Tuesday, December 01, 2015
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
WD, Samsung Lead The HDD And SSD Markets
4K Copy Protection Probably Cracked
AMD To Correct GPU Fan Control Issues With New Crimson Drivers
Google Outlines The Gifts We're Searching For This Holiday
Microsoft Launches New Office 365 Enterprise Capabilities, Dynamics CRM 2016 and Introduces PowerApps
BlackBerry is Exiting Asian Country Following Government Pressure
TDK To Buy Semiconductor Factory From Renesas Electronics
Swatch Parners With Visa On Pay-by-the wrist Payments
Active Discussions
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
How to burn a backup copy of The Frozen Throne
Help make DVDInfoPro better with dvdinfomantis!!!
Copied dvd's say blank in computer only
menu making
Optiarc AD-7260S review
 Home > News > Mobiles > GLOBALF...
Last 7 Days News : SU MO TU WE TH FR SA All News

Monday, February 15, 2010
GLOBALFOUNDRIES and ARM Showcase Their Mobile Technology Platform at MWC 2010

At the 2010 Mobile World Congress, GLOBALFOUNDRIES and ARM today unveiled new details on their System-on-Chip (SoC) platform technology for powering the next generation of wireless products and applications.

The new chip manufacturing platform is projected to enable a 40 percent increase in computing performance, a 30 percent decrease in power consumption, and a 100 percent increase in standby battery life. The new platform includes collaboration on two GLOBALFOUNDRIES process variants: 28nm super low power (SLP) for mobile and consumer applications and 28nm high performance (HP) for applications requiring maximum performance.

The ARM and GLOBALFOUNDRIES SoC platform is based on the ARM Cortex- A9 processor, optimized ARM physical IP and GLOBALFOUNDRIES' 28nm Gate-First High-K Metal Gate (HKMG) process. Together, ARM and GLOBALFOUNDRIES will enable manufacturers of embedded devices such as smartphones, smartbooks, tablets and more to address increasing design and manufacturing complexities while reducing time to volume production at mature yields. GLOBALFOUNDRIES expects to start production on these next-generation technologies in 2H 2010 at Fab 1 in Dresden, Germany.

GLOBALFOUNDRIES' 28nm process with Gate-First HKMG technology provides significant performance gains over the previous generation 40/45nm technologies. Current estimates show 28nm with HKMG will provide approximately 40 percent higher performance within the same thermal envelope, delivering improved application performance and enriched multi-tasking capabilities on mobile devices.

Also, improvements in power efficiency are necessary with each new technology generation to deliver longer talk/standby time, multimedia playback and interactive gaming and graphics. The combined benefits of ARM IP and GLOBALFOUNDRIES 28nm HKMG process enables up to a 30 percent reduction of power consumption and 100 percent increase in standby battery life compared to 40/45nm.

In addition to the partnership with GLOBALFOUNDRIES, ARM has established strategic relationships with other members of the IBM Joint Development Alliance to enable the development of optimized processor and physical IP tuned to the HKMG process. ARM will be showcasing the first 28nm wafer with HKMG technology at Mobile World Congress demonstrating the advantages of early enablement with their foundry partners to accelerate the migration to advanced node design in next generation SoCs.

Sandisk Introduces 64GB iNand Flash Drives For Mobile Devices        All News        Operators Unite to Challenge Apple's Store
Sandisk Introduces 64GB iNand Flash Drives For Mobile Devices     Mobiles News      Operators Unite to Challenge Apple's Store

Get RSS feed Easy Print E-Mail this Message

Related News
GLOBALFOUNDRIES Launches High-Performance ASIC Offering on 14nm FinFET Process
GlobalFoundries And AMD Achieve 14nm FinFET Technology Success
Globalfoundries Said To Move To 10nm Development On Its Own
GLOBALFOUNDRIES Launches 22nm FD-SOI Technology Platform
GLOBALFOUNDRIES Provides Design Flows For 14nm FinFET Chips
GLOBALFOUNDRIES Releases New Low-Power 28nm Solution for Mobile and IoT Applications
GLOBALFOUNDRIES Joins imec to Develop RF Solutions for Internet of Things Applications
Globalfoundries Invests In MRAM Maker Everspin
Glonbalfoundries Buy IBM's Micorelectronics Business
IBM Talks With Globalfoundries Stall Over Price: report
IBM May Sell Chip-Making Unit to Globalfoundries: report
GLOBALFOUNDRIES Introduces 55nm Automotive-Specific Semiconductor Manufacturing Platform

Most Popular News
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2015 - All rights reserved -
Privacy policy - Contact Us .