Monday, November 20, 2017
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Toshiba's Board Approves $5 billion Injection to Stay Listed
LG Electronics Launches the ThinQ Hub AI Speaker
Verizon Signs Deal with NFL: report
Microsoft Offers Discounted Games for Xbox Live Gold Members, Sony Unveils PlayStation Deals
Apple HomePod Smart Speaker Won't Be an Option For Holiday Shopping
G.Skill Unveils Trident Z DDR4-4400 32GB CL19 Kit
Spotify Buys Soundtrap
Volkswagen to Invest Over $40 billion on Future Cars
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > PC Parts > Compute...
Last 7 Days News : SU MO TU WE TH FR SA All News

Friday, June 05, 2009
Computex: Intel Showcases Moorestone and the 32nm Medfield Platforms For Netbooks, Smart Phones


At Computex, Intel outlined progress with Intel?s next-generation "Moorestown" platform and announced that the company is on track to achieve up to 50x platform idle power reduction while reducing the board size by 2x compared to Intel?s first-generation "Menlow" platform.

This is a dramatic improvement over Intel?s previously announced target of achieving >10x power reduction, and is being made possible through a combination of architectural, design and process enhancements, according to Anand Chandrasekher, Intel Corporation senior vice president and general manager, Ultra Mobility Group.

At Computex, Intel also displayed first form factor designs from Aava Mobile, CCI, EB, Inventec and Quanta as indicators of what the "Moorestown" technology platform will make possible. Looking to the future, Chandrasekher pointed to Intel?s continued manufacturing and process leadership with 32nm and highlighted the third-generation platform, codenamed "Medfield," scheduled for introduction in 2011. Medfield will be a single chip, 32nm SoC design. It will continue substantial reductions in size and power, and extend Intel?s product offerings into smart phone segments.

Intel?s next-generation handheld platform, codenamed "Moorestown," is scheduled to launch by 2010. Intel indicated that the platform is hitting all the milestones and demonstrated up to 50x platform idle power reduction while reducing the board size by 2x compared to Intel?s first-generation "Menlow" platform. Moorestown consists of a SoC (codenamed "Lincroft") that integrates a 45nm Intel Atom processor core, 2-D/3-D graphics, video encode/decode, display controller and memory controller. The platform includes an input/output (I/O) hub, codenamed "Langwell," that features a range of interfaces including CE-ATA, MIPI and SPI interfaces, SDIO ports, USB controllers, NAND controller and audio codecs.

Moorestown will be accompanied by a newer Moblin software version, Moblin v2.0, that is based on the Linux operating system. This software is designed specifically to deliver a great PC-like Internet experience while also supporting cellular voice capabilities.

Chandrasekher showcased a number of designs during his keynote, spotlighting what Moorestown is making possible. He highlighted designs from Aava Mobile, CCI, EB, Inventec and Quanta, and demonstrated compelling 3-D UIs, HD video, interactive gaming, rich graphics and 3G voice.

Intel also spotlighted category momentum behind the company?s first-generation Atom-based mobile Internet device platform "Menlow," which to date has garnered more than 70 design wins worldwide. Chandrasekher showcased a range of Atom-based designs and announced Compal?s next-generation design, codenamed "KAX15" and based on the Windows XP OS.

Intel emphasized the inherent advantage it has around the software and Internet compatibility, and discussed the unified software stack it is able to provide across Windows and Linux-based Moblin OS to the software community. Chandrasekher discussed a number of companies which are embracing the Linux-based Moblin OS and developing their middleware and applications for Moorestown-based MIDs.

Sneak Peek into 32nm "Medfield" Platform

Intel?s third-generation platform is codenamed "Medfield" and scheduled for 2011. "Medfield" will be a single chip, 32nm SoC design. It will continue substantial reductions in size and power over previous generations and extend Intel?s product offerings into smart phone segments.


Previous
Next
Apple Announces $99 iPhone and 3GS Model, Trims Mac prices        All News        Enthusiasts Expect New iPhone Announcement on Monday
WD Unveils First 4TB Extrenal Hard Drive     PC Parts News      Computex: Acer Showcases Android Netbook Based on The Atom CPU

Get RSS feed Easy Print E-Mail this Message

Related News
Intel Doubles Capacity of the Optane SSD DC P4800X
AMD's Raja Koduri Joins Intel as Chief Architect for High-End, Discrete Graphics Solutions
New Intel Core Processor Combines High-Performance CPU with Custom Discrete Graphics from AMD
Intel to Add AMD Radeon Graphics to New Laptop Processor
Intel Launches the Blazing-Fast Optane 900P SSD
Intel Raises Full Year Revenue, Profit Forecast
ARM-based Intel Stratix 10 FPGA Launches for 5G, NFV and Data Centers
Intel Capital Announces $60 million of New Investments in Data-Focused Startups
Intel Health Application Platform Helps Health Care Providers Reduce Hospital Readmissions
Globalfoundries and Intel to Talk About 10, 7nm at IEDM
Intel and Mobileye Offer Present Algorithms to Prove the Safety of Autonomous Vehicles
Intel Advances Artificial Intelligence With Nervana Neural Network Processor

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2017 - All rights reserved -
Privacy policy - Contact Us .