Saturday, April 19, 2014
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Ex-Apple CEO To Sell Mobiles In India
HTC Hired Ex-Samsung Marketing Officer
Xbox One Wolrdwide Sales Cross 5 million
Samsung Works With GLOBALFOUNDRIES On 14 nm FinFET Offering
Facebook To Find Nearby Friends
Console Sales Lift AMD's First Quarter Results
LG Expands 'Second Screen' TV Ecosystem With Open-Source SDK
Amazon Announces Kindle Service For Samsung Devices
Active Discussions
help questions structure DVDR
Made video, won't play back easily
Questions durability monitor LCD
Questions fungus CD/DVD Media, Some expert engineer in optical media can help me?
CD, DVD and Blu-ray burning for Android in development
IBM supercharges Power servers with graphics chips
Werner Vogels: four cloud computing trends for 2014
Video editing software.
 Home > News > Consumer Electronics > Toshiba...
Last 7 Days News : SU MO TU WE TH FR SA All News

Tuesday, June 12, 2007
Toshiba Develops New NAND Flash Technology


Toshiba today announced a new three dimensional memory cell array structure that enhances cell density and data capacity without relying on advances in process technology, and with minimal increase in the chip die size.

Toshiba announced its new development at the VLSI symposium on June 12.

In the new structure, pillars of stacked memory elements pass vertically through multi-stacked layers of electrode material and utilize shared peripheral circuits. The new design is a potential candidate technology for meeting future demand for higher density NAND flash memory.

Typically, advances in memory density reflect advances in process technology. Toshiba's new approach is based on innovations in the stacking process. Existing memory stacking technologies simply stack two-dimensional memory array on top of another, repeating the same set of processes. While this achieves increased memory cell density, it makes the manufacturing process longer and more complex. The new array does increase memory cell density, is easier to fabricate, and does not produce much increase in chip area, as peripheral circuits are shared by several silicon pillars.



Toshiba said that it would further develop this technology to the level where it wouold be secure and reliabile.


Previous
Next
Nokia's Wireless Technology to Be New Bluetooth Standard        All News        Intel Core 2 Extreme Overclocked at 5 GHz
Epson and Philips Release Reference Design for SVGA Projectors     Consumer Electronics News      Mitsubishi Announces, 640 nm 150 mW CW Laser Diode

Get RSS feed Easy Print E-Mail this Message

Related News
Toshiba Debuts World's Fastest microSD Memory Cards
Toshiba 4K Ultra HD Laptop Retails For $1500
Toshiba to Launch 40-inch 4K TV
Toshiba Introduces Its own Application Processor For Wearables
Toshiba Launches Interface Bridge ICs that Supports SeeQVault Content Security Technology
Toshiba Self-encrypting HDD Meets Government-class Security Requirements
Toshiba Canvio Wireless Adapter Transforms External Hard Drives Into NAS Devices
Toshiba To Ship New 4K Laptops Later This Year
Toshiba Develops Medical Breath Analyzer
Toshiba And GLOBALFOUNDRIES To Work Together On FFSA Manufacturing
Toshiba Sues SK Hynix For Leaking NAND Technology IP
Toshiba Launches 15,000 RPM Enterprise HDDs

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2014 - All rights reserved -
Privacy policy - Contact Us .