Sunday, February 01, 2015
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
South Korea's Antitrust Authority Aims At Google, Apple
Bill Gates Sees Future In Robots
Pirate Bay Back Online
ASUS Announces The B85M-Gamer Mainboard
AT&T, Verizon Among Winners Of US Airwaves Auction
Apple Closes the Gap on Samsung Fourth Quarter's Worldwide Smartphone Shipments
Verizon To Let USers Opt Out Supercookies
Microsoft Outlines Windows 10 Options For The Enterprise
Active Discussions
Why Double Logins ?
retrieving burned cd information
Writing Audio files on DVDs ?
Need major help with Gigabeat
New match-3 puzzle game launch now!
Rimage 2000i
Sound card for my Laptop
hello
 Home > News > General Computing > VIA Int...
Last 7 Days News : SU MO TU WE TH FR SA All News

Tuesday, January 19, 2010
VIA Introduces First Mobile-ITX Module


VIA Technologies today announced the VIA EPIA-T700: the first product based on the recently announced Mobile-ITX form factor.

Measuring a mere 6cm x 6cm, the VIA EPIA-T700 is a compact computer-on-module that is designed for a range of embedded devices in medical, military and in-vehicle applications.

The VIA EPIA-T700 can be used with a variety of carrier boards that can be adapted and customized to meet the needs of a range of applications and is powered by a specially miniaturized 1GHz VIA Eden ULV processor and the compact VIA VX820 MSP that together offer I/O flexibility in the most compact of available form factors. The VIA EPIA-T700 features 512MB of DDR2 on-board system memory.

The VIA VX820 media system processor adds a wealth of key features including the VIA Chrome9 DX9 integrated graphics core, the VIA Chromotion video engine with hardware acceleration of MPEG-2, MPEG-4, WMV9, and VC1 video formats, and VIA Vinyl HD Audio supporting up to eight channels of HD audio.

An integrated multi-configuration transmitter enables display connection to TTL LCD panels and CRT monitors. Added flexibility is provided through carrier board configurations that integrate the DVP interface to include LVDS and DVI support. Other integrated data bus technologies include PCI Express and Ultra DMA.

The VIA EPIA-T700 uses two high density, low profile connectors on the under side of the module that can also withstand vibrations of up to 5Gs making Mobile-ITX systems suitable for in-vehicle and industrial machining applications.



Previous
Next
The Sharp Expansion of Internet Video        All News        Hitachi Releases First Media Converter for 40 Gigabit Ethernet
Samsung and Rambus Reach 900-million-dollar Settlement     General Computing News      Hitachi Releases First Media Converter for 40 Gigabit Ethernet

Get RSS feed Easy Print E-Mail this Message

Related News
VIA Launches ARTiGO A900 Android System For IoT and M2M Deployments
Viacom To Offer Channels To Sony's Online Pay TV Service
VIA Now Offers New Viega Ruggedized Android Tablet
VIA Releases New AMOS-3003 Fanless System
Viacom and Google Resolve Copyright Lawsuit
VIA Sues Asus Group Companies and Executives for Damages in Trade Secrets Misappropriation Suit
VIA Announces New Fanless Quad Core ARM-Based Industrial System
VIA Launches Springboard Platform For Android and Linux Devices
Cablevision Sues Viacom Over High Fees For Little-watched Channels
VIA Launches VIA ARMTiGO A800
VIA Releases Compact VIA ARMOS-800 IPC For Embedded Applications
VIA ARTiGO A1250 Is Possibly The World's Smallest x86 Quad Core System

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2015 - All rights reserved -
Privacy policy - Contact Us .