Monday, February 08, 2016
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Kingston Buys USB Technology and Assets of IronKey from Imation
LG'S Flagship SIGNATURE OLED TV Now Available In The U.S.
Imagination Tech CEO Steps Down As Company Reports Losses
Google Has A Gear VR Competitor In The Works: report
Sony Xperia Z5 and Xperia Z5 Compact Are Now Shipping In The U.S.
Following Outcry, Twitter's Dorsey Says Live Tweets Are Here To Stay
Samsung Files Patent For A Vein-authentication System On A Smartwatch
BlackBerry Cuts 200 Jobs To Trim Costs
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
How to burn a backup copy of The Frozen Throne
Help make DVDInfoPro better with dvdinfomantis!!!
Copied dvd's say blank in computer only
menu making
 Home > News > PC Parts > TSMC to...
Last 7 Days News : SU MO TU WE TH FR SA All News

Tuesday, July 28, 2009
TSMC to Make Intel's Langwell Chipsets


Intel plans to contract foundry giant Taiwan Semiconductor Manufacturing Co. (TSMC) to produce the 'Langwell' chipset using the 65-nanometer process.

The information appeared online today at the Taiwan-based China Economic News Service news agency.

Intel's 'Langwell' chipset is part of the company's "Moorestown" platform scheduled for the 2009-2010. Moorestown comprises of an SOC, codenamed "Lincroft," which integrates the 45nm processor, graphics, memory controller and video encode/decode onto a single chip and an I/O hub codenamed "Langwell", which supports a range of I/O ports to connect with wireless, storage, and display components in addition to incorporating several board level functions.

Intel executive Anand Chandrasekher had showcased the "Moorestown" platform last October at the Intel Developer Forum in Taiwan. He had highlighted the progress Intel was making in the Mobile Internet Devices (MID) market segment with the world's first working "Moorestown" platform demonstration.

Intel and TMSC signed a memorandum of understanding this March for the SoC contract manufacturing.

Intel will also colaborate with LG Electronics around mobile Internet devices (MIDs) based on Intel's "Moorestown," MID hardware platform and the and Linux-based Moblin v2.0 software platform.


Previous
Next
IDT Introduces Next-Generation HQV Video Technology with the Vida Processor        All News        AMD Delivers Its Most Powerful Professional 3D Graphics Card
Toshiba Breaks into the 3.5-Inch External HDD Market     PC Parts News      IDT and Micron Form Alliance to Develop PCI Express Enterprise Solid-State Drive Solutions

Get RSS feed Easy Print E-Mail this Message

Related News
Taiwan Earthquake Temporarily Suspended TSMC's And UMC's Production
New Skylake And Xeon Chips Power Latest Devices
Microsoft releases CNTK Deep Learning Toolkit
Intel, Tsinghua University and Montage Technology Collaborate to Bring Data Center Solutions to China
Intel Releases 6th Generation Intel Core vPro Processors
TSMC Confident That It Will Lead The 10nm Foundry Segment
Intel Reports Full Year Revenue Despite Slow PC Sales
Intel To Patch Freezing Issues Of Skylake Processors Under Certain Workloads
Intel To Release Quad-core NUC For Gamers
Meet the New and Improved Intel Compute Sticks
Intel Brings New Experiences to Life at CES
New Intel Broadwell And Skylake Processors Released

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2016 - All rights reserved -
Privacy policy - Contact Us .