Sunday, December 11, 2016
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Apple AirPods Will Miss Holiday Season
Japan Display To Receive ¥50 bil. Support From Government
Google Said to Bring Internet To Cubans
Super Mario Run Won't Play Offline
U.S. Confirms Samsung and LG Dumped Washers
Xiaomi Electric Vehicle Launch on Monday, Yeelight LED Ceiling Light Launched
Hon Hai, Sharp To Build Massive LCD TV Plant In China
U.S. To Review Cyber Attacks Beyond 2016 Election
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > PC Parts > Elpida ...
Last 7 Days News : SU MO TU WE TH FR SA All News

Monday, September 28, 2009
Elpida Unveils First 2-Gigabit DDR2 Mobile RAM


Elpida Memory,Japan's leading global supplier of Dynamic Random Access Memory (DRAM), today announced that it had developed the industry's first 2-gigabit DDR2 Mobile RAM.

The new 2-Gigabit Mobile RAM features the highest density for a JEDEC LPDDR2 (DDR2 Mobile RAM) compatible device.

Elpida has leveraged its low voltage and low-power consumption technology to achieve a device that can operate at 1.2V (conventional DDR Mobile RAM requires 1.8V) while achieving a high-speed data transfer rate of 800Mbps (DDR Mobile RAM is 400Mbps). Also, compared with other same-density and same-speed DDR2 products, as little as 1/16th the power consumption is needed when on standby, making it an eco-friendly DRAM.

Because of its high density, low power consumption and high-speed functionality the new device is likely to make a powerful contribution to the development of innovative mobile applications for high-end mobile phones and smart phones and in such areas as the growing market for Netbooks and MID (Mobile Internet Devices).

The new device can be shipped as a bare chip for use in SiP (System in Package), MCP (Multi-chip Package) and other multi-layer packages or it can be packaged for a PoP (Package on Package) configuration to enable space-saving features.

Sample shipments are expected to begin in October, 2009 with the start-up of mass production scheduled for the first half of 2010.

Features

Product procesess: 50nm CMOS
Data width: x16-bit / x32-bit
Per pin data transfer rate: 800Mbps, 667Mbps

Supply voltage : VDD1: 1.8V, VDD2/VDDCA/VDDQ: 1.2V
Operating temperature range (TC): -25 to 85C (standard), -25 to 105C (extended temperature range)

Shipment configuration:
Bare chip (JEDEC compatible)
168-ball PoP-type FBGA (JEDEC compatible)
216-ball PoP-type FBGA (JEDEC compatible)


Previous
Next
Panasonic Develops 50-inch Full HD 3D Plasma Display Panel        All News        ASUS Launches Gaming Notebooks with the Latest Intel Core i7 Processors
ASUS Unveils First TUF Series Motherboard     PC Parts News      ASUS Launches Gaming Notebooks with the Latest Intel Core i7 Processors

Get RSS feed Easy Print E-Mail this Message

Related News
Samsung Dominates The Global Mobile DRAM Market
Samsung Electronics To Mass Produce 15-nm DRAM Next Year
SK Hynix to Promote Its MDS Technology
Key Samsung Technologies That Enabled 10nm-Class DRAM
Samsung To Start Mass-Producing 18nm DRAM
18nm DRAM Coming Next Year
Samsung Maintains Highest DRAM Market Share in Q2
Intel Labs Showcase Low-energy DRAM Memory
Kingston Leads the DRAM Module Industry: TrendForce
Elpida Memory Becomes Micron Memory Japan
Mobile DRAM to Account for 40 Percent of DRAM Revenue in 2014
DRAM Trends For 2014

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2016 - All rights reserved -
Privacy policy - Contact Us .