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Thursday, January 07, 2010
GLOBALFOUNDRIES and Qualcomm to Collaborate on the Development and Pursue a Manufacturing Engagement


GLOBALFOUNDRIES and Qualcomm today announced that they have entered into a non-binding memorandum of understanding to collaborate on leading edge technologies.

Initially, GLOBALFOUNDRIES intends to provide Qualcomm with access to 45nm Low Power (LP) and 28nm (LP) technologies with an intended collaboration on future advanced process nodes.

"As our customers increasingly demand more performance, lower power, functionality and portability in their mobile experiences, the need for a strong manufacturing and technology foundation is more important than ever before," said Jim Clifford, senior vice president and general manager of operations, Qualcomm CDMA Technologies. "With its manufacturing capacity and technology roadmap, GLOBALFOUNDRIES is well positioned to help us enable the next generation of wireless innovation."

Qualcomm?s Integrated Fabless Manufacturing (IFM) model builds tight technical interfaces among all parties in the semiconductor development cycle, delivering greater efficiency, lower costs and quicker time to market for new products. A crucial component of the Qualcomm?s IFM strategy is a multi-foundry approach, which helps assure product supply to Qualcomm?s device manufacturing customers and provides the Company flexibility to meet rapidly changing demands. The IFM model is designed to accelerate Qualcomm?s technology execution and to meet the exponential growth expected in the wireless semiconductor market.

The intended relationship with GLOBALFOUNDRIES will focus on Qualcomm?s wireless businesses and provide technologies for handheld products that operate on the CDMA2000, WCDMA and 4G/LTE cellular standards, including the emerging smartbook device segment.

Both companies anticipate that GLOBALFOUNDRIES will begin accepting Qualcomm designs at Fab 1 in Dresden in 2010.

In addition to advanced technology nodes, the two companies intend to explore other areas to collaborate on such as die-package interaction and 3D packaging technologies.


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