Friday, August 29, 2014
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
UMC To Partner With Fujitsu On Chip Production
Samsung, LG Introduce New Smartwatches
Sharp, Pioneer Dissolve Their Capital Alliance
Nero 2015 is Coming At IFA
LaCie Ships the 48 TB Thunderbolt 2 Storage Solution
ALCATEL ONETOUCH Launches New Affordable Smartphones
ZOTAC Debuts the ZBOX PI320 pico
Dropbox Now Offers 1TB Pro plan for 10 Dollars
Active Discussions
help questions structure DVDR
Made video, won't play back easily
Questions durability monitor LCD
Questions fungus CD/DVD Media, Some expert engineer in optical media can help me?
CD, DVD and Blu-ray burning for Android in development
IBM supercharges Power servers with graphics chips
Werner Vogels: four cloud computing trends for 2014
Video editing software.
 Home > News > General Computing > New Ult...
Last 7 Days News : SU MO TU WE TH FR SA All News

Wednesday, September 26, 2007
New Ultra-Thin Flexible RFID Tag Developed


Semiconductor Energy Laboratory and TDK have developed technology for an RFID tag integrated circuit mounted on a flexible substrate.

This technology employs high-performance thin-film transistor technology to integrate an RFID integrated circuit with a flexible substrate.

RFID is a technology that uses radio waves to send and receive data without contact. RFID is expected to produce significant results in areas such as streamlining and speeding up manufacturing processes.



There are various problems with LSI chips manufactured from conventional silicon wafers including an inability to withstand physical stress such as bending as well as the thickness of LSI chips. SEL and TDK have operated the world?s first RFID integrated circuit for the UHF band formed on a flexible substrate. They have also developed an RFID integrated circuit that operates at 13.56 MHz. The new technology produces an extremely thin, flexible substrate that can be formed as thin inlets (RFID integrated circuit with an antenna) just 30 ?m thick.

The new technology can create inlets that are so thin the unevenness cannot be felt even when they are embedded in thin, high-quality paper that is 100 ?m thick. By incorporating RFID functions into a flexible substrate, products are highly resistant to bending.

The new RFID will be on display at the CEATEC JAPAN 2007 exhibition to be held at Makuhari Messe from October 2 to 6.


Previous
Next
JVC Announces HD Projector With a 30,000:1 Native Contrast Ratio        All News        Toshiba Announces High-Definition Laptops
Microsoft Revamps Windows Live Search     General Computing News      Amazon Launches DRM-Free MP3 Music Download Store

Get RSS feed Easy Print E-Mail this Message

Related News
TDK Life on Record Launches New TREK Max Wireless Speaker
TDK Launches SNG4A M.2 Industrial SSDs
TDK Acquires HDD-related Products Businesses
TDK Launches SHG4A Series of SATA 3 Half Slim Type SSDs
TDK Showcases Ultra-thin Transparent Conductive Film For Touch Panels
TDK Life on Record Launches New Trek Wireless Outdoor Speaker
TDK Exits The Data Tape Business
TDK Launches SDG4A Series of Solid State Drives
TDK To Withdraw From The Blu-ray Disc Business
TDK Starting LTO Ultrium 6 Data Cartridge Production
New TDK Multilayer Ceramic Chip Capacitors Enable High-density Mounting
TDK Wireless Speakers Now Available

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2014 - All rights reserved -
Privacy policy - Contact Us .