Wednesday, March 29, 2017
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
New Intel Xeon Processor E3-1200 v6 Product Family Targets Pros
Google Assistant Is Coming To More Connected Devices
Self-assembly Technique Could Solve Miniaturization Chip Making Issues
Prepare For Battle GeForce GTX Bundle Includes For Honor or Tom Clancy's Ghost Recon Wildlands Games
VIZIO's 2017 D-Series Smart TV Collection Includes 4K Ultra HD Support in Select Models
Facebook Attacks Snapchat With New Camera Features
China Tech Giant Tencent Buys 5 Percent Stake In Tesla
Hyundai Motor To Develop Its Own Automotive Chips
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > PC Parts > Hynix D...
Last 7 Days News : SU MO TU WE TH FR SA All News

Monday, April 27, 2009
Hynix Develops First 54nm High Speed Mobile 1Gb DDR2 DRAM


Hynix Semiconductor, announced that it has developed the first mobile 1Gb DDR2 DRAM using 54nm process technology.

By successfully developing a 50nm-class process, Hynix has overcome the challenge of producing mobile DRAMs with both high speed and low power consumption features.

This device is offered at a maximum speed of 1066MHz, and with 32-bit I/O, boasts bandwidth of 4.26GB/s(Giga byte per second) on a single channel device and 8.52GB/s on a dual channel. Hynix?s 'One Chip Solution' design, offers flexible options with 2-bit or 4-bit prefetch, and 16 or 32-bit I/O on a single chip. Additionally, Hynix?s new mobile DDR2 is an eco-friendly device since it consumes only 50% of power compared to the previous generation mobile DDR, and 30% compared to standard DDR2 DRAM.

The product complies with the JEDEC standards, and is well suited for next generation mobile applications such as MID (Mobile Internet Device), NetBooks and High-end smartphones requiring high bandwidth and extended battery life.

The product is available in JEDEC standard packages and also in custom packages to meet a wide range of user requirements.

Hynix plans to start mass production of this product in the second half of this year.


Previous
Next
Qualcomm to Pay Broadcom $891 Million to Settle Patent Litigation        All News        Windows XP Mode and Windows Virtual PC on Windows 7
New Seagate Replica PC Backup Appliance Makes Data Backup Easier     PC Parts News      Asus Revamps the Eee PC 1000HA with New Chiclet Keyboard

Get RSS feed Easy Print E-Mail this Message

Related News
Toshiba Informs SK hynix of New Plan to Sell Memory Business
SK hynix Bids for Stake in Toshiba's Memory Chip Business
SK Hynix Chalks Operating Profit in 4Q, Outlines Plans For 2017
SK Expands Semiconductor Business By Acquiring LG Siltron
SK Hynix Launches First 8GB LPDDR4X For Mobile Devices
SK Hynix Inc. to Invest $2.7 billion In Cutting Edge NAND Flash Fabs
SK Hynix Develops Its First 10nm DRAM
Seagate, SK Hynix To Team Up On Enterprise SSDs
SK hynix To Start Mass Production Of 48-layer 3D-NAND Chips
Samsung, SK Hynix Announce Fund For Semiconductor-related Companies
SK Hynix Profit Beats Estimates
SK Hynix to Expand Production Of Image Sensors At New 300mm Factories

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2017 - All rights reserved -
Privacy policy - Contact Us .