Wednesday, September 24, 2014
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
iOS 8 Update Causing Problems
iPhone 6 Plus Is $100 Costlier For Consumers But Less Than $16 More Expensive for Apple to Make
Microsoft Wireless Display Adapter Connects Miracast Devices to HDTVs
BlackBerry Passport Launches Tomorrow
ASUS ROG Announced The G551 and G771 Gaming Laptops
New VIZIO P-Series Ultra HD LED TVs Start From $1000
Europe Asks More Concessions From Google In Antitrust Dispute
Future Of Apple's Beats Music Remains Uncertain
Active Discussions
Yamaha CRW-F1UX
help questions structure DVDR
Made video, won't play back easily
Questions durability monitor LCD
Questions fungus CD/DVD Media, Some expert engineer in optical media can help me?
CD, DVD and Blu-ray burning for Android in development
IBM supercharges Power servers with graphics chips
Werner Vogels: four cloud computing trends for 2014
 Home > News > PC Parts > 3M and ...
Last 7 Days News : SU MO TU WE TH FR SA All News

Wednesday, September 07, 2011
3M and IBM to Develop Silicon Skyscrapers


3M and IBM plan to jointly develop the first adhesives that can be used to package semiconductors into stacked silicon "towers," aiming to create microprocessors composed of layers of up to 100 separate chips.

Such stacking would allow for dramatically higher levels of integration for information technology and consumer electronics applications. Processors could be tightly packed with memory and networking, for example, into a "brick" of silicon that would create a computer chip 1,000 times faster than today?s fastest microprocessor.

The companies' work can potentially leapfrog today's current attempts at stacking chips vertically - known as 3D packaging. The joint research tackles some of the thorniest technical issues underlying the industry's move to true 3D chip forms. For example, new types of adhesives are needed that can efficiently conduct heat through a densely packed stack of chips and away from heat-sensitive components such as logic circuits.

"Today's chips, including those containing '3D' transistors, are in fact 2D chips that are still very flat structures," said Bernard Meyerson, VP of Research, IBM. "Our scientists are aiming to develop materials that will allow us to package tremendous amounts of computing power into a new form factor - a silicon 'skyscraper.' We believe we can advance the state-of-art in packaging, and create a new class of semiconductors that offer more speed and capabilities while they keep power usage low -- key requirements for many manufacturers, especially for makers of tablets and smartphones."

Many types of semiconductors, including those for servers and games, today require packaging and bonding techniques that can only be applied to individual chips. 3M and IBM plan to develop adhesives that can be applied to silicon wafers, coating hundreds or even thousands of chips at a single time. Current processes are akin to frosting a cake slice-by-slice.

Under the agreement, IBM will draw on its expertise in creating semiconductor packaging processes, and 3M will provide its expertise in developing and manufacturing adhesive materials.

3M is already producing adhesives used in high-tech applications such as the semiconductor industry, consumer electronic devices, aerospace and solar applications.


Previous
Next
HP Introduces New All-in-One PCs        All News        Verizon Motorola Bionic Coming Out Tomorrow
HP Introduces New All-in-One PCs     PC Parts News      Hard Disk Drive Shipments Rise Percent in Second Quarter

Get RSS feed Easy Print E-Mail this Message

Related News
IBM Offers Watson Data Tool To the Mainstream
IBM and Intel Bring New Security Features to the Cloud
IBM Tries To Strengthen Its Presence In China With Local Vendor Deal
U.S. Regulators Clear Sale Of IBM's Server Business to Lenovo
New IBM Chip Simulates Brain Functions
IBM Offered Globalfoundries 1bn Dollars To Take Chip unit: report
IBM Talks With Globalfoundries Stall Over Price: report
Apple and IBM Partner On Enterprise Mobility
IBM Announces $3 Billion Investment In Future Chip Research
IBM To Help China Deliver on Ambitious Energy and Environmental Goals
China Clears IBM, Lenovo Server Deal
IBM Hopes Nanotube Transistors Are Coming Aroud 2020

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2014 - All rights reserved -
Privacy policy - Contact Us .