Wednesday, May 04, 2016
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Sony Releases New Home Audio Products
HDD Sales Fall, Capacities Rise
Sony's Future Camera Could Be in The Form Of A Contact Lens
HP Refreshes The Pavilion PC Line-up
Intel and Oculus Bring Virtual Reality to Best Buy Stores
NVIDIA And Samsung Agree to Settle IP Litigation
Samsung Develops 3rd Generation 14-Nano FinFET Low-power Process
IE Loses Top Web Browser Spot to Chrome
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > General Computing > Fujitsu...
Last 7 Days News : SU MO TU WE TH FR SA All News

Thursday, April 30, 2009
Fujitsu Microelectronics and TSMC to Collaborate on 40nm and 28nm Process Technologies


Fujitsu Microelectronics Limited and Taiwan Semiconductor Manufacturing Company, Ltd. today announced that they will collaborate on leading-edge process technology production for the manufacturing of Fujitsu Microelectronics? products.

Under an agreement between the companies, Fujitsu Microelectronics will expand its 40-nanometer generation logic IC business with production at TSMC?s fabs.

The collaborative effort will bring together Fujitsu Microelectronics? IC design technologies, imaging and communication intellectual property (IP), and quality technical support to customers, especially in Japan, with TSMC?s foundry-leading process technology and capability. This advanced technology engagement should enable both companies to create new business for themselves and for their prospective customers.

The two companies also announced that they intend to initiate discussions on collaborative development of high-performance process technologies for 28-nanometer and below for Fujitsu Microelectronics? product applications.

"From the aspect of its advanced process technologies and large-scale production capacity, TSMC is the most attractive semiconductor foundry partner", said Haruki Okada, president of Fujitsu Microelectronics Limited. "By continuing to create our advantages in fine-pitch process technologies through this partnership, we can further grow our ASIC and ASSP product businesses."

"Fujitsu Microelectronics is clearly a world-class leader in advanced high-speed and low-power technologies, design engineering, and differentiated IP. Given TSMC's long-standing commitment to Japan's semiconductor market, and our on-going investment and dedication to advanced process technology, our collaboration with Fujitsu Microelectronics represents a new best-in-class solution for many system companies," said Dr. Rick Tsai, president & CEO of TSMC.


Previous
Next
Hitachi GST and Lenovo Sign Agreement        All News        Palm Pre Aims at the iPhone, Costs $170 to make: iSuppli
Hitachi GST and Lenovo Sign Agreement     General Computing News      Windows 7 Professional and Windows XP Mode

Get RSS feed Easy Print E-Mail this Message

Related News
TSMC On Track To Move InFO Packaging Technology to Volume Production
TSMC Forecasts Slow Sales Amid Smartphone Slowdown
TSMC To Build 12-inch Fab In China
ARM and TSMC To Collaborate on 7nm FinFET Process Technology
Samsung Lost iPhone 7 Chip Contract
TSMC Says Recent Earthquake Damaged Wafers
TSMC Wins Exclusive Chip Contract For Next iPhone: report
Chip Makers Differientate In terms Of Equipment Investments
Taiwan Earthquake Temporarily Suspended TSMC's And UMC's Production
TSMC Confident That It Will Lead The 10nm Foundry Segment
TSMC Has Started Woking On 5nm Manufacturing Process
TSMC To Open 12-inch Wafer Fab and Design Service Center in China

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2016 - All rights reserved -
Privacy policy - Contact Us .