Friday, July 21, 2017
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Lyft Forms Autonomous Vehicle Unit
More Than Half German Companies Hit by Sabotage, Spying, BSI says
Intel, Microsoft and Amazon Side with Apple in Qualcomm's iPhone Ban Dispute
Samsung Galaxy Note 8 to debut on Aug. 23
Apple Turns to LG Chem for iPhone 9 Batteries
Microsoft Reports Strong Profit on Cloud Demand
Intel Introduces Movidius Neural Compute Stick
TSMC InFO packaging Enters Second Generation
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > General Computing > Toshiba...
Last 7 Days News : SU MO TU WE TH FR SA All News

Wednesday, June 20, 2007
Toshiba Develops 60GHz Receiver Technology Using CMOS Device


Toshiba has announced new technology that opens the way to manufacturing powerful ICs for the millimeter-waveband.

The new fabrication process uses a low-cost CMOS process to achieve high-speed integrated wireless communications over short distances, and will support development of consumer applications. Toshiba unveiled the technology on June 15 at Session 17-1 of the 2007 Symposia on VLSI Circuits, in Kyoto, Japan.

Millimeter-wave communication offers high-speed wireless communication in the 60GHz band, a frequency over ten times higher than that of wireless LAN. While communication distances are limited to a few meters due to the nature of the wave, the wide bandwidth of the signal allows data transfers at a rate of more than 1 gigabit a second. In Japan, the U.S. and Europe, frequencies around the 60GHz band are allocated to unlicensed equipment. In the case of Japan, the allocated range is 59 to 66GHz, a width of 7GHz. As a result, millimeter-wave communication is increasingly seen as a solution for short distance transmission of high-speed data.

60GHz IC for millimeter-wave communication have been fabricated with gallium arsenide (GaAs), which is more expensive than CMOS IC. Millimeter-wave GaAs IC also require separate integration on the module of an antenna and a synthesizer, which can not be fabricated with GaAs process technology, plus additional components, including bonding wire and costly ceramic board. This further increases cost and chip die size.

With advances in process technology, complementary metal-oxide semiconductor (CMOS) technology is now approaching a level where it is applicable to the millimeter waveband. This has prompted universities and companies around the world to promote development of CMOS IC, as CMOS devices enjoy the advantages of a low cost silicon substrate, and are the most widely used devices in consumer and industrial digital ICs. In addition, multiple functions, including a digital signal processor can be formed directly on the chip.

Toshiba has realized a 60GHz CMOS receiver chip for the millimeter-wave band. It integrates an on-chip antenna, LNA, a mixer with a preamplifier and a phase-locked loop (PLL) synthesizer in a die that is only 1.1mm x 2.4mm without pad area. Application of 90nm process technology supports high levels of integration and achieves a performance close to that of much more complex and expensive GaAs devices. A fully differential circuitry improves signal quality, as it achieves noise-resistant features suited to millimeter-wave IC application. Optimization of element structure and wiring structure restrain internal noise, and contributes to realizing stable operation?the major issue to overcome for millimeter-wave CMOS IC.


Previous
Next
New ATA Controller LSI for Built-In Hard Disk Drives        All News        MySpace Launches Instant Messaging Service
BenQ Becomes Qisda     General Computing News      MySpace Launches Instant Messaging Service

Get RSS feed Easy Print E-Mail this Message

Related News
Toshiba Resumed Blocking Western Digital Access to JV Database
Court Says Western Digital Should Have Access Toshiba's Technical Databases
Toshiba in Talks with Western Digital, Foxconn Over Memory Unit Sale
Western Digital Responds to Toshiba's Actions
Toshiba Delays Chip Unit Deal, Sues Western Digital
Western Digital Resubmits Bid for Toshiba Chip Unit
Toshiba Chip-Unit Final Agreement Said to be Delayed, WD Opposes Participation of SK Hynix
Toshiba Open to Further Talks With Western Digital About Chip Unit Sale
Japan-led Consortium Wins Toshiba Memory Bidding
Toshiba Applies Spintronics Technology to Strain-gauge Sensor Element to Boost Sensitivity
Western Digital's SanDisk Subsidiaries Seek Injunctive Relief Against Toshiba in the Superior Court of California
Toshiba Faces New Lawsuit Over Accounting Scandal

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2017 - All rights reserved -
Privacy policy - Contact Us .