Saturday, December 20, 2014
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
T-Mobile to Pay $90 Million To Settle Case With FCC
New Trojan Targetted Banks Wordlwide
FBI Confirms North Korea Was Behind Sony Hack
Apple Responds To BBC's Allegations Over Working Conditions In Chinese Factory
BlackBerry Returns To Cash Flow
Comparison: Quantum Dot Vs. OLED Displays
Toshiba and SK Hynix Reach Settlement in Lawsuit Ahead Of CES
Google Concerned About MPAA's Actions To Revive SOPA
Active Discussions
Digital Audio Extraction and Plextools
Will there be any trade in scheme for the coming PSP Go?
Hello, Glad to be Aboard!!!
Best optical drive for ripping CD's? My LG 4163B is mediocre.
Hi All!
cdrw trouble
CDR for car Sat Nav
DVD/DL for Optiarc 7191S at 8X
 Home > News > General Computing > ARM, Ch...
Last 7 Days News : SU MO TU WE TH FR SA All News

Tuesday, September 30, 2008
ARM, Chartered, IBM and Samsung Collaborate to Enable 32nm and 28nm Systems-on-Chip


IBM, Chartered Semiconductor Manufacturing Ltd. Samsung Electronics, Co., Ltd., and ARM will develop a 32 nanometer (nm) and 28nm Systems-on-a-Chip (SoCs) design platform based on high-k metal-gate (HKMG) technology from the IBM-led joint-development alliance.

Under this multi-year collaboration, ARM will develop and license a design platform of physical intellectual property (IP) including logic, memory and interface products for the Common Platform technology alliance of IBM, Chartered and Samsung for distribution to their customers.

ARM also announced its intent to develop customized physical IP targeted at achieving optimal power, performance, and area for their current and future Cortex processor family leveraging the attributes of the Common Platform HKMG 32nm/28nm technology. The HKMG technology breaks down the historical barrier of scaling, allowing significant power and performance advantage by utilizing new material science innovations. This technology targets a broad range of embedded segments, including mobile, portable and consumer electronics.

"Through this early engagement, we are creating the foundation for designing power efficient ARM SoCs for customers of the Common Platform," said Warren East, CEO, ARM . "By utilizing the strength of our advanced microprocessors, our leadership in Physical IP design and advanced technology supported by the Common Platform, customers can accelerate the release of products for electronic devices that service a broad range of consumer applications."

The Common Platform partners expect to continue to expand the eco-system in this collaborative initiative to include more members in the near future.


Previous
Next
Sandisk Offers 16GB MicroSDHC and M2 Memory Cards For Mobiles        All News        Super Talent Offers 128GB SSD for Under $300
Technology and Creative Communities Unite to Fight Piracy     General Computing News      Microsoft Unveils Next Version of Visual Studio and .NET Framework

Get RSS feed Easy Print E-Mail this Message

Related News
Intel, IBM Follow Different Strategies On 14nm FinFET
Apple and IBM Bring Big Data Analytics and Security Capabilities on iPhone And iPad
Mobile Shopping Dominated During Thanksgiving And Black Friday
IBM Patents Cloud Privacy Engine
IBM Introduces Verse Business E-mail With Social Media Integration
Lufthansa Signs $1.25 billion Deal with IBM
Twitter and IBM Form Partner to Data Analytics
Glonbalfoundries Buy IBM's Micorelectronics Business
New IBM Tape Cartridge Holds 10TB Uncompressed Data
IBM and SAP Partner On Enterprise Cloud
IBM Claims New OpenPOWER-Based Systems Are Superior Alternative to x86-Based Servers
Lenovo Set to Close Acquisition of IBM's x86 Server Business

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2014 - All rights reserved -
Privacy policy - Contact Us .