Saturday, August 23, 2014
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
German Regulator Will Pursue Complaint Against Publishers
IBM Tries To Strengthen Its Presence In China With Local Vendor Deal
Demand For iPhone 6 Screens Add Perssure To Supply Chain
Intel Highlights Its Wireless Computing Plans
Ouya Parners With Xiaomi On Games
Sony Offers New Smart Tennis Sensor
Microsoft to Announce Windows 9 on September Event: report
Acer Unveils New Chromebox CXI and Chromebook 11
Active Discussions
help questions structure DVDR
Made video, won't play back easily
Questions durability monitor LCD
Questions fungus CD/DVD Media, Some expert engineer in optical media can help me?
CD, DVD and Blu-ray burning for Android in development
IBM supercharges Power servers with graphics chips
Werner Vogels: four cloud computing trends for 2014
Video editing software.
 Home > News > PC Parts > Rambus ...
Last 7 Days News : SU MO TU WE TH FR SA All News

Monday, September 13, 2010
Rambus to Discuss Challenges for Next-Generation Mobile and Graphics Memory at Intel Developer Forum 2010


Rambus on Monday will talk about next-generation memory solutions for mobile and graphics applications at the Intel Developer Forum 2010. In addition, Rambus will exhibit demos of its innovations including its XDR memory product showcase.

During the session, Dr. Judy Chen, strategic development director and Dr. Steve Woo, technical director at Rambus will discuss how next-generation mobile and graphics systems share the need for higher-performance, power-efficient memory. They will outline techniques to help address the challenges of managing signal and power integrity, reducing component and board costs, and delivering multi-modal functionality.

Rambus will demonstrate its latest technology developments in the areas of mobile, gaming and graphics, and computing main memory solutions.

Mobile XDR Memory Architecture

Rambus claims that its XDR memory the fastest and most power-efficient memory for mobile applications. Capable of achieving data rates of 3.2 to 4.3 gigabits per second (Gbps) at a power efficiency of 2.2 milliwatts per gigabit per second (mW/Gbps), Mobile XDR memory is ideal for next-generation smartphones, netbooks, mobile gaming and mobile multimedia products.

DDR3 PHY Development Package

This high-performance, low-cost DDR3 memory controller interface solution is tailored for consumer electronics. The solutions is the first to demonstrate operation in working silicon at a data rate of 1866 megatransfers per second (MT/s) in a low-cost wire bond package.

XDR 2 Memory Architecture

Designed for scalability, power efficiency and manufacturability, the XDR 2 memory architecture is a complete memory solution suited for high-performance gaming, graphics and multi-core computing applications.

DDR3 Module Threading Demonstration

Driven by multi-core computing, virtualization and processor integration trends, the industry needs a next-generation main memory solution capable of achieving data rates of up to 3200MT/s in the same, or lower power envelope as the current DDR3 1600MT/s memory solution. This system demo will show how Module Threading can be used to boost memory throughput at reduced power.


Previous
Next
AMD to Demonstrate AMD Fusion APU Codenamed "Zacate" on Monday        All News        IDF2010 - Intel Demos Real-time Ray Tracing On Laptop
AMD to Demonstrate AMD Fusion APU Codenamed "Zacate" on Monday     PC Parts News      LaCie Introduces the Compact Mobile and Desktop USB 3.0 Hard Drives

Get RSS feed Easy Print E-Mail this Message

Related News
Rambus Signs License Agreement with Qualcomm
Rambus and Nanya Sign Patent License Agreement
Rambus CMOS Sensor Fits In Cameras Without Lens
Rambus Signs Agreement with Samsung
Rambus Settles Patent Disputes With Micron
Rambus Signs Agreement with STMicroelectronics
Rambus and SK Hynix Sign Patent License Agreement
Rambus Pleased With Court Ruling In SK Hynix Case
Rambus Demonstrates the Imerz IPTV Multi-Media Platform, Binary Pixel Technology at MWC
Rambus and LSI Sign Patent License Agreement
Rambus Introduces R+ LPDDR3 Memory Solution
Rambus and Fujitsu Sign Patent License Agreement

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2014 - All rights reserved -
Privacy policy - Contact Us .