Samsung announced today that it is mass producing the highest density memory module for laptops and mobile workstations ? an eight gigabyte (GB) small outline dual inline memory module (SoDIMM) or unbuffered dual inline memory module (UDIMM), based on 4-gigabit (Gb), 40 nanometer (nm)-class DDR3.

High-density DDR3 will benefit chip designers, CAD/CAM engineers and other professionals who need to work with large data sets at significantly faster speeds.

Samsung is shipping 1G x64 (8GB) configurations of its new 40nm-class DDR3-based modules. Dell, first to market with the new module, is offering it in the 17 inch Dell Precision M6500 mobile workstation, which features 32GBs of Samsung 40nm-class DDR3, or four 8GB SoDIMMs.

The Dell Precision M6500 features up to an Intel Core i7 Extreme Edition CPU and Nvidia Quadro FX 3800M graphics, and comes with an optional Samsung 256GB solid state drive or 500GB HDD storage, with optional 2nd and 3rd drives and RAID support. Dell also is offering the Samsung 8GB SoDIMM in a 16GB configuration in the 15 inch Dell Precision M4500 mobile workstation.

With the module?s 4Gb 40nm-class chips, demanding users are able to take advantage of the best power-performance ratio of any memory module now available. The 8GB high density module operates at 1333MHz megabits per second (Mbps) while using 1.5 volts of power, providing about a 67 percent savings in power consumption over 1.8V DDR2.

Eight gigabyte DDR3 memory consumes 53 percent less power than two 4GB DDR3 modules, in meeting the growing demand for lower power consumption.

According to market research firm iSuppli, the DRAM market worldwide is expected to grow 51 percent in 2010 and increase 60 percent in 2011 (estimated in 1Gb equivalent units).