VIA Technologies released the VIA EPIA PX5000EG Pico-ITX board that features the extremely power efficient 500MHz VIA Eden ULV processor, offering embedded developers an compact, highly integrated board.
The VIA EPIA PX5000EG adds the incredible heat and power efficiency of the 500MHz VIA Eden ULV processor with its maximum power draw of just one watt. The system can be embedded in automation and industrial control devices.
"The VIA EPIA Pico-ITX form-factor continues to evolve, addressing the embedded industry's needs for greater efficiency and miniaturization," said Daniel Wu, Vice President, VIA Embedded Platform Division, VIA Technologies, Inc.
Developed exclusively by VIA, the Pico-ITX form factor squeezes a full feature set into a mere 10cm x 7.2cm. The VIA EPIA PX5000EG includes both LVDS/DVI and VGA support, integrated 5.1 channel audio, 100/10 Ethernet, both IDE and S-ATA drive support and up to six USB ports and a COM port. It supports up to 1GB of DDR2 system memory. The VIA VX700 system media processor adds VIA UniChrome Pro II IGP 3D/2D graphics with MPEG-2/-4 and WMV9 hardware decoding acceleration and pin support for LVDS, DVI and VGA display configurations.
To demonstrate the system's power and thermal efficiency, VIA welcomes you to take part in the 'Naked Pico Challenge' where we will push the VIA EPIA PX5000EG Pico-ITX board to its absolute limits by running a system under full load without any cooling whatsoever. Simply correctly guess how long this tiny board can take the strain and win a VIA ARTiGO Pico-ITX Builder Kit. For more details visit:
http://www.viaarena.com/default.aspx?PageID=425
The VIA EPIA PX5000EG Pico-ITX boards are available now for developers.
Plans for Faster and Dual-core CPUs
In related news, VIA's first Isaiah-based processor will feature a core frequency of 2GHz, a V4 Bus speed from 800-1333MHz, and two 64KB L1 cache and 1MB L2 cache pairs with 16-way associatively, according to industry sources. The CPU will be pin compatible with the company's C7 processors, and it will be manufactured using a 65nm process.
VIA also plans to adopt a 45nm process for the manufacture of its processors in 2009 and expects to launch dual-core CPU by the 2H of the same year.