Friday, November 27, 2015
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
LG Display Makes Huge Investment in OLED Panels
Sony To Bring Remote Play Feature To PS4
MINIX NEO U1 Media Hub for Android Coming Next Week
Samsung Joins Audi’s Progressive SemiConductor Program
German ISPs May Block Music-sharing Sites: court
Study Says HTTPS Certificate and SSH Key Reuse Endangers Millions of Devices Worldwide
SK Hynix Rejects Chinese Take-over Offer
New Huawei Mate 8 Smartphone Launched With Kirin 950 Inside
Active Discussions
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
How to burn a backup copy of The Frozen Throne
Help make DVDInfoPro better with dvdinfomantis!!!
Copied dvd's say blank in computer only
menu making
Optiarc AD-7260S review
 Home > News > Consumer Electronics > New Dis...
Last 7 Days News : SU MO TU WE TH FR SA All News

Monday, May 03, 2010
New Display Driver IC Packaging Solution Enhances Heat Dissipation in High-Performance TV Applications

Samsung today introduced its latest heat dissipation packaging technology solution for display driver ICs (DDIs) in high-end TV applications.

Samsung's new ultra Low Temperature Chip On Film (u-LTCOF) packaging solution enhances heat dissipation in high-performance, high resolution TVs by minimizing the contact thermal resistance between the DDI package and the display panel chassis.

"With high-performance features becoming more and more prevalent in today's consumer electronics, there are limits to solving heat emissions by adjusting just one specific aspect within the product's overall design," said Sa-Yoon Kang, vice president, System LSI package development team, Samsung Electronics. "The new u-LTCOF package is an innovative solution considering both the package technology and the module structure for outstanding heat dissipation. We expect the u-LTCOF solution to be applicable to other semiconductor chips such as D-TV system-on-chips (SoCs) that require high-speed processing of increased data."

First introduced in 2007, Samsung?s Low Temperature Chip On Film (LTCOF) used a thin-film metal tape to spread heat generated from the DDI to provide a 30 percent improvement in heat emission over conventional chip on film (COF) packages. Samsung's new u-LTCOF replaces the thin metal film with viscoelastic silicone that has a high thermal conductivity to enhance heat transfer characteristics by more than 20 percent against the LTCOF package.

Additionally, this new solution can deliver cost competitiveness to display panel manufacturers as the package coated with viscoelastic silicone does not require the addition of thin metal film or thermal pads.

Samsung's new u-LTCOF package is designed for display driver ICs used in 240Hz Full HD and 3D LED TVs as well as 60/120Hz mid to large-sized LCD and PDP TVs to effectively improve the heat dissipation needs of these advanced-featured TVs.

Samsung has finalized reliability tests on the u-LTCOF package and plans to start production of the new package solution for its DDI devices from the fourth quarter of 2010.

New ATI Stream SDK Brings Enhancements For Developers        All News        ASUS Launches the EeeKeyboard PC
NPD's 2010 Household Penetration Study Finds Device Owners Embracing Entertainment     Consumer Electronics News      TVs, Blu-Ray Players and Portable Media Players Drive Adoption of Wi-Fi in Consumer Electronics

Get RSS feed Easy Print E-Mail this Message

Related News
Samsung Joins Audi’s Progressive SemiConductor Program
Samsung's New DDR4 with TSV Gives a Boost To Data Centers and Servers
Samsung Pay Adds Eight More Credit and Debit Card Issuers
UK High Court Rules Samsung and Huawei Infringe LTE Patent
Samsung Display Is Seeking OLED Growth Through Apple Deal
Samsung To Release Bio Processor Next Year
Samsung Officially Unveils The Exynos 8 Octa Application Processor
Samsung Prepares For Entry In Auto Technology
Samsung Electronics Takes The Lead in Smartphone Sales Worldwide
Samsung To Use Both Exynos 8890, Snapdragon 820 SoCs In Galaxy S7
Samsung Adds Two New Laptops to ATIV Line
Google Finds Security Holes In New Samsung Galaxy S6 Edge

Most Popular News
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2015 - All rights reserved -
Privacy policy - Contact Us .