Saturday, October 25, 2014
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Google's Pichai to Become Head of Product at Google: report
Internet Explorer 11 Toolkit Allows Enterprise Admins "Spy" On Their Employees
FCC Says Airwave Auction To Delay Until 2016
HP Broadens Moonshot Portfolio With Intel-powered Models
Microsoft To Keep Nokia Brand For Low-end Smartphones
LG Introduces Its First Octa-Core Application Processor
Cloud and Surface 3 Drive Microsoft's Revenue
Micron Urges Investors To Reject TRC Capital's Unsolicited Tender Offer
Active Discussions
Copied dvd's say blank in computer only
How to generate lots of different CDs quickly
Yamaha CRW-F1UX
help questions structure DVDR
Made video, won't play back easily
Questions durability monitor LCD
Questions fungus CD/DVD Media, Some expert engineer in optical media can help me?
CD, DVD and Blu-ray burning for Android in development
 Home > News > Consumer Electronics > Intel, ...
Last 7 Days News : SU MO TU WE TH FR SA All News

Wednesday, May 19, 2010
Intel, Micron Introduce 25-Nanometer NAND


Intel and Micron Technology, Inc. today announced the world's first 25-nanometer (nm) NAND technology, which provides a more cost-effective path for increasing storage capacity in popular consumer gadgets as well as the latest solid-state drives (SSDs).

NAND flash memory stores data and other media contained in consumer electronics products, retaining information even when the power is turned off. The drive toward smaller NAND processes enables the continued development and introduction of new uses for the technology. Not only is the 25nm process the smallest NAND technology, it is also the smallest semiconductor technology in the world.

Manufactured by IM Flash Technologies (IMFT), Intel and Micron?s NAND flash joint venture, the 25nm process produces 8 gigabytes (GB) of storage in a single NAND device, creating a high-capacity storage solution for today?s tiny consumer gadgets. It measures just 167mm2-- small enough to fit through the hole in the middle of a compact disc (CD), yet packs more than 10 times the data capacity of that CD (a standard CD holds 700 megabytes of data).

Intel and Micron have doubled NAND density roughly every 18 months, which leads to smaller, more cost-efficient and higher capacity products. IMFT started production with a 50nm process in 2006, followed by a 34nm process in 2008.

The 25nm, 8GB device is sampling now and is expected to enter mass production in the second quarter of 2010. For consumer electronics manufacturers, the device provides the highest-density in a single 2 bits-per-cell multi-level cell (MLC) die that will fit an industry-standard, thin small-outline package (TSOP). Multiple 8GB devices can be stacked in a package to increase storage capacity. The new 25nm 8GB device reduces chip count by 50 percent compared to previous process generations, allowing for smaller, yet higher density designs and greater cost efficiencies. For example, a 256GB solid-state drive (SSD) can now be enabled with just 32 of these devices (versus 64 previously), a 32GB smartphone needs just four, and a 16GB flash card requires only two.


Previous
Next
2x testing from AudioDev With CATS B210 BD Pro 2x        All News        Google To Acquire Audio-video Tech Company IP Solutions
QSTARZ Releases New GPS Travel Recorder     Consumer Electronics News      Sony Goes Retro With Cassette Tape, CD player and Radio Combo

Get RSS feed Easy Print E-Mail this Message

Related News
Micron Urges Investors To Reject TRC Capital's Unsolicited Tender Offer
Intel To Work With AT&T To Research Software Defined Networking
Intel Meegopad T01 Is A Bay Trail PC On HDMI Stick
The Intel Experience Coming In Best Buy Stores
New Data Protection Tecnology Protects Point-of-sale Data
Intel Reports Record Third-Quarter Revenue
Samsung Starts Mass Production of First 3-bit 3D V-NAND
Micron Launches SDK For Its Automata Processor
Intel Releases Internet of Things Developer Kit
Intel and Mitsubishi Electric Collaborate to Create Factory Automation Systems
Intel To Invest in Semiconductor Business under Tsinghua Unigroup
Latest Intel LTE Chipset Certified on China Mobile

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2014 - All rights reserved -
Privacy policy - Contact Us .