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Tuesday, July 28, 2009
TSMC to Make Intel's Langwell Chipsets


Intel plans to contract foundry giant Taiwan Semiconductor Manufacturing Co. (TSMC) to produce the 'Langwell' chipset using the 65-nanometer process.

The information appeared online today at the Taiwan-based China Economic News Service news agency.

Intel's 'Langwell' chipset is part of the company's "Moorestown" platform scheduled for the 2009-2010. Moorestown comprises of an SOC, codenamed "Lincroft," which integrates the 45nm processor, graphics, memory controller and video encode/decode onto a single chip and an I/O hub codenamed "Langwell", which supports a range of I/O ports to connect with wireless, storage, and display components in addition to incorporating several board level functions.

Intel executive Anand Chandrasekher had showcased the "Moorestown" platform last October at the Intel Developer Forum in Taiwan. He had highlighted the progress Intel was making in the Mobile Internet Devices (MID) market segment with the world's first working "Moorestown" platform demonstration.

Intel and TMSC signed a memorandum of understanding this March for the SoC contract manufacturing.

Intel will also colaborate with LG Electronics around mobile Internet devices (MIDs) based on Intel's "Moorestown," MID hardware platform and the and Linux-based Moblin v2.0 software platform.


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