Wednesday, April 01, 2015
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Sony To Sell Olympus Shares
Tech Industry Enjoys April Fools' Day
Facebook User Tracking Violates EU Law, Research Says
Google Releases Cheaper Chromebooks
Intel Releases New Braswell SoCs
WD's My Passport X Delivers 2 TB of Storage for Xbox One and PC Gamers
Google To Use SSDs From Samsung: report
Microsoft Introduces The Surface 3
Active Discussions
how to copy and move data files to dvd-rw
cdrw trouble
Need serious help!!!!
burning
nvidia 6200 review
Hello
Burning Multimedia in track 0
I'm lazy. Please help.
 Home > News > PC Parts > TSMC to...
Last 7 Days News : SU MO TU WE TH FR SA All News

Tuesday, July 28, 2009
TSMC to Make Intel's Langwell Chipsets


Intel plans to contract foundry giant Taiwan Semiconductor Manufacturing Co. (TSMC) to produce the 'Langwell' chipset using the 65-nanometer process.

The information appeared online today at the Taiwan-based China Economic News Service news agency.

Intel's 'Langwell' chipset is part of the company's "Moorestown" platform scheduled for the 2009-2010. Moorestown comprises of an SOC, codenamed "Lincroft," which integrates the 45nm processor, graphics, memory controller and video encode/decode onto a single chip and an I/O hub codenamed "Langwell", which supports a range of I/O ports to connect with wireless, storage, and display components in addition to incorporating several board level functions.

Intel executive Anand Chandrasekher had showcased the "Moorestown" platform last October at the Intel Developer Forum in Taiwan. He had highlighted the progress Intel was making in the Mobile Internet Devices (MID) market segment with the world's first working "Moorestown" platform demonstration.

Intel and TMSC signed a memorandum of understanding this March for the SoC contract manufacturing.

Intel will also colaborate with LG Electronics around mobile Internet devices (MIDs) based on Intel's "Moorestown," MID hardware platform and the and Linux-based Moblin v2.0 software platform.


Previous
Next
IDT Introduces Next-Generation HQV Video Technology with the Vida Processor        All News        AMD Delivers Its Most Powerful Professional 3D Graphics Card
Toshiba Breaks into the 3.5-Inch External HDD Market     PC Parts News      IDT and Micron Form Alliance to Develop PCI Express Enterprise Solid-State Drive Solutions

Get RSS feed Easy Print E-Mail this Message

Related News
Intel Releases New Braswell SoCs
Intel in Talks to buy Altera: report
Intel Lowers First-quarter Revenue Forecast Amid Slow PC Demand
Intel Introduces New Xeon Processor D-1500 Product Family
Intel Outlines 2015 Gaming News at GDC
MWC: Intel Launches New Mobile SoCs, LTE Solution
Intel Introduces New Brand Levels for the Intel Atom Processor
TSMC Achieves EUV Productivity Milestone
Intel's 'Skylake' Chips Coming This Year
Intel Buys IoT Chip Maker Lantiq
Intel 5th Generation vPro Processors Released
Intel Releases New 20nm SSDs For Data Centers

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2015 - All rights reserved -
Privacy policy - Contact Us .