Tuesday, October 25, 2016
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Seagate 6th Generation High-Speed Enterprise Performance HDD
Google Pixel XL Manufacturing Cost is in Line with Rival Smartphones
Intel introduces Atom E3900 processors For IoT
HTC Losses Deepen
BlackBerry Announces DTEK60, Latest Android Device With BlackBerry's Security Software
Emporio Armani Launches A Hybrid Smartwatch
Toshiba's Voice Recognition Technology Can Distinguish Multiple Individual Speakers Without Training
Alexa Skill To Lets You Control Your Harmony Hub-based Universal Remotes
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > Consumer Electronics > TSMC to...
Last 7 Days News : SU MO TU WE TH FR SA All News

Friday, October 01, 2010
TSMC to Make Chips For iPhone 5 and iPad 2

Qualcomm Inc. will reportedly contract Taiwan Semiconductor Manufacturing Co. (TSMC) to make the 3G wireless chips that will equip Apple's iPhone5 and iPad2, which will be launched in mid-2011.

The Taiwan-based China Economic News reported today that Apple has designated Qualcomm to supply 3G chips for the upcoming iPhone 5 and iPad 2. Market analysts estimate that Qualcomm will contract TSMC to make the chips, using TSMC's 65-nm process.

Until now, Apple has been using Infineon's wireless chips for all generations of iPhones from first to iPhone 4. The company has reportedly chosen Qualcomm over Infineon as the supplier of its iPhone5 chips after Intel acquired Infineon`s wireless unit.

The report also clais that Apple has left Broadcom Corp. for Qualcomm for base-band chips that its iPad2 will use.

Both TSMC and Qualcomm have not commented on the report

UEFI To Start Replacing PC BIOS by 2011        All News        Gigabyte To Make Logitech's Google TV Devices, Prepares Booktop Tablets
Toshiba's To Introduce Glasses-free 3D TV In December     Consumer Electronics News      LG Introduces 'SuperSign' Digital Signage Solutions

Get RSS feed Easy Print E-Mail this Message

Related News
Portrait Mode Available on iPhone 7 Plus With iOS 10.1
TSMC, GlobalFoundries/Samsung To Present Their 7nm Platforms At IEDM
Qualcomm Said to Be Near A Deal With NXP
Qualcomm Showcases 5G Modem Solution, New Snapdragon 600 and 400-Tier Processors
TSMC Sees Strong Quarter On Smartphone Chip Demand
Samsung Wins Order To Make Qualcomm Snapdragon 830 chips
Qualcomm in Talks to Buy NXP
Qualcomm Snapdragon 600E and 410E For Embedded Applications Now Available Through Arrow Electronics
TSMC To Use Different Processes And 3D Packages Across Future Design Platforms
iPhone 7 Costs Apple $220 To Make
iPhone 7 And iPhone 7 Plus Teardowns Unveil Interesting Internal Parts
T-Mobile Says iPhone 7 Order Rate Breaks Record

Most Popular News
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2016 - All rights reserved -
Privacy policy - Contact Us .