Tuesday, May 31, 2016
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
5-inch ARCHOS 50d Oxygen Retails For EUR 150
Heterogeneous Systems Architecture 1.1 Specification Launched With Multi-Vendor Architecture Support
Micron Debuts 3D NAND 1100 and 2100 SSDs
CyberLink Power DVD, Power Director, To Support VR Content
Hackers Attacked Myspace
Sony Xperia X Series Coming to the United States
Computex: New Dell 10 2-in-1 Laptops Are Starting At $249
Computex: Intel Launches 10-core Core i7 Processor Extreme Edition And Xeon Processor E3-1500v5 Family
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > Consumer Electronics > TSMC to...
Last 7 Days News : SU MO TU WE TH FR SA All News

Friday, October 01, 2010
TSMC to Make Chips For iPhone 5 and iPad 2


Qualcomm Inc. will reportedly contract Taiwan Semiconductor Manufacturing Co. (TSMC) to make the 3G wireless chips that will equip Apple's iPhone5 and iPad2, which will be launched in mid-2011.

The Taiwan-based China Economic News reported today that Apple has designated Qualcomm to supply 3G chips for the upcoming iPhone 5 and iPad 2. Market analysts estimate that Qualcomm will contract TSMC to make the chips, using TSMC's 65-nm process.

Until now, Apple has been using Infineon's wireless chips for all generations of iPhones from first to iPhone 4. The company has reportedly chosen Qualcomm over Infineon as the supplier of its iPhone5 chips after Intel acquired Infineon`s wireless unit.

The report also clais that Apple has left Broadcom Corp. for Qualcomm for base-band chips that its iPad2 will use.

Both TSMC and Qualcomm have not commented on the report


Previous
Next
UEFI To Start Replacing PC BIOS by 2011        All News        Gigabyte To Make Logitech's Google TV Devices, Prepares Booktop Tablets
Toshiba's To Introduce Glasses-free 3D TV In December     Consumer Electronics News      LG Introduces 'SuperSign' Digital Signage Solutions

Get RSS feed Easy Print E-Mail this Message

Related News
Computex: Qualcomm Debuts The Snapdragon Wear 1100 Processor for Wearables
TSMC to Boost R&D Spending To Accelerate Development Of More Advanced Chips
Apple Supplier Talks About All-glass iPhone
ARM And TSMC Validate First Multicore Test Chip Based on 10FinFET Technology
Qualcomm To Make Mobiles Smarter With New Snapdragon Machine Learning SDK
iPhone 7 May Not Be Enough to Boost Apple's Sales
Samsung To Supply EMI-shielded NAND Flash Memory to Apple: report
TSMC On Track To Move InFO Packaging Technology to Volume Production
KGI Analyst Says iPhone 7 To Feature 'All glass' Enclosure Along With An AMOLED Screen
TSMC Forecasts Slow Sales Amid Smartphone Slowdown
Fitch Sees An OLED iPhone Coming Soon
iPhone SE Shares Features And Parts With Three iPhone Generations, Teardown Reveals

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2016 - All rights reserved -
Privacy policy - Contact Us .