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Thursday, January 27, 2011
TSMC To Move in Bigger Wafers


Taiwan Semiconductor Manufacturing Company said on Thursday that it plans to have a trial production line using 18-inch wafers ready by 2013 or 2014, in an effort to drive down chip manufacturing costs.

Full production chips using 18-inch wafers would begin in 2015 or 2016.

Bu using using bigger wafers, chip makes can increase their chip production while they are lowering costs.

Last December, Intel also announced plans to use 18-inch wafers in its new Oregan plant, slated for start-up in 2013.

Moving on 18-inch fabs requires significant investments on new tools the factories.


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