VIA Technologies today announced the VIA EPIA-T700: the first product based on the recently announced Mobile-ITX form factor.
Measuring a mere 6cm x 6cm, the VIA EPIA-T700 is a compact computer-on-module that is designed for a range of embedded devices in medical, military and in-vehicle applications.
The VIA EPIA-T700 can be used with a variety of carrier boards that can be adapted and customized to meet the needs of a range of applications and is powered by a specially miniaturized 1GHz VIA Eden ULV processor and the compact VIA VX820 MSP that together offer I/O flexibility in the most compact of available form factors. The VIA EPIA-T700 features 512MB of DDR2 on-board system memory.
The VIA VX820 media system processor adds a wealth of key features including the VIA Chrome9 DX9 integrated graphics core, the VIA Chromotion video engine with hardware acceleration of MPEG-2, MPEG-4, WMV9, and VC1 video formats, and VIA Vinyl HD Audio supporting up to eight channels of HD audio.
An integrated multi-configuration transmitter enables display connection to TTL LCD panels and CRT monitors. Added flexibility is provided through carrier board configurations that integrate the DVP interface to include LVDS and DVI support. Other integrated data bus technologies include PCI Express and Ultra DMA.
The VIA EPIA-T700 uses two high density, low profile connectors on the under side of the module that can also withstand vibrations of up to 5Gs making Mobile-ITX systems suitable for in-vehicle and industrial machining applications.