Friday, April 18, 2014
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
HTC Hired Ex-Samsung Marketing Officer
Xbox One Wolrdwide Sales Cross 5 million
Samsung Works With GLOBALFOUNDRIES On 14 nm FinFET Offering
Facebook To Find Nearby Friends
Console Sales Lift AMD's First Quarter Results
LG Expands 'Second Screen' TV Ecosystem With Open-Source SDK
Amazon Announces Kindle Service For Samsung Devices
Nokia Halts Sales Of Lumia 2520 Tablet
Active Discussions
help questions structure DVDR
Made video, won't play back easily
Questions durability monitor LCD
Questions fungus CD/DVD Media, Some expert engineer in optical media can help me?
CD, DVD and Blu-ray burning for Android in development
IBM supercharges Power servers with graphics chips
Werner Vogels: four cloud computing trends for 2014
Video editing software.
 Home > News > PC Parts > HyperTr...
Last 7 Days News : SU MO TU WE TH FR SA All News

Friday, December 11, 2009
HyperTransport Consortium Extends Signal Transmission Distance by 6x and Releases New Connector Specifications


The HyperTransport Consortium today released two new HyperTransport connector/cable specifications that enable more ways of implementing and interconnecting HyperTransport links in data center and high-performance computing platforms.

The specifications define a portfolio of high-performance, compact and fully standardized connectors and cables capable of carrying HyperTransport links at their full 3.2 GHz clock rate over distances of up to 2 meters with excellent signal integrity, unmatched by traditional printed circuit boards (PCB) technology. The portfolio enables a new breed of board-to-board, system-to-subsystem, system-to-appliance and chassis-to-chassis interconnect solutions for applications such as motherboards, special function subsystems, servers, blade servers and server clusters.

The new specifications standardize a physical layer complement to the High Node Count (HNC) specification released earlier this year by the HyperTransport Consortium. The HNC specification defines extensions to the HyperTransport 3 protocol that answer the industry challenge of addressing the exponentially increasing number of CPU cores and computing nodes in high performance systems.

"We have evolved HyperTransport from the well established role of high performance chip-to-chip interconnect standard, to a full-fledged role of first and only system-wide interconnect standard capable of fulfilling the industry's most demanding commercial and scientific computing requirements," said Mario Cavalli, general manager of the HyperTransport Consortium. "Together, the HNC and Connector specifications enable highly scalable, heterogeneous, fully hardware-virtualized and modularized resource-sharing computing platforms that support global shared memory architectures. These are best suited to deliver the performance, energy efficiency and cost optimization that data center and high performance computing markets need going forward."

The new specifications are the result of collaborative work between the Consortium's Technical Working Group (TWG) and Samtec, Inc., a company specialized in high performance interconnect technology and materials and a member of the HyperTransport Consortium.

The HyperTransport Node Connector Specification defines right angle and vertical mount female cable connectors, as well as a universal male cable connector. The right angle female connector carries 2x independent and stacked 8-bit HyperTransport links in a 30 x 30 x 14.6 mm edge-mount shell for motherboard and add-on cards use. The vertical mount female connector is a 27 x 9 x 8.7 mm small footprint connector that can easily be positioned anywhere on system motherboards or add-on cards and it allows a system's CPU to be directly linked to either in-chassis or external HyperTransport subsystems. Both the right angle and vertical mount female connectors are compatible with the 27 x 25.4 x 6.1 mm universal male cable connector. Either 8-bit link or 16-bit HyperTransport link configurations are supported.

The HyperTransport Mezzanine Connector Specification defines compact, vertical mount male and female connectors measuring 55.7 x 8.3 x 10.6 mm and 56.6 x 5.6 x 5 mm respectively and supporting 2x 8-bit or 1x 16-bit HT link configurations and which can be used for stacked, board-to-board connections without the use of cables. The mezzanine connectors carry a number of user definable pins are ideally suited for in-system, add-on function modularity in the form of multi-processor modules, network interface cards, acceleration modules and any special function modules.

The mechanical structure and the signal, ground and power pins allocation of all standardized HyperTransport connectors have been defined to produce the best escape routing PCB designs.

The HyperTransport Technology Consortium is a membership-based, non-profit organization that licenses, manages and promotes HyperTransport Technology. The HyperTransport Consortium was founded in 2001 by AMD, Broadcom, Cisco, NVIDIA and Sun Microsystems and counts several members worldwide, including AMD, Broadcom, Cisco, Cray, Dell, HP, IBM, NVIDIA and Sun Microsystems.


Previous
Next
Bing Hosts Homepage Photo Contest        All News        VIA Ships DX10.1 Chipset
Asus to Spin-Off 75% Stake in Pegatron for Business Separation and Independent Operation     PC Parts News      VIA Ships DX10.1 Chipset

Get RSS feed Easy Print E-Mail this Message

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2014 - All rights reserved -
Privacy policy - Contact Us .