sensor interface and a thermal sensor by pin headers. The VIA EITX-3002 supports Windows 7, XP, Windows Embedded Standard 2009 and WES7 as well as Debian Linux 6.0 and Android 2.2 operating systems. VIA AMOS-5002 Industrial Chassis Kit

The VIA AMOS-5002 modular industrial chassis kit is an ultra compact solution designed to take full advantage of the VIA EITX-3002 board.

Systems built using the VIA AMOS-5002 chassis kit are completely fanless and the de-thermal design utilizing blade style thermal fins for the dual core processors can withstand a wide temperature range of -20C to 55C. Capable of sustaining a g-force of up to 50, the rugged VIA AMOS-5002 chassis kits are easily assembled and maintained, using only four mechanical pieces to form a fanless system with extensive I/O options.


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