Sunday, May 03, 2015
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Samsung Galaxy S6 Smartphones Have Memory Leak Problems
Cry Engine, Final Fantasy Direct X 12 Demos Impressed BUILD
Telecom Companies Seek Stay of FCC's Internet Regulations
Seagate Combines Cloud Storage Systems, High Performance Computing and Electronic Solutions Groups
Microsoft Releases Windows 10 for IoT Devices
LinkedIn Sees Slow Growth
Mozilla To Deprecate Non-Secure HTTP Sites
AMD Delays CrossFire Freesync Update
Active Discussions
roxio issues with xp pro
How to burn a backup copy of The Frozen Throne
Help make DVDInfoPro better with dvdinfomantis!!!
Copied dvd's say blank in computer only
menu making
Optiarc AD-7260S review
cdrw trouble
burning
 Home > News > Consumer Electronics > New Dis...
Last 7 Days News : SU MO TU WE TH FR SA All News

Monday, May 03, 2010
New Display Driver IC Packaging Solution Enhances Heat Dissipation in High-Performance TV Applications


Samsung today introduced its latest heat dissipation packaging technology solution for display driver ICs (DDIs) in high-end TV applications.

Samsung's new ultra Low Temperature Chip On Film (u-LTCOF) packaging solution enhances heat dissipation in high-performance, high resolution TVs by minimizing the contact thermal resistance between the DDI package and the display panel chassis.

"With high-performance features becoming more and more prevalent in today's consumer electronics, there are limits to solving heat emissions by adjusting just one specific aspect within the product's overall design," said Sa-Yoon Kang, vice president, System LSI package development team, Samsung Electronics. "The new u-LTCOF package is an innovative solution considering both the package technology and the module structure for outstanding heat dissipation. We expect the u-LTCOF solution to be applicable to other semiconductor chips such as D-TV system-on-chips (SoCs) that require high-speed processing of increased data."

First introduced in 2007, Samsung?s Low Temperature Chip On Film (LTCOF) used a thin-film metal tape to spread heat generated from the DDI to provide a 30 percent improvement in heat emission over conventional chip on film (COF) packages. Samsung's new u-LTCOF replaces the thin metal film with viscoelastic silicone that has a high thermal conductivity to enhance heat transfer characteristics by more than 20 percent against the LTCOF package.

Additionally, this new solution can deliver cost competitiveness to display panel manufacturers as the package coated with viscoelastic silicone does not require the addition of thin metal film or thermal pads.

Samsung's new u-LTCOF package is designed for display driver ICs used in 240Hz Full HD and 3D LED TVs as well as 60/120Hz mid to large-sized LCD and PDP TVs to effectively improve the heat dissipation needs of these advanced-featured TVs.

Samsung has finalized reliability tests on the u-LTCOF package and plans to start production of the new package solution for its DDI devices from the fourth quarter of 2010.


Previous
Next
New ATI Stream SDK Brings Enhancements For Developers        All News        ASUS Launches the EeeKeyboard PC
NPD's 2010 Household Penetration Study Finds Device Owners Embracing Entertainment     Consumer Electronics News      TVs, Blu-Ray Players and Portable Media Players Drive Adoption of Wi-Fi in Consumer Electronics

Get RSS feed Easy Print E-Mail this Message

Related News
Samsung Galaxy S6 Smartphones Have Memory Leak Problems
Samsung's Profit Sinks In First Quarter Results
Samsung Expands Level Series of Wireless Smart Audio Products
Samsung Leads The Global SSD Market
Samsung Galaxy Tab A Coming In The U.S.
Samsung Logo Removed From Japanese Smartphones
The Latest On Nvidia's Patent Dispute with Samsung
Samsung Display Buys Quantum Dot Technology From SEC
Samsung Galaxy S6 Edge Pricier to Build, Cheaper to Buy Than The Apple iPhone 6 Plus
Samsung Now Producing First M.2 NVMe PCIe SSD for PCs
Samsung to Make 14nm GPUs For Nvidia
Samsung to Release Proprietary Mobile Application Processor Core

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2015 - All rights reserved -
Privacy policy - Contact Us .