Wednesday, August 27, 2014
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Nero 2015 is Coming At IFA
LaCie Ships the 48 TB Thunderbolt 2 Storage Solution
ALCATEL ONETOUCH Launches New Affordable Smartphones
ZOTAC Debuts the ZBOX PI320 pico
Dropbox Now Offers 1TB Pro plan for 10 Dollars
HTC Reveals Entry-level Desire 510 Powered By a 64-bit Processor
Archos To Showcase Windows And Android Devices At IFA
Larger iPad Coming Next Year
Active Discussions
help questions structure DVDR
Made video, won't play back easily
Questions durability monitor LCD
Questions fungus CD/DVD Media, Some expert engineer in optical media can help me?
CD, DVD and Blu-ray burning for Android in development
IBM supercharges Power servers with graphics chips
Werner Vogels: four cloud computing trends for 2014
Video editing software.
 Home > News > PC Parts > TSMC An...
Last 7 Days News : SU MO TU WE TH FR SA All News

Wednesday, April 14, 2010
TSMC Announces Move to 20nm Process


Taiwan Semiconductor Manufacturing Company, Ltd. announced today at its 2010 Technology Symposium that it will skip the 22nm manufacturing process node and move directly to a 20nm technology.

After the 28-nm node, it plans to skip the 22-nm ''full node'' and will move directly to the 20-nm ''half node.''

During his address to nearly 1,500 TSMC customers and third party alliances, Dr. Shang-yi Chiang, TSMC Senior Vice President, Research & Development, said that the move to 20nm creates a superior gate density and chip performance to cost ratio than a 22nm process technology and makes it a more viable platform for advanced technology designers. He also announced that TSMC is expected to enter 20nm risk production in the second half of 2012. TSMC will also not offer an 18-nm process.

The technology will be based on a planar process with enhanced high-K metal gate, novel strained silicon, and low-resistance copper Ultra-Low-K interconnects, TSMC said. Dr. Chiang also indicated that the company has demonstrated record-setting feasibility of other transistor structures such as FinFET and high-mobility devices.

The technical rationale behind the move is based on the capability of patterning technology and layout design methodologies required at these advanced technology nodes.

"We have reached a point in advanced technology development where we need to be actively concerned about the ROI of advanced technology. We also need to broaden our thinking beyond the process technology barriers that are inherent in every new node," Dr. Chiang pointed out. "Collaborative and co-optimized innovation is required to overcome the technological and economic challenges."

Unlike its previous processes in recent times--which focused on low power first--TSMC's initial 20-nm process will be a high-performance technology. Following that process, it will roll out a low-power technology.

With the announcement, TSMC is seeking to gain an edge over its leading-edge rivals, such a GlobalFoundries, Samsung and UMC.Recently, GlobalFoundries Inc. said it is starting work on its 22-nm CMOS process, which is due out in the second half of 2012. Intel is expected to be at the 22-nm node by the fourth quarter of 2011.

TSMC is currently shipping its 40-nm process. The company's next step is to release the first 28 LP (low-power) chips at the end of June this year, Chiang said in a presentation last November.

"The first high-k metal gate we call 28 HP for the high performance application will be introduce the end of September this year, and followed by three months later December will be the 28 HPL. This is the first high-k metal gate introduction for the low power application," he said.


Previous
Next
Intel Plans New Intel Atom Processor-based System-on-Chip        All News        GIGABYTE's Motherboard Offer iPad Recharging Capability
Intel Plans New Intel Atom Processor-based System-on-Chip     PC Parts News      GIGABYTE's Motherboard Offer iPad Recharging Capability

Get RSS feed Easy Print E-Mail this Message

Related News
TSMC Losses Chip Orders From Apple, Qualcomm: reports
TSMC Q2 profit Increased, 20nm Chips Start Shipping
TSMC Reports Strong Q2 Sales
TSMC Aims At 10nm Chip Production By 2016
TSMC Reports Quarterly Profit
TSMC Enjoys Q4 Profit, Getting Ready For More Efficient Chips
Samsung, TSMC, and Micron Top List of IC Capacity Leaders
Apple Works with TSMC for Manufacturing of A8 Chip: report
TSMC Introduces Its 16nm FinFET Technology
Chipmaker TSMC Reports Increased Earnings
Foundries Spending Big on Capital Equipment
TSMC Outlines Path To 16nm While Costs And Complexity Rise

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2014 - All rights reserved -
Privacy policy - Contact Us .