Sunday, February 25, 2018
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
MWC: The Cat S61 Smartphone Measures Distances, Senses the Quality of Air
MWC: TCL Introduces Alcatel 5, 3 and 1 Smartphone Series, Android Oreo Smartphone and Tablets
IBM Researchers Talk About the Future of EUV at SPIE
Xiaomi and Microsoft Expand Their Collaboration in cloud, Devices and AI Areas
Google's Augmented Reality SDK ARCore 1.0 Released, Google Lens Updated
Google Assistant is Going Global
TEAC Releases New Reference Series Hi-Res Audio Models
First Affordable Android Go Smartphones Coming Next Week
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > Mobiles > Samsung...
Last 7 Days News : SU MO TU WE TH FR SA All News

Wednesday, May 30, 2007
Samsung Develops High-Density Memory that Simplifies Handset Design


Samsung developed a four gigabyte (GB) MCP (multi-chip package) for mobile phones that for the first time forgoes the need for an external memory card slot and also eliminates having to develop interface software for all types of NAND memory.

Samsung's new moviMCP is a multi-chip package carrying an embedded (moviNAND) memory solution, which provides a simple-to-design memory package that satisfies the high-speed data transmission needs of mobile phones, while fully supporting the communication features within the handset.

The new moviMCP combines a 4GB embedded memory card, which consists of two 16Gb (gigabit) NAND flash chips and a controller, together with a 1Gb mobile DRAM chip to support the processor and a 2Gb NAND flash chip for general handset operations. This provides a total memory capacity of 35Gbs.

Samsung's use of an eMMC interface, the MultiMediaCard Association (MMCA) standard for embedded memory, resolves the design complexity inherent in the functional differences of the various types of NAND flash, by integrating an embedded controller, into the moviMCP. This removes the need to develop interface software for each type of NAND flash.

The new moviMCP stacks several memory functions vertically to enable a small footprint. Its high density eliminates the need for having to also provide an external expansion slot.


Previous
Next
Fujitsu Introduces its First 2.5" HDDs Running at 15,000 rpm        All News        Adobe Released Acrobat 3D 8
Samsung Adds 4GB Memory to Handsets     Mobiles News      New Low End Samsung Phone

Get RSS feed Easy Print E-Mail this Message

Related News
Samsung Max Android Application Offering Mobile Data Saving Mode and Privacy
Worldwide Sales of Smartphones Declined in 4Q, Samsung Retains First Spot
Samsung and Qualcomm Expand Foundry Cooperation on EUV Process Technology
Samsung to Cut OLED Panel Production as iPhone X Demand Slows: report
Samsung Electronics Begins Mass Production of 30.72TB SSD
Samsung Notebook 9 Pen, Notebook 9 (2018) and Notebook 7 Spin (2018) Available February 18
ISSCC: Samsung Working on 7-nm EUV SRAM, Intel Details 10-nm SRAM
Samsung SDI Aims at Cobalt-free EV Batteries
Samsung Chairman Suspect in Tax Evasion Case
China Signs MoU With Samsung on Chip Making
Samsung Introduces The Wall Professional at ISE 2018
Samsung's Lee Freed From Prison

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2018 - All rights reserved -
Privacy policy - Contact Us .