Wednesday, October 26, 2016
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Google's Jamboard Reinverts The Whiteboard For Collaboration in the Cloud
ARM Accelerates Secure IoT from Chip to Cloud
Seagate 6th Generation High-Speed Enterprise Performance HDD
Google Pixel XL Manufacturing Cost is in Line with Rival Smartphones
Intel introduces Atom E3900 processors For IoT
HTC Losses Deepen
BlackBerry Announces DTEK60, Latest Android Device With BlackBerry's Security Software
Emporio Armani Launches A Hybrid Smartwatch
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > General Computing > TSMC Jo...
Last 7 Days News : SU MO TU WE TH FR SA All News

Wednesday, May 11, 2011
TSMC Joins SEMATECH to Accelerate Research and Development on 20nm Technologies

TSMC joined SEMATECH as a core member, in an effort to focus on advanced technology development to address some of the industry's most pressing challenges.

TSMC will collaborate with SEMATECH, an international consortium of semiconductor manufacturers, on semiconductor research and development for IC process technologies for 20nm generation and beyond, including extreme ultra-violet (EUV) lithography, 3D interconnects, metrology, novel materials and device structures, and to develop critical infrastructure vital for next-generation manufacturing, including the transition to 450 mm wafer size.

SEMATECH's strong relationships with suppliers, chip makers, universities, and research institutes around the world are a critical element in providing research and development to its members. SEMATECH's other core members include GlobalFoundries, HP, IBM, Intel, Samsung, UMC, and the College of Nanoscale Science and Engineering (CNSE).

SEMATECH manages an international network of collaborative partners, including foundries, IDMs, fabless, packaging and assembly companies, and material and equipment suppliers, to provide solutions to the challenges of chip manufacturing.

Android 3.1 Coming First to Motorola XOOM        All News        Sharp Introduces 3D AQUOS Phone
EU To Offer More Frequencies for Mobile Internet by 2013     General Computing News      Google Puts Aside $500 Million For Advertising Probe

Get RSS feed Easy Print E-Mail this Message

Related News
TSMC, GlobalFoundries/Samsung To Present Their 7nm Platforms At IEDM
TSMC Sees Strong Quarter On Smartphone Chip Demand
TSMC To Use Different Processes And 3D Packages Across Future Design Platforms
TSMC 7nm Volume Production To Start In 1Q18
TSMC Foundry Market Share Drops in 2016
Samsung, TSMC And Intel Set To Expand Their Chip Production Capacities In 2H
TSMC To Follow The Extreme Ultraviolet Approach For 5nm
TSMC 2Q16 Profits Fall, Revenue Grew
TSMC to Boost R&D Spending To Accelerate Development Of More Advanced Chips
ARM And TSMC Validate First Multicore Test Chip Based on 10FinFET Technology
TSMC On Track To Move InFO Packaging Technology to Volume Production
TSMC Forecasts Slow Sales Amid Smartphone Slowdown

Most Popular News
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2016 - All rights reserved -
Privacy policy - Contact Us .