Thursday, April 02, 2015
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Facebook Introduces Riff And Scrapbook
The White House Targets Cyber Attackers With New Sanctions Program
Uber Files Complaints Against Service Bans
Yahoo Autos Is Launching Today
GoDaddy Enters The Wall Street
Amazon Button for Instant Product Ordering
Sony To Sell Olympus Shares
Tech Industry Enjoys April Fools' Day
Active Discussions
how to copy and move data files to dvd-rw
cdrw trouble
Need serious help!!!!
burning
nvidia 6200 review
Hello
Burning Multimedia in track 0
I'm lazy. Please help.
 Home > News > PC Parts > IBM, Ch...
Last 7 Days News : SU MO TU WE TH FR SA All News

Wednesday, May 23, 2007
IBM, Chartered, Samsung, Infineon and Freescale Expand Technology Agreements


IBM, Samsung Electronics and Chartered Semiconductor Manufacturing have signed a series of joint semiconductor process development and manufacturing agreements, Samsung Electronics said.

The joint development agreements between these companies will now include 32-nanometer (nm) bulk complementary metal oxide semiconductor (CMOS) process technologies and joint development of process design kits (PDKs) to support that technology.

The partners plan to develop and manufacture advanced technology through 2010.

IBM, Chartered and Samsung, as Common Platform technology manufacturers, will be able to use the jointly developed 32nm process technology and design kits to synchronize their manufacturing facilities. This helps facilitate the flexibility to produce nearly identical chips for their respective high-volume OEM clients, who require a multi-sourcing model and expect early access to process technology.

The five companies will focus on low cost and minimum complexity while they will implementa new materials such as high-k/metal gate, advanced stress engineering, and extreme low-k films in the back-end-of-line (BEOL). In addition, the cooperaiton is expected to advance the immersion lithography technology to achieve competitive density and chip size. Providing a platform for derivative technologies such as RF CMOS and embedded DRAM, or eDRAM is also among the goals of the new alliance.

As with previous nodes, 32nm development activities will be conducted at IBM's 300 millimeter (mm) semiconductor fabrication facility in East Fishkill, N.Y. Freescale originally announced its membership in the alliance on Jan. 23.


Previous
Next
Super Talent Announces 1333MHz DDR3 Memory        All News        New Feature on Google Trends Shows List of Current Top-Rising Searches
Super Talent Announces 1333MHz DDR3 Memory     PC Parts News      WD Ships 250 GB Hard Drive For Notebooks

Get RSS feed Easy Print E-Mail this Message

Related News
Google To Use SSDs From Samsung: report
Samsung Now Offers New Lineup of 3-bit V-NAND Based 850 EVO SSDs for Ultrathin PCs
Samsung, LG End Legal Disputes
IBM Connects Internet of Things to the Enterprise
Samsung Listed In Nvidia's Chip Providers
Samsung to Bring Microsoft Services on More Devices
Samsung Expands Its Lineup of Curved Monitors
IBM Delivers Cloud Data Services with Twitter Built-In
Samsung Demonstrates Enterprise Platforms at CeBIT 2015
Samsung Strengthens Its SSD Business With New Apple Macbook Deal
IBM Buys AlchemyAPI
Samsung Expands Digital Display Portfolio with YESCO Electronics Acquisition

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2015 - All rights reserved -
Privacy policy - Contact Us .