Thursday, April 17, 2014
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Amazon Announces Kindle Service For Samsung Devices
Nokia Halts Sales Of Lumia 2520 Tablet
TSMC Reports Quarterly Profit
Toshiba Debuts World's Fastest microSD Memory Cards
PlayStation 4 Sales Surpass 7.0 Million Units
Google Reports Lower Than Expected First Quarter revenue
AMD Demonstrates Next-Gen x86 APU Running Fedora Linux
Lenovo Introduces A to Z and FLEX 2 series Of Laptops and Desktops
Active Discussions
help questions structure DVDR
Made video, won't play back easily
Questions durability monitor LCD
Questions fungus CD/DVD Media, Some expert engineer in optical media can help me?
CD, DVD and Blu-ray burning for Android in development
IBM supercharges Power servers with graphics chips
Werner Vogels: four cloud computing trends for 2014
Video editing software.
 Home > News > PC Parts > IBM Coo...
Last 7 Days News : SU MO TU WE TH FR SA All News

Thursday, June 05, 2008
IBM Cools Chips By Streaming Water Inside


IBM researchers believe that sloshing water through hair-thin pipes inside chips will solve heat problems facing next-generation computers.

As chips get smaller and smaller, cramming more processing power into ever-tinier spaces, the heat thrown off by the miniature circuits becomes harder to manage. Cooling measures used now to avoid chip meltdowns, including "heat sinks" made from heat-absorbing materials, might not work on tinier scales.

In a future microprocessor design IBM is exploring called 3-D Chips, chips are stacked vertically to save space and enhance performance, rather than arrayed next to each other. In this design, the heat-to-volume ratio exceeds that of a nuclear reactor.

To address that, IBM researchers say they could pipe water in between chips that are sandwiched together. The system uses pipes that are just 50 microns wide - 50 millionths of a meter. The tiny tubes are sealed to prevent leaks and electrical shorts.

Even these micro amounts of water can handle prodigious cooling chores, because water is much more efficient than air at absorbing heat. That is why some high-end computers long have used water cooling. The new trick here is that IBM expects to do it at the miniature scale, inside chips.

"As we package chips on top of each other to significantly speed a processor?s capability to process data, we have found that conventional coolers attached to the back of a chip don?t scale. In order to exploit the potential of high-performance 3-D chip stacking, we need interlayer cooling," explains Thomas Brunschwiler, project leader at IBM?s Zurich Research Laboratory. "Until now, nobody has demonstrated viable solutions to this problem."

Using the superior thermophysical qualities of water, scientists were able to demonstrate a cooling performance of up to 180 W/cm2 per layer for a stack with a typical footprint of 4 cm2.

"This truly constitutes a breakthrough. With classic backside cooling, the stacking of two or more high-power density logic layers would be impossible," said Bruno Michel, manager of the chip cooling research efforts at the IBM Zurich Lab.

However, IBM's tiny pipes aren't out of the lab yet. They're at least five years from becoming available. In further research, IBM is working to optimize cooling systems for even smaller chip dimensions and more interconnects. They are also investigating additional sophisticated structures for hotspot cooling.


Previous
Next
AMD Offers External Graphics Solution for Notebooks        All News        Asus Xonar HDAV1.3: First Graphics/Sound Combo Board With HDMI
AMD Offers External Graphics Solution for Notebooks     PC Parts News      Asus Xonar HDAV1.3: First Graphics/Sound Combo Board With HDMI

Get RSS feed Easy Print E-Mail this Message

Related News
Globalfoundries To Buy IBM chip-making Business: report
IBM To Help Organizations Tackle Fraud
IBM Watson To Help Fight Cancer
IBM Says It Has Not Provided Any User Data To Government
Lenovo Says China Strike Remains An IBM Matter
MWC: IBM Wants Mobile Apps on Watson
AT&T And IBM Join Forces On The Internet of Things
Scientists Set New Speed Record for Big Data
Samsung Joins IBM In OpenPower Alliance
IBM Considers Selling Its Semiconductor Business: reports
IBM Brings Watson to Africa
Lenovo Buys IBM's x86 Server Business

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2014 - All rights reserved -
Privacy policy - Contact Us .