Friday, September 30, 2016
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Amazon Offers $2.5 Million to Advance Conversational Artificial Intelligence
Raspberry Pi Upgraded With A Visual Overhaul Called Pixel
E FUN Nextbook Ares 11 2-in-1 Android Tablet Costs Just $179
Micron Opens Fab 10 Singapore NAND Flash Memory Fabrication Facility
Qualcomm in Talks to Buy NXP
Microsoft Creation New Artificial Intelligence and Research Group
Game of Thrones Enhanced Edition Comes To iBooks
Automakers Showcase Their Electric Vehicles At 2016 Paris Motor Show
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > PC Parts > Intel T...
Last 7 Days News : SU MO TU WE TH FR SA All News

Wednesday, March 04, 2009
Intel Talks 32nm at CeBIT 09


Intel talked about the migaration in the 32nm lithography this year and demosntrated the upcoming "Clarkdale" and "Arrandale" processors at CeBIT 09.

Intel disclosed details of its 32 nanometer manufacturing technology and announces the first 32nm based notebook and desktop products for the end of 2009.

The company makes the largest-ever investment for a new manufacturing process and spends eight billion US Dollars on its 32nm manufacturing technology. With this investment the company will modernize the production facilities in New Mexico, Arizona and Oregon. Production of the first 32nm chips is planned for the end of 2009. Second generation High-k and Metal Gate transistor technology will be used for computer chips based on this new manufacturing process. Intel utilizes 193nm immersion lithography for the chip?s critical layers as well as an improved transistor strain technique to improve switching capabilities of the transistor. This allows for considerable improvements in performance and energy efficiency for products based on Intel?s new 32nm process technology.

Intel also showcsed working desktop and notebook prototypes based on the upcoming 32nm "Clarkdale" and "Arrandale" processors, which come with integrated graphics. Intel's Christian Morales explained that the 32nm process allows for a specific reduction of the leak current of a transistor by five times, which is actually translated in a 14-22% performance gain compared to the current 45nm process.

Intel also talked about the upcoming next generation Intel Xeon processor, which offers higher data throughput rates, considerably increased performance and highest levels of energy efficiency. The server chip has already won several tenders for High Performance Computing (HPC) environments: at the research centre in Juelich in Germany, the next generation Intel Xeon processors is set for a system with 1080 processing nodes and 8640 computing cores to enable realistic physical effects in running computer simulations in building and running the fusion experiment ITER which will support to have fusion as new source of energy in a long term perspective.

Intel server and workstation solutions will be powered by the "Nehalem EP" quad-core processors, which take advantage of the Hyperthreading technology (8 cores) QPI and support 3 channel DDR3 memory. In addition, Intel plans to release a six-core/12 threads CPU for servers called "Nehalem EX", mainly addressed for large-scale systems with 4 or 8 sockets.

Intel?s chairman, Dr. Craig Barrett, went into more detail about Intel Labs Europe (ILE), the recently announced organisation whose Munich location was formally opened on March 2nd 2009. Intel founded the ILE to drive the dialogue between Intel, the industry and academia and to catalyse and coordinate the company?s European research and development activities.

Intel Labs Europe Intel is currently actively involved in 18 research facilities with around 800 scientists in Europe.


Previous
Next
Hybrid Camera by JVC Shoots Full HD Video and 9-Megapixel Stills        All News        Gigabyte Open Overclocking Championship - GO OC 2009
OCZ Showcases New Products at CeBit 2009 in Germany     PC Parts News      Gigabyte Open Overclocking Championship - GO OC 2009

Get RSS feed Easy Print E-Mail this Message

Related News
Microsoft Creation New Artificial Intelligence and Research Group
Amazon, Google, Facebook, Microsoft And IBM Establish Partnership on AI Best Practices
NVIDIA Launches New AI Technology At Third Regional GPU Tech Conference
Samsung Narrows Gap With Intel In Semiconductor Industry Ranking
Intel Raises Third-Quarter Revenue Expectations
TPG to Buy Intel's McAfee Security Unit
Intel to Buy Movidius To Accelerate Computer Vision Through RealSense
Intel 7th Generation Kaby Lake Processors Released
Intel Introduces New 3D NAND SSDs
Intel to Accelerate Altera, Autonomous Driving
Nvidia Says Intel Is Misleading With Outdated Deep Learning Benchmarks
Intel Says USB-C Audio Could Kill Traditional Headphone Jacks

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2016 - All rights reserved -
Privacy policy - Contact Us .