Wednesday, August 27, 2014
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
HTC Reveals Entry-level Desire 510 Powered By a 64-bit Processor
Archos To Showcase Windows And Android Devices At IFA
Larger iPad Coming Next Year
Samsung Starts Mass Production Of First 3D TSV DDR4 Modules
HP Recalls Millions Of Power Cords
New Toshiba 20 Megapixel CMOS Image Sensor Enables 6mm Z-height Camera Modules
Huawei Quits Windows Phone, Goes Completely Android
Europer To Probe Qualcomm: report
Active Discussions
help questions structure DVDR
Made video, won't play back easily
Questions durability monitor LCD
Questions fungus CD/DVD Media, Some expert engineer in optical media can help me?
CD, DVD and Blu-ray burning for Android in development
IBM supercharges Power servers with graphics chips
Werner Vogels: four cloud computing trends for 2014
Video editing software.
 Home > News > Consumer Electronics > TSMC to...
Last 7 Days News : SU MO TU WE TH FR SA All News

Friday, October 01, 2010
TSMC to Make Chips For iPhone 5 and iPad 2


Qualcomm Inc. will reportedly contract Taiwan Semiconductor Manufacturing Co. (TSMC) to make the 3G wireless chips that will equip Apple's iPhone5 and iPad2, which will be launched in mid-2011.

The Taiwan-based China Economic News reported today that Apple has designated Qualcomm to supply 3G chips for the upcoming iPhone 5 and iPad 2. Market analysts estimate that Qualcomm will contract TSMC to make the chips, using TSMC's 65-nm process.

Until now, Apple has been using Infineon's wireless chips for all generations of iPhones from first to iPhone 4. The company has reportedly chosen Qualcomm over Infineon as the supplier of its iPhone5 chips after Intel acquired Infineon`s wireless unit.

The report also clais that Apple has left Broadcom Corp. for Qualcomm for base-band chips that its iPad2 will use.

Both TSMC and Qualcomm have not commented on the report


Previous
Next
UEFI To Start Replacing PC BIOS by 2011        All News        Gigabyte To Make Logitech's Google TV Devices, Prepares Booktop Tablets
Toshiba's To Introduce Glasses-free 3D TV In December     Consumer Electronics News      LG Introduces 'SuperSign' Digital Signage Solutions

Get RSS feed Easy Print E-Mail this Message

Related News
Europer To Probe Qualcomm: report
Bloomberg Says New iPad Already In Production
Qualcomm's Profit Hurt by Dispute Over China Royalties
TSMC Losses Chip Orders From Apple, Qualcomm: reports
Samsung To Manufacture Qualcomm's Mobile Application Processors
TSMC Q2 profit Increased, 20nm Chips Start Shipping
TSMC Reports Strong Q2 Sales
TSMC Aims At 10nm Chip Production By 2016
Qualcomm To Make Snapdragon chips In China
Qualcomm Acquires WiGig Leader Wilocity
Rambus Signs License Agreement with Qualcomm
Qualcomm Introduces Small Cell SoC For Access Points

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2014 - All rights reserved -
Privacy policy - Contact Us .