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Tuesday, August 14, 2007
OCZ Introduces High-Speed Flex XLC DDR3 Modules


The newest PC3-12800 modules feature OCZ's Flex XLC (Xtreme Liquid Convention) heatsink that delivers superior heat dissipation via a hybrid copper and aluminum design alterable between passive air or water cooling.

This unique "flexible" design gives enthusiasts the option to run the modules passively or water cooled via the integrated liquid injection system. The concurrent use of both technologies (water-cooling) promotes maximum heat dissipation, allowing the memory to operate at extreme speeds without the high temperatures that inhibit or damage the module's ICs.

The PC3-12800 modules run at a blazing 1600MHz and feature 6-6-6-18 timings to maximize the performance potential of the latest Intel-based motherboards and will be available in 2GB (2x1024MB) dual channel kits.


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