Sunday, April 30, 2017
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Hacker Gets Access To Unreleased "Orange Is The New Black" Netflix Episodes
Turkey Blocks Access To Wikipedia
Qualcomm Slashes Profit Expectations As Apple Refuses To Pay Royalty Payments
Kodi Clarifies DRM Stance, Shuts Down Rumors
ASML Countersues Nikon Over Alleged Patent Infringement
Image Sensors, Batteries And Playstation Boosts Sony's Profit
Cost Cuts Start Paying Off For Sharp
New Nintendo 2DS XL Gaming Handheld System Coming On July 28
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > PC Parts > Spansio...
Last 7 Days News : SU MO TU WE TH FR SA All News

Tuesday, May 15, 2007
Spansion, TSMC Agree on Joint Technology Development


Spansion and TSMC said they have signed a definitive agreement to begin joint development of variations of Spansion's MirrorBit technology, which uses 40-nanometer and more advanced process technologies for memory chips production.

Spansion, a provider of flash memory solutions, will use the jointly developed MirrorBit-related technology to expand its application into new areas of memory solutions, while wafer foundry TSMC will upgrade Spansion's advanced flash memory technologies to volume production, under the agreement, they said.

TSMC had been producing Spansion flash memory wafers using 110-nm technology since the second quarter of 2006.

'Collaborating with Spansion expands our technology portfolio and increases our participation in the fast-growing flash memory business,' TSMC president and chief executive officer Rick Tsai said in the statement.


Previous
Next
Thomson to Acquire Reuters        All News        LG Samsung Form the World's Largest Display Alliance
AMD Opteron Processor Faster Than Xeon in SQL Database Test     PC Parts News      AMD Updates Its I/O Virtualization Technology Specification

Get RSS feed Easy Print E-Mail this Message

Related News
TSMC To Start Producing A11 InFo Chips For New iPhone In April
TSMC May Build 3nm Chip Foundry In The U.S.
TSMC Receives HPC Chip Orders From Nvidia, Qualcomm
Foxconn, TSMC To Bid Together For Toshiba's Memory Business , Says Paper
TSMC Outlines Its 5nm Road Map
TSMC, Samsung Take Different Approaches For 7nm
TSMC, Mentor Graphics To Enable Design and Verification Tools for New InFO Technology Variants
TSMC To Build New Fab for 3nm
ARM Physical IP for TSMC 7nm Process Technology Now Available
TSMC And IBM Detail Their 7nm Progress At 2016 IEDM
TSMC To Relabel Manufacturing Process As 12nm
TSMC, GlobalFoundries/Samsung To Present Their 7nm Platforms At IEDM

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2017 - All rights reserved -
Privacy policy - Contact Us .