Thursday, March 26, 2015
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Micron and Intel Unveil New 3D NAND Flash Memory
Amazon Cloud Drive Now Offers Unlimited Storage
Twitter Launches Periscope Live Video Streaming App
3DMark Adds API Overhead Feature-set
New HTC One M9 Goes On Sale Today
Apple Rumored To Release New iPhones Later This Year
DVDFab Loses Legal Battle Against AACS LA
Toshiba, Sandisk, Develop First 48-layer 3D NAND For SSDs
Active Discussions
how to copy and move data files to dvd-rw
cdrw trouble
Need serious help!!!!
burning
nvidia 6200 review
Hello
Burning Multimedia in track 0
I'm lazy. Please help.
 Home > News > PC Parts > Samsung...
Last 7 Days News : SU MO TU WE TH FR SA All News

Thursday, January 29, 2009
Samsung Develops World's Highest Density DRAM Chip


Samsung announced today that it has made a significant advancement in the push for higher volume memory chips by developing the world's first four gigabit (Gb) DDR3 DRAM chip, using 50 nanometer (nm) process technology.

With more and more data centers seeking a reduction in the number of servers they use, the development of low-power 4Gb DDR3 has become critical in reducing data center costs, improving server time management and increasing overall efficiency.

For the new generation of "green" servers, the 4Gb DDR3's high density combined with its lower level of power consumption will not only provide a reduction in electricity bills, but also a cutback in installment fees, maintenance fees and repair fees involving power suppliers and heat-emitting equipment.

"We have leveraged our strength in innovation to develop the first 4Gb DDR3, in leading the industry to higher DRAM densities," said Kevin Lee, vice president, technical marketing, Samsung Semiconductor, Inc. "By designing our 4Gb DDR3 using state-of-the-art 50-nm class technology, we are setting the stage for what ultimately will result in significant cost-savings, for servers and for the overall computing market," he added.

The 4Gb DDR3 can be produced in 16 gigabyte (GB) registered dual in-line memory modules (RDIMM) for servers, as well as 8GB unbuffered DIMM (UDIMM) for workstations and desktop PCs, and 8GB small outline DIMM (SODIMM) for laptops. By applying dual-die package technology, this new device can deliver modules of up to 32GB -- offering twice as much capacity as memory modules based on the previous highest chip density of 2Gb.

Designed to be low-powered, the 4Gb DDR3 DRAM operates at 1.35 volts (V), therein improving its throughput by 20 percent over a 1.5V DDR3. Its maximum speed is 1.6 gigabits per second (Gbps).

In 16GB module configurations, 4Gb DDR3 can consume 40 percent less power than 2Gb DDR3 because of its higher density and because it uses only half the DRAM (32 vs. 64 chips).

As forecasts have the amount of memory per server doubling every two years, the development of high-density DRAM is expected to keep pace, expanding to other applications such as notebooks and desktop PCs.

According to the International Data Corporation (IDC), a market research and analysis firm, the worldwide DDR3 DRAM market will account for 29 percent of the total DRAM market in 2009 and 75 percent in 2011. In addition, IDC estimates that 2Gb-or-higher DDR3 DRAM will make up three percent of the total DRAM market in 2009 and 33 percent in 2011 (units in bits).


Previous
Next
NEC Eye Flavor Offers Targeted Advertising Through Face Recognition Techniques        All News        Google Tools Check Your ISP For Speed, Exposes ISP Traffic Shaping
Higher-capacity, 34nm SSDs to Appear in Sept 2009     PC Parts News      Hard Drive Makers Develop Opal Encryption Standard For Computer Drives

Get RSS feed Easy Print E-Mail this Message

Related News
Samsung Listed In Nvidia's Chip Providers
Samsung to Bring Microsoft Services on More Devices
Samsung Expands Its Lineup of Curved Monitors
Samsung Demonstrates Enterprise Platforms at CeBIT 2015
Samsung Strengthens Its SSD Business With New Apple Macbook Deal
Samsung Expands Digital Display Portfolio with YESCO Electronics Acquisition
Samsung Lost Top Position to Apple in Q4's Global Smartphone Market
Samsung Releases New Image Sensor and NFC IC For Mobile Devices
Crafted from Metal and Glass, Samsung Galaxy S6 and Galaxy S6 Edge Are Here
Samsung Says Semiconductor Technology Can Easily Scale Down to 5nm
Samsung To Showcase IoT, Network Functions Virtualization and 5G Technologies at MWC 2015
Samsung Introduces First 128-Gigabyte Universal Flash Storage for Smartphones

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2015 - All rights reserved -
Privacy policy - Contact Us .