DDR3 solutions provided by memory makers including Samsung and Elpida have been validated on Intel 's reference platform to work with Intel?s next generation DDR3 (Double Data Rate - Version 3) chipsets.

DDR3 memory will provide at least twice the bandwidth of today's primary memory ? DDR2 ? with data transfer rates now up to 1.6Gb/s. This will enable much improved 3D graphics, which will directly benefit users of the new Vista operating system. DDR3 also improves the efficiency of multi-threading operations, which will enhance the performance of multi-core systems. DDR3 not only allows for higher system performance, but it also uses only 1.5V of power compared to the 1.8V of DDR2, thereby extending battery life in notebooks. To further optimize system thermal management, DDR3 modules can utilize a thermal sensor on the dual in-line memory module (DIMM).

Samsung announced today that 21 of its DDR3 solutions have been succesfully validated by Intel. The solutions include 13 modules and eight monolithic devices in combinations of 512Megabit (Mb)/1Gigabit (Gb) densities with speeds of 800 or 1066Mb/ps.

The company plans to begin full-scale mass production of its DDR3 chips later this quarter.

In addition, Japanese Elpida Memory, Inc. has also received Intel's validation of its DDR3 main memory based on the G33 chipset reference platform.

Elpida is now shipping SO-DIMM for notebook PCs and is preparing for volume shipments of registered DIMM for servers by making this product available to chipset vendors and major customers for evaluation. Elpida's 1G bit DDR3 memory using 70nm process technology will be coming soon.