Thursday, August 27, 2015
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Google Says Improving Quality Isn't Anti-competitive
Apple To Announce New iPhones In Sept.9 Event
AMD Radeon R9 Nano Graphics Card Shipping September 10th
ASUS Announces TUF Sabertooth Z170 Mark 1 Motherboard
New Camera-Lens Optical Element Enables Extremely High Levels of Chromatic Aberration Correction
LG Develops Full-Size Keyboard For Pockets
Facebook Is Testing Digital Assistant For Messenger
YouTube Gaming Site Launched
Active Discussions
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
How to burn a backup copy of The Frozen Throne
Help make DVDInfoPro better with dvdinfomantis!!!
Copied dvd's say blank in computer only
menu making
Optiarc AD-7260S review
 Home > News > PC Parts > IBM, Ch...
Last 7 Days News : SU MO TU WE TH FR SA All News

Wednesday, May 23, 2007
IBM, Chartered, Samsung, Infineon and Freescale Expand Technology Agreements


IBM, Samsung Electronics and Chartered Semiconductor Manufacturing have signed a series of joint semiconductor process development and manufacturing agreements, Samsung Electronics said.

The joint development agreements between these companies will now include 32-nanometer (nm) bulk complementary metal oxide semiconductor (CMOS) process technologies and joint development of process design kits (PDKs) to support that technology.

The partners plan to develop and manufacture advanced technology through 2010.

IBM, Chartered and Samsung, as Common Platform technology manufacturers, will be able to use the jointly developed 32nm process technology and design kits to synchronize their manufacturing facilities. This helps facilitate the flexibility to produce nearly identical chips for their respective high-volume OEM clients, who require a multi-sourcing model and expect early access to process technology.

The five companies will focus on low cost and minimum complexity while they will implementa new materials such as high-k/metal gate, advanced stress engineering, and extreme low-k films in the back-end-of-line (BEOL). In addition, the cooperaiton is expected to advance the immersion lithography technology to achieve competitive density and chip size. Providing a platform for derivative technologies such as RF CMOS and embedded DRAM, or eDRAM is also among the goals of the new alliance.

As with previous nodes, 32nm development activities will be conducted at IBM's 300 millimeter (mm) semiconductor fabrication facility in East Fishkill, N.Y. Freescale originally announced its membership in the alliance on Jan. 23.


Previous
Next
Super Talent Announces 1333MHz DDR3 Memory        All News        New Feature on Google Trends Shows List of Current Top-Rising Searches
Super Talent Announces 1333MHz DDR3 Memory     PC Parts News      WD Ships 250 GB Hard Drive For Notebooks

Get RSS feed Easy Print E-Mail this Message

Related News
Samsung Used TSMC's Technology To Prevail In Chip Manufacturing Race
Samsung To Accelerate Chip Production
Samsung Announces New Wireless Audio 360 Speakers
Samsung Says Users Should Follow The Manual With Galaxy Note 5 Stylus
Samsung To Give iPhone Users The new Galaxy Smartphones
New Galaxy Note 5 Phablet Has The Best Display: report
Samsung Offers USB Flash Drive Family
Samsung Introduces Level On Wireless Pro Headphones
IBM Unveils Linux Mainframe System
New Samsung Galaxy Note 5 and S6 Edge Plus Phablets Unveiled
Samsung Rolls Out Line-up of V-NAND SSDs For Data Centers
Samsung Begins Mass Producing 256-Gigabit, 3D V-NAND Flash Memory

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2015 - All rights reserved -
Privacy policy - Contact Us .