Friday, December 09, 2016
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Samsung To Brick Remaining Note7 Device Through Software Update
Samsung SDI to Supply Batteries To Lucid Motors
Samsung To Design And Make Chips For Tesla Cars
Google Opens its Digital Assistant to Developers
BlackBerry Unveils BlackBerry Secure For IoT Mobile Security
ARM Physical IP for TSMC 7nm Process Technology Now Available
HTC Launches Vive Studios, Debuts "Arcade Saga" Title
Radeon Software Crimson ReLive Edition Brings Support For Chill, Along With New Features
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > General Computing > Toshiba...
Last 7 Days News : SU MO TU WE TH FR SA All News

Wednesday, June 20, 2007
Toshiba Develops 60GHz Receiver Technology Using CMOS Device


Toshiba has announced new technology that opens the way to manufacturing powerful ICs for the millimeter-waveband.

The new fabrication process uses a low-cost CMOS process to achieve high-speed integrated wireless communications over short distances, and will support development of consumer applications. Toshiba unveiled the technology on June 15 at Session 17-1 of the 2007 Symposia on VLSI Circuits, in Kyoto, Japan.

Millimeter-wave communication offers high-speed wireless communication in the 60GHz band, a frequency over ten times higher than that of wireless LAN. While communication distances are limited to a few meters due to the nature of the wave, the wide bandwidth of the signal allows data transfers at a rate of more than 1 gigabit a second. In Japan, the U.S. and Europe, frequencies around the 60GHz band are allocated to unlicensed equipment. In the case of Japan, the allocated range is 59 to 66GHz, a width of 7GHz. As a result, millimeter-wave communication is increasingly seen as a solution for short distance transmission of high-speed data.

60GHz IC for millimeter-wave communication have been fabricated with gallium arsenide (GaAs), which is more expensive than CMOS IC. Millimeter-wave GaAs IC also require separate integration on the module of an antenna and a synthesizer, which can not be fabricated with GaAs process technology, plus additional components, including bonding wire and costly ceramic board. This further increases cost and chip die size.

With advances in process technology, complementary metal-oxide semiconductor (CMOS) technology is now approaching a level where it is applicable to the millimeter waveband. This has prompted universities and companies around the world to promote development of CMOS IC, as CMOS devices enjoy the advantages of a low cost silicon substrate, and are the most widely used devices in consumer and industrial digital ICs. In addition, multiple functions, including a digital signal processor can be formed directly on the chip.

Toshiba has realized a 60GHz CMOS receiver chip for the millimeter-wave band. It integrates an on-chip antenna, LNA, a mixer with a preamplifier and a phase-locked loop (PLL) synthesizer in a die that is only 1.1mm x 2.4mm without pad area. Application of 90nm process technology supports high levels of integration and achieves a performance close to that of much more complex and expensive GaAs devices. A fully differential circuitry improves signal quality, as it achieves noise-resistant features suited to millimeter-wave IC application. Optimization of element structure and wiring structure restrain internal noise, and contributes to realizing stable operation?the major issue to overcome for millimeter-wave CMOS IC.


Previous
Next
New ATA Controller LSI for Built-In Hard Disk Drives        All News        MySpace Launches Instant Messaging Service
BenQ Becomes Qisda     General Computing News      MySpace Launches Instant Messaging Service

Get RSS feed Easy Print E-Mail this Message

Related News
Toshiba Expands 3D Flash Memory Production Capacity In New Fabrication Facility at Yokkaichi
Toshiba Advances Deep Learning with Extremely Low Power Neuromorphic Processor
Toshiba's Voice Recognition Technology Can Distinguish Multiple Individual Speakers Without Training
Investors Sue Toshiba Over Accounting Scandal
Toshiba Starts Testing System For Future Self-driving Cars
Toshiba, Tohoku Electric and Iwatani Start Study of World?s Largest Hydrogen Energy System
Toshiba Introduces the Value-oriented OCZ TL100 SATA SSD Series
Toshiba Expands 24nm SLC Flash Family with 16Gb Offering
Toshiba Introduces the OCZ VX500 SATA SSD Series
Toshiba to Implement Eyefi Connected Features in Next FlashAir SD Cards
Toshiba Debuts Flashmatrix Technology
Toshiba Announces New BG SSDs with 3-Bit-Per-Cell TLC BiCS FLASH

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2016 - All rights reserved -
Privacy policy - Contact Us .