Toshiba, Sony and Sony Semiconductor Kyushu Corporation
(SCK) today announced that they have executed definitive
agreements based on the non-binding memorandum of
understanding signed on December 24, 2010 between Toshiba
and Sony for the transfer from Toshiba to SCK of certain
semiconductor fabrication equipment.
The fabrication equipment to be transferred from Toshiba to
SCK are semiconductor fabrication equipment located at
SCK's Nagasaki Technology Center operated by Nagasaki
Semiconductor Manufacturing Corporation ("NSM"), a joint
venture among Toshiba, Sony and Sony Computer Entertainment
Inc. ("SCEI"). The purchase price for this equipment is 53
billion yen. The closing for this transfer is planned for
April 1, 2011, subject to the receipt of any necessary
government approvals. Following the execution of the
transfer, Toshiba, Sony and SCEI plan to terminate their
NSM joint venture relationship.
By carrying out this transfer, Toshiba aims to pursue an
asset light business model for its system LSI business.
Promoting this measure in the system LSI area where demand
is volatile, and concentrating management resources in its
Oita Operations, will allow Toshiba to enhance its
productivity and cost structure.
Sony said that its goal was to further strengthen its
production capacity for CMOS image sensors, demand for
which is increasing, and expand its CMOS image sensor
business by utilizing the equipment to be transferred to
Sony that is located at SCK's Nagasaki Technology Center.
The purchase price of 53 billion yen is included in the
approximately 100 billion yen CMOS image sensor investment
announced by Sony on December 27, 2010.