Monday, June 18, 2018
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
HPE Says Astra is The World's largest Arm-based Supercomputer
Garmin fēnix 5 Plus GPS Sportswatch Adds Maps, Music, Garmin Pay and Wrist-based Pulse Ox
Google Uses Deep Learning to Predict When a Patient Will Die
Volvo Penta Unveils Self-docking Yacht Technology
iOS 12 Will Automatically Share Your Location with The Police
Google to Invest $550 Million in China E-Commerce Site JD
Intel to Showcase AI and HPC Demos at ISC
Google Introduces the VR180 Creator to Simplify Video Editing
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > General Computing > Qualcom...
Last 7 Days News : SU MO TU WE TH FR SA All News

Friday, January 08, 2010
Qualcomm and TSMC Collaborating on 28nm Process Technology


Qualcomm today announced that the Company is working closely with foundry partner Taiwan Semiconductor Manufacturing Company on 28 nanometer (nm) process technology.

The advanced process node enables more features to be integrated into smaller chips with a high level of cost efficiency, accelerating the expansion of wireless into new market segments.

Small form factor and low power consumption are important features of Qualcomm?s next generation of system-on-a-chip (SoC) solutions, including the Snapdragon chipset platform. The two companies are capitalizing on their long-term relationship as Qualcomm works on migrating directly from the 45nm to the 28nm node.

"TSMC prides itself on its ability to deliver cutting-edge technology platforms, including the related design ecosystems. Our 28nm platform supports the high-performance, low-power products that deliver next-generation experiences," said Jason Chen, vice president of Worldwide Sales and Marketing. "We are pleased to be working with Qualcomm, a market leader in wireless technology, on bringing these new experiences to reality."

"Qualcomm?s close collaboration with TSMC has always been a key part of our ability to deliver significant advantages to our customers through the industry-leading integration, power efficiency and cost efficiency of our products ? enabling them to do more with less," said Jim Clifford, senior vice president and general manager of Qualcomm CDMA Technologies. "Qualcomm?s integrated fabless manufacturing model and migration to smaller geometries will allow us to continue enabling the best mobile user experience possible on handsets, smartphones and smartbook devices."

Qualcomm and TSMC worked closely on 65nm and 45nm technologies. They are continuing their relationship into low-power, low-leakage 28nm designs for high-volume manufacturing. Qualcomm and TSMC are working on both high-k metal gate (HKMG) 28HP and silicon oxynitride (SiON) 28LP technologies. Qualcomm expects to tape out its first commercial 28nm products in mid-2010.

Close collaboration with strategic technology and foundry partners is a key part of Qualcomm's Integrated Fabless Manufacturing (IFM) business model.


Previous
Next
New NVIDIA Tegra 2 Processor Powers Tablets - GeForce Fermi in Action at CES 2010        All News        Intel Unveils New 2010 Intel Core Processor Family, Wireless Display, First Moorestown Phone
Kodak, Samsung Enter Into Technology Cross License     General Computing News      IEEE Publishes 1901 Draft Standard for Powerline Communications

Get RSS feed Easy Print E-Mail this Message

Related News
Qualcomm-NXP Deal Yet to be Approved by China, Qualcomm Extends Tender Offer
China Approves Qualcomm's $43 Billion NXP Deal: report
Important Hearings to Determine Apple and Qualcomm's Legal Dispute
Qualcomm Announces Snapdragon 850 Platform for Windows 10 PCs
Qualcomm Reveals Dedicated Qualcomm Snapdragon XR1 Extended Reality
Qualcomm Snapdragon 710 Mobile Platform Brings Artificial Intelligence Features to a New Tier of Smartphones
Qualcomm Snapdragon XR1 SoC to be Dedicated to VR and AR Headsets
Next Generation A12 iPhone Chips Are Already in production On TSMC's 7nm Process
Qualcomm Mobile and Networking Chipsets to Integrate WPA3 Wi-Fi Security Standard
Questions Remain on TSMC's 7nm, 5nm Gains
Qualcomm's Quarterly Profit Falls 51.5 Percent
7nm Volume Production to Fuel TSMC's Profits This Year

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2018 - All rights reserved -
Privacy policy - Contact Us .