Friday, October 24, 2014
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Internet Explorer 11 Toolkit Allows Enterprise Admins "Spy" On Their Employees
FCC Says Airwave Auction To Delay Until 2016
HP Broadens Moonshot Portfolio With Intel-powered Models
Microsoft To Keep Nokia Brand For Low-end Smartphones
LG Introduces Its First Octa-Core Application Processor
Cloud and Surface 3 Drive Microsoft's Revenue
Micron Urges Investors To Reject TRC Capital's Unsolicited Tender Offer
Facebook Returns To Chat Roots With Rooms App
Active Discussions
Copied dvd's say blank in computer only
How to generate lots of different CDs quickly
Yamaha CRW-F1UX
help questions structure DVDR
Made video, won't play back easily
Questions durability monitor LCD
Questions fungus CD/DVD Media, Some expert engineer in optical media can help me?
CD, DVD and Blu-ray burning for Android in development
 Home > News > Consumer Electronics > New Dis...
Last 7 Days News : SU MO TU WE TH FR SA All News

Monday, May 03, 2010
New Display Driver IC Packaging Solution Enhances Heat Dissipation in High-Performance TV Applications


Samsung today introduced its latest heat dissipation packaging technology solution for display driver ICs (DDIs) in high-end TV applications.

Samsung's new ultra Low Temperature Chip On Film (u-LTCOF) packaging solution enhances heat dissipation in high-performance, high resolution TVs by minimizing the contact thermal resistance between the DDI package and the display panel chassis.

"With high-performance features becoming more and more prevalent in today's consumer electronics, there are limits to solving heat emissions by adjusting just one specific aspect within the product's overall design," said Sa-Yoon Kang, vice president, System LSI package development team, Samsung Electronics. "The new u-LTCOF package is an innovative solution considering both the package technology and the module structure for outstanding heat dissipation. We expect the u-LTCOF solution to be applicable to other semiconductor chips such as D-TV system-on-chips (SoCs) that require high-speed processing of increased data."

First introduced in 2007, Samsung?s Low Temperature Chip On Film (LTCOF) used a thin-film metal tape to spread heat generated from the DDI to provide a 30 percent improvement in heat emission over conventional chip on film (COF) packages. Samsung's new u-LTCOF replaces the thin metal film with viscoelastic silicone that has a high thermal conductivity to enhance heat transfer characteristics by more than 20 percent against the LTCOF package.

Additionally, this new solution can deliver cost competitiveness to display panel manufacturers as the package coated with viscoelastic silicone does not require the addition of thin metal film or thermal pads.

Samsung's new u-LTCOF package is designed for display driver ICs used in 240Hz Full HD and 3D LED TVs as well as 60/120Hz mid to large-sized LCD and PDP TVs to effectively improve the heat dissipation needs of these advanced-featured TVs.

Samsung has finalized reliability tests on the u-LTCOF package and plans to start production of the new package solution for its DDI devices from the fourth quarter of 2010.


Previous
Next
New ATI Stream SDK Brings Enhancements For Developers        All News        ASUS Launches the EeeKeyboard PC
NPD's 2010 Household Penetration Study Finds Device Owners Embracing Entertainment     Consumer Electronics News      TVs, Blu-Ray Players and Portable Media Players Drive Adoption of Wi-Fi in Consumer Electronics

Get RSS feed Easy Print E-Mail this Message

Related News
New Samsung Galaxy S5 'Plus' Released With Faster Processor
SK Telecom and Samsung Join Hands to Lead 5G Network Technology
New 64-bit Exynos 7 Octa Processor Supports Iris Recognition
Samsung Claims 5G Speed Record
Facebook And Samsung Executives Discuss Mobile, Content Collaborations
Samsung SDI and LG Chem Showcase Advanced Batteries
Samsung Gevelops 5 Times Faster WiFi technology
Samsung Starts Mass Production of First 3-bit 3D V-NAND
Samsung Galaxy Tab Active Now Available For Pre-order
Samsung Announces Weak Q3 Guidance
Samsung to Build New Chip Plant In South Korea
Microsoft says Samsung owes Millions in unpaid Patent Royalties

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2014 - All rights reserved -
Privacy policy - Contact Us .