Tuesday, March 28, 2017
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Self-assembly Technique Could Solve Miniaturization Chip Making Issues
Prepare For Battle GeForce GTX Bundle Includes For Honor or Tom Clancy's Ghost Recon Wildlands Games
VIZIO's 2017 D-Series Smart TV Collection Includes 4K Ultra HD Support in Select Models
Facebook Attacks Snapchat With New Camera Features
China Tech Giant Tencent Buys 5 Percent Stake In Tesla
Hyundai Motor To Develop Its Own Automotive Chips
Razer "Paid to Play" Initiative to Reward Fans for Playing Games
Square Goes U.K
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > PC Parts > Samsung...
Last 7 Days News : SU MO TU WE TH FR SA All News

Tuesday, December 07, 2010
Samsung Readies Memory With Advanced Chip Stacking Technology


Samsung Electronics today announced the development of an eight gigabyte (GB) registered dual inline memory module (RDIMM) based on its Green DDR3 DRAM.

The new memory module, which has just been successfully tested by major Samsung customers, delivers high performance, in particular because of its use of a three-dimensional (3D) chip stacking technology referred to as 'through silicon via' (TSV).

"At Samsung, we're well positioned to accommodate early market demand for our state-of-the-art TSV technology as the industry continues to forge forward with even further advances in bonding technology to enable greater performance and operational efficiency," said Dr. Chang-Hyun Kim, senior vice president and Samsung fellow, memory product planning & application engineering at Samsung Electronics. "Our 40nm-class RDIMM being announced today marks the introduction of a more advanced eco-friendly 'Green Memory' product line up utilizing 3D-TSV technology that is expected to enhance the leadership of Samsung and our allies in server and enterprise storage."

An 8GB RDIMM utilizing Samsung's 3D TSV technology saves up to 40 percent of the power consumed by a conventional RDIMM. Also, the TSV technology allows for an improvement in memory chip density that is expected to offset the decrease of memory sockets in next generation server systems. In the face of a 30 percent decrease in memory slots in next-generation servers, the TSV technology will be able to raise the DRAM density by more than 50 percent, making it highly attractive for high-density, high-performance server systems.

Samsung's TSV technology is a key to solving the paradox of driving lower power consumption in servers, while increasing memory capacity and improving performance.

The TSV technology fabricates micron-sized holes through the silicon vertically, with a copper filling. By using the - through silicon via - bonding process instead of conventional wire bonding, signal lines are shortened significantly, enabling the multi-stacked chip to function at levels comparable to a single silicon chip.

Already passing customer performance tests, Samsung is readying its TSV technology for a variety of server applications having stringent performance and power demands.

Samsung plans to apply the higher performance and lower power features of its TSV technology to 30nm-class and finer process nodes.



Previous
Next
New Alliance Debuts With Open Security Standard to Foster Next-Generation Transit Fare Collection        All News        AMD Introduces Faster Six-core and Dual-core Processors
Noctua Intros New AMD Opteron Coolers With G34 Support     PC Parts News      Elpida and Rambus Sign Patent License Agreement

Get RSS feed Easy Print E-Mail this Message

Related News
Samsung To Sell Refurbished Galaxy Note 7s
Samsung Backs Away From Restructuring Plan, Gears Up For Galaxy S8 Release
Samsung Plans To Release New Curved TVs
Samsung Adds 4G LTE Capability to Gear S3 Classic
Samsung and eSilicon Taped Out First 14nm Network Processor
Samsung Display Is Ramping Up Production To OLEDs For Tablets
Qualcomm Forced Samsung To Use Exynos SoCs Only In Galaxy Phones
Samsung Galaxy Tab S3 To Retail For $600
Samsung's S8 to Support Facial Recognition for Payments, 1K Fps Shooter
Samsung On Track For 10nm FinFET Process Technology Production Ramp-up
Samsung SDI Showcases Powerful ESS Products At Energy Storage Europe
Samsung's 2017 Home Entertainment Lineup Available In The U.S.

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2017 - All rights reserved -
Privacy policy - Contact Us .