Wednesday, June 01, 2016
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
5-inch ARCHOS 50d Oxygen Retails For EUR 150
Heterogeneous Systems Architecture 1.1 Specification Launched With Multi-Vendor Architecture Support
Micron Debuts 3D NAND 1100 and 2100 SSDs
CyberLink Power DVD, Power Director, To Support VR Content
Hackers Attacked Myspace
Sony Xperia X Series Coming to the United States
Computex: New Dell 10 2-in-1 Laptops Are Starting At $249
Computex: Intel Launches 10-core Core i7 Processor Extreme Edition And Xeon Processor E3-1500v5 Family
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > General Computing > ARM, Ch...
Last 7 Days News : SU MO TU WE TH FR SA All News

Tuesday, September 30, 2008
ARM, Chartered, IBM and Samsung Collaborate to Enable 32nm and 28nm Systems-on-Chip


IBM, Chartered Semiconductor Manufacturing Ltd. Samsung Electronics, Co., Ltd., and ARM will develop a 32 nanometer (nm) and 28nm Systems-on-a-Chip (SoCs) design platform based on high-k metal-gate (HKMG) technology from the IBM-led joint-development alliance.

Under this multi-year collaboration, ARM will develop and license a design platform of physical intellectual property (IP) including logic, memory and interface products for the Common Platform technology alliance of IBM, Chartered and Samsung for distribution to their customers.

ARM also announced its intent to develop customized physical IP targeted at achieving optimal power, performance, and area for their current and future Cortex processor family leveraging the attributes of the Common Platform HKMG 32nm/28nm technology. The HKMG technology breaks down the historical barrier of scaling, allowing significant power and performance advantage by utilizing new material science innovations. This technology targets a broad range of embedded segments, including mobile, portable and consumer electronics.

"Through this early engagement, we are creating the foundation for designing power efficient ARM SoCs for customers of the Common Platform," said Warren East, CEO, ARM . "By utilizing the strength of our advanced microprocessors, our leadership in Physical IP design and advanced technology supported by the Common Platform, customers can accelerate the release of products for electronic devices that service a broad range of consumer applications."

The Common Platform partners expect to continue to expand the eco-system in this collaborative initiative to include more members in the near future.


Previous
Next
Sandisk Offers 16GB MicroSDHC and M2 Memory Cards For Mobiles        All News        Super Talent Offers 128GB SSD for Under $300
Technology and Creative Communities Unite to Fight Piracy     General Computing News      Microsoft Unveils Next Version of Visual Studio and .NET Framework

Get RSS feed Easy Print E-Mail this Message

Related News
IBM Watson Will Be Trained To Tackle Cybercrime
IBM and SK Holdings C&C Alliance Brings Watson To South Korea
IBM Makes Quantum Computing Available on IBM Cloud
OpenPOWER Foundation Reveals New Servers
IBM, VMWare, To Accelerate Enterprise Hybrid Cloud Adoption
IBM To Buy Truven Health Analytics for $2.6 Billion
Western Digital Buys Storage And Memory Patents From IBM
IBM Forecasts Weak Earnings For 2016
IBM Remains First In Patents, Study Finds
IBM Opens Watson IoT Global Headquarters In Germany
IBM’s Watson Forecasts Products for Holiday Season
IBM, Xilinx target Intel With Chip Collaboration

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2016 - All rights reserved -
Privacy policy - Contact Us .