IBM, Samsung Electronics and GLOBALFOUNDRIES today announced the 2011 Common Platform Technology Forum will be held Tuesday,
January 18, 2011 at the Santa Clara Convention Center in
California?s Silicon Valley.
This free, daylong event will feature the Common Platform's
collaboration to deliver semiconductor manufacturing solutions
that address the challenges of the 32/28nm technology generation
and beyond.
At this year;s event, the companies will reveal the latest
details of the delivery of 32/28nm low-power high-k metal gate
(HKMG) process technology, which is optimized for the next
generation of smart mobile devices. The event also will feature
proven design and manufacturing solutions from the alliance and
its partners, as well as the Common Platform?s technology roadmap
covering 20nm and beyond.
"As we move to 32/28nm and beyond, the challenges facing our
industry are growing exponentially and the need for collaboration
is more critical than ever," said Michael Cadigan, general
manager of IBM Microelectronics, on behalf of the Common Platform
alliance. "By collaborating to align our technology and
manufacturing capabilities, the members of the Common Platform
alliance can provide customers with maximum flexibility in
foundry selection at the leading edge. At this year's event we
will demonstrate our commitment to delivering an industry-leading
32/28nm technology that breaks new ground in performance and
power efficiency, while driving innovation to be ready for the
next generation."
The Common Platform Technology Forum will feature keynotes from
industry leaders and presentations from senior members of the
Common Platform partners? management and technical teams. A key
part of the forum will focus on collaboration for technology
delivery, highlighting the rich and broad ecosystem of design
enablement and implementation partners through a Partner Pavilion
featuring leading EDA, IP, library, mask, back-end and design
services companies.
To register, please visit:
http://www.commonplatform.com/tf2011/02/.