Friday, February 27, 2015
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Twitter To Offer More User Safety Features
Google to Start Ranking Mobile-friendly Sites Higher
Qualcomm Extends LTE to Unlicensed Spectrum to Enhance Mobile Experiences
Toshiba Develops Multicore SoC For Image-Recognition Applications
Samsung Says Semiconductor Technology Can Easily Scale Down to 5nm
Ericsson Sues Apple Over Patent Infringement
Net Neutrality Rules Passed by The FCC
Apple To Hold Watch Event on March 9
Active Discussions
burning
nvidia 6200 review
Hello
Burning Multimedia in track 0
I'm lazy. Please help.
sanyo e6 camera
need help on some cd burning...
Why Double Logins ?
 Home > News > PC Parts > Rambus ...
Last 7 Days News : SU MO TU WE TH FR SA All News

Thursday, September 17, 2009
Rambus and Kingston Co-Develop Threaded Module Prototype for Multi-Core Computing


Rambus and Kingston Technology today announced a collaborative development of a threaded module prototype using DDR3 DRAM technology.

Initial silicon results show an improvement in data throughput of up to 50 percent, while reducing power consumption by 20 percent compared to conventional modules, according to data provided by both companies.

As demand grows for throughput-intensive computing in notebooks, desktops and servers, the performance requirements on DRAM memory subsystems rises dramatically. As a result, multi-core computing requires more bandwidth and higher rates of random access from DRAM memory.

"As multi-core computing becomes pervasive, DRAM memory subsystems will be severely challenged to deliver the data throughput required," said Craig Hampel, Rambus Fellow. "Our innovative module threading technology employs parallelism to deliver the higher memory bandwidth needed for multi-core systems while reducing overall power consumption."

Threaded memory module technology is implemented utilizing industry-standard DDR3 devices and a conventional module infrastructure. It is capable of providing greater power efficiency for computing systems by partitioning modules into multiple independent channels that share a common command/address port. Threaded modules can support 64-byte memory transfers at full bus utilization, resulting in efficiency gains of up to 50 percent when compared to current DDR3 memory modules. In addition, DRAMs in threaded modules are activated half as often as in conventional modules, resulting in a 20 percent reduction in overall module power.

Rambus will showcase a static demonstration of this prototype at the Intel Developer Forum, September 22 ? 24, 2009 at Moscone West in San Francisco, CA.


Previous
Next
Plextor Introduces Latest Design 24x DVD ReWriter        All News        More Companies Join WiGig Alliance to Advance Next-Generation Wireless Technology
EU Publishes Decision Concerning Intel's Abuse of Dominant Position     PC Parts News      Seagate Introduces FreeAgent DockStar Network Adapter

Get RSS feed Easy Print E-Mail this Message

Related News
Rambus Develops R+ DDR4/3 PHY on Samsung 28nm LPP Process
HyperX Releases Cloud II Gaming Headset, New Mouse Pad
Samsung Starts Mass Production Of ePoP Memory for Smartphones
Kingston Digital Releases FIPS 140-2 Level 3 Encrypted USB Flash Drive
HyperX Sets DDR4 Overclocking Record
HyperX Launches High-Performance PCIe SSD
Kingston Doubling The Capacities Of microSDHC, microSDXC And SDHC/SDXC Cards
Samsung Now Mass Producing 20-Nanometer 6Gb LPDDR3 Mobile DRAM
Kingston HyperX Demos DDR4 Memory at PAX Prime
ADATA Launches XPG V3 DDR3 Memory For Overclockers
Kingston V310 SSD 960GB Released
Kingston Leads the DRAM Module Industry: TrendForce

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2015 - All rights reserved -
Privacy policy - Contact Us .