Nvidia and Broadcom joined AMD to showcase the 3D graphics, wireless, battery life, and compute performance advantages of next-generation AMD mobile platforms at an event held in San Francisco today.

Based on technologies from the AMD Better by Design program -- including next-generation 65nm AMD Turion 64 X2 dual-core mobile technology, chipsets from AMD and NVIDIA, and wireless networking solutions from Broadcom -- these mobile platforms promise a superior Windows Vista experience for end-users.

AMD's 65nm Silicon-on-Insulator technology provides increased transistor performance, scalability and power efficiency.

Notebook PCs based on the new AMD Turion 64 X2 dual-core mobile technology will be available later this quarter in designs from leading computer manufacturers.

Together with AMD Turion 64 X2 dual-core mobile technology, the recently-launched AMD M690 platform with integrated ATI Radeon X1200 series graphics further advances the mobile computing experience. AMD hopes the new M690 chipset and its existing partnerships can challenge the next version of Intel's Centrino platform, called Santa Rosa, which will be unveiled next week.

At today's event, Broadcom also demonstrated its WLAN performance advantages delivered with the Better by Design program, including its latest 802.11n (draft) technology.

To extend battery life, AMD-based platforms using the AMD M690 chipset incorporate innovative memory technology known as display cache, designed to allow the CPU to operate in low-power mode without accessing system memory. This coupled with the new 65nm process design of the AMD Turion 64 X2 dual-core mobile processor extends battery life to five hours, noted the company.