Monday, February 08, 2016
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Google Has A Gear VR Competitor In The Works: report
Sony Xperia Z5 and Xperia Z5 Compact Are Now Shipping In The U.S.
Following Outcry, Twitter's Dorsey Says Live Tweets Are Here To Stay
Samsung Files Patent For A Vein-authentication System On A Smartwatch
BlackBerry Cuts 200 Jobs To Trim Costs
Taiwan Earthquake Temporarily Suspended TSMC's And UMC's Production
Samsung Loses Memory-Chip patent Trial Against Nvidia
Twitter Suspends Accounts To Combat Extremism
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
How to burn a backup copy of The Frozen Throne
Help make DVDInfoPro better with dvdinfomantis!!!
Copied dvd's say blank in computer only
menu making
 Home > News > PC Parts > Intel T...
Last 7 Days News : SU MO TU WE TH FR SA All News

Wednesday, March 04, 2009
Intel Talks 32nm at CeBIT 09


Intel talked about the migaration in the 32nm lithography this year and demosntrated the upcoming "Clarkdale" and "Arrandale" processors at CeBIT 09.

Intel disclosed details of its 32 nanometer manufacturing technology and announces the first 32nm based notebook and desktop products for the end of 2009.

The company makes the largest-ever investment for a new manufacturing process and spends eight billion US Dollars on its 32nm manufacturing technology. With this investment the company will modernize the production facilities in New Mexico, Arizona and Oregon. Production of the first 32nm chips is planned for the end of 2009. Second generation High-k and Metal Gate transistor technology will be used for computer chips based on this new manufacturing process. Intel utilizes 193nm immersion lithography for the chip?s critical layers as well as an improved transistor strain technique to improve switching capabilities of the transistor. This allows for considerable improvements in performance and energy efficiency for products based on Intel?s new 32nm process technology.

Intel also showcsed working desktop and notebook prototypes based on the upcoming 32nm "Clarkdale" and "Arrandale" processors, which come with integrated graphics. Intel's Christian Morales explained that the 32nm process allows for a specific reduction of the leak current of a transistor by five times, which is actually translated in a 14-22% performance gain compared to the current 45nm process.

Intel also talked about the upcoming next generation Intel Xeon processor, which offers higher data throughput rates, considerably increased performance and highest levels of energy efficiency. The server chip has already won several tenders for High Performance Computing (HPC) environments: at the research centre in Juelich in Germany, the next generation Intel Xeon processors is set for a system with 1080 processing nodes and 8640 computing cores to enable realistic physical effects in running computer simulations in building and running the fusion experiment ITER which will support to have fusion as new source of energy in a long term perspective.

Intel server and workstation solutions will be powered by the "Nehalem EP" quad-core processors, which take advantage of the Hyperthreading technology (8 cores) QPI and support 3 channel DDR3 memory. In addition, Intel plans to release a six-core/12 threads CPU for servers called "Nehalem EX", mainly addressed for large-scale systems with 4 or 8 sockets.

Intel?s chairman, Dr. Craig Barrett, went into more detail about Intel Labs Europe (ILE), the recently announced organisation whose Munich location was formally opened on March 2nd 2009. Intel founded the ILE to drive the dialogue between Intel, the industry and academia and to catalyse and coordinate the company?s European research and development activities.

Intel Labs Europe Intel is currently actively involved in 18 research facilities with around 800 scientists in Europe.


Previous
Next
Hybrid Camera by JVC Shoots Full HD Video and 9-Megapixel Stills        All News        Gigabyte Open Overclocking Championship - GO OC 2009
OCZ Showcases New Products at CeBit 2009 in Germany     PC Parts News      Gigabyte Open Overclocking Championship - GO OC 2009

Get RSS feed Easy Print E-Mail this Message

Related News
New Skylake And Xeon Chips Power Latest Devices
Microsoft releases CNTK Deep Learning Toolkit
Intel, Tsinghua University and Montage Technology Collaborate to Bring Data Center Solutions to China
Intel Releases 6th Generation Intel Core vPro Processors
Intel Reports Full Year Revenue Despite Slow PC Sales
Intel To Patch Freezing Issues Of Skylake Processors Under Certain Workloads
Intel To Release Quad-core NUC For Gamers
Meet the New and Improved Intel Compute Sticks
Intel Brings New Experiences to Life at CES
New Intel Broadwell And Skylake Processors Released
Intel Completes Acquisition of Altera
Facebook to Open-source Artificial Intelligence Server Design

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2016 - All rights reserved -
Privacy policy - Contact Us .