Saturday, December 20, 2014
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
T-Mobile to Pay $90 Million To Settle Case With FCC
New Trojan Targetted Banks Wordlwide
FBI Confirms North Korea Was Behind Sony Hack
Apple Responds To BBC's Allegations Over Working Conditions In Chinese Factory
BlackBerry Returns To Cash Flow
Comparison: Quantum Dot Vs. OLED Displays
Toshiba and SK Hynix Reach Settlement in Lawsuit Ahead Of CES
Google Concerned About MPAA's Actions To Revive SOPA
Active Discussions
Digital Audio Extraction and Plextools
Will there be any trade in scheme for the coming PSP Go?
Hello, Glad to be Aboard!!!
Best optical drive for ripping CD's? My LG 4163B is mediocre.
Hi All!
cdrw trouble
CDR for car Sat Nav
DVD/DL for Optiarc 7191S at 8X
 Home > News > PC Parts > Elpida ...
Last 7 Days News : SU MO TU WE TH FR SA All News

Wednesday, January 06, 2010
Elpida to Set Up R&D Center at Rexchip to Develop 40nm 4F2 Process Technology


Taiwanese DRAM manufacturer Rexchip Electronics and Elpida Memory today jointly announced the establishment of a technology development center at Rexchip during the first quarter of 2010, cooperating on the development of the next generation 40nm 4F2 process technology.

Beginning with front-end technology, Elpida plans to gradually utilize Rexchip as the Taiwan PC DRAM design center. This decision also allows Taiwan to achieve the goal of possessing independent DRAM process technology.

At the same time, Rexchip Electronics also announced plans to migrate to 40nm 6F2 process technology in 2010, mass producing 2Gb DDR3 products. Currently both parties plan for Rexchip's 80,000 12" monthly wafers to be fully converted to 40nm 6F2 process technology by the end of 2010. If the market demand is not as expected, Rexchip will first migrate half of its capacity, with the remainder utilizing 65nm-XS process technology. As a result of Rexchip's 65nm-XS process chip size being equivalent to other DRAM manufacturers' 50nm process, under these conditions, Rexchip is still capable of possessing comparable competitive technology. Furthermore, Elpida's Hiroshima Fab has already completed the pilot run of the 40nm 6F process, where yields have already exceeded expectations, where Elpida initially plans for half of its 130,000 12" wafers per month to be converted and further conversion dependent on market conditions.

As the 40nm 6F2 process technology reduces the chip size, when compared to the current generation of 65nm products, this will effectively reduce relative die costs by 50%. This process is also the most advanced among industry peers, with the smallest die size, producing high performance and low power consumption, mainstream DDR3 products. Elpida also said that the process technology - also depending on certain conditions - will be transferred to its manufacturing partner Powerchip Semiconductor, Winbond, and Promos.


Previous
Next
Seagate Super Speeds Transfer Rates With USB 3.0 External Portable Hard Drive        All News        ASUS at CES 2010
Seagate Super Speeds Transfer Rates With USB 3.0 External Portable Hard Drive     PC Parts News      ASUS at CES 2010

Get RSS feed Easy Print E-Mail this Message

Related News
Intel Labs Showcase Low-energy DRAM Memory
Kingston Leads the DRAM Module Industry: TrendForce
Elpida Memory Becomes Micron Memory Japan
Mobile DRAM to Account for 40 Percent of DRAM Revenue in 2014
DRAM Trends For 2014
DRAM Market Reaches Maturity
Micron Acquires Elpida, Enhances Its DRAM Portfolio
Elpida Acquisition To Close This Month
Big Gains Forecast in Quarterly DRAM Selling Proces
DRAM Market Matures, Says IHS
Micron Closer To Elpida Memory Deal
Tokyo High Court Dismissed Creditor Appeals Against Elpida's Reorganization plan

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2014 - All rights reserved -
Privacy policy - Contact Us .