Saturday, February 13, 2016
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Researchers Download "Game Of Thrones" In Just 1 Second!
Apple: Dr. Dre Starring In New TV Series; New iPhone, iPad Coming in March
Foxconn Seeks For Partner To Boost Bid For Sharp
Micron Outlines Tts First 3D NAND Products
AT&T To Start 5G Trials This Year
Uber Agrees to Settle Safety Lawsuits
Google To Expand Right-to-Be-Forgotten Removals Following Pressure From Europe
Apple And At&T Sued For Infringement of Touch Feedback Patents
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
How to burn a backup copy of The Frozen Throne
Help make DVDInfoPro better with dvdinfomantis!!!
Copied dvd's say blank in computer only
menu making
 Home > News > PC Parts > IBM Use...
Last 7 Days News : SU MO TU WE TH FR SA All News

Thursday, May 03, 2007
IBM Uses Self-assembling Material in Chip Advance


IBM has developed a way to make microchips run up to one-third faster or use 15 percent less power by using an exotic material that "self-assembles" in a similar way to a seashell or snowflake.

The company said the new process allows the wiring on a chip to be insulated with vacuum, replacing the glass-like substances used for decades but which have become less effective as chips steadily shrink.

It is the latest achievement for IBM researchers, who have announced a number of advances in recent months allowing chips to get smaller despite challenges posed by physical laws at those tiny dimensions.

"This is one of the biggest breakthroughs I've seen in the last decade," said John Kelly, IBM's senior vice president of technology and intellectual property.

"The holy grail of insulators is to use vacuum ... and we've broken the code on how to do this," Kelly said.

The technique works by coating a silicon wafer with a layer of a special polymer that when baked, naturally forms trillions of uniformly tiny holes just 20 nanometers, or millionth of a millimeter, across.

The resulting pattern is used to create the copper wiring on top of a chip and the insulating gaps that let electricity flow smoothly. A similar process is seen in nature during the formation of snowflakes, tooth enamel and seashells, IBM said.

"The problem they needed to solve was how to create lots of deep little wells in the insulation area between the wires," said Nathan Brookwood, who runs Insight 64, an industry consultancy.

"Typically, whenever they tried, they ended up making a chip that was like Swiss cheese and had no mechanical integrity," Brookwood said.

Kelly said that while IBM plans to use the process in its chips in 2009, it has already made prototypes based on existing designs and it could employ the technique sooner.

IBM will also "selectively license" the technology to partners, Kelly said. IBM has research efforts with No. 2 computer processor maker AMD, Toshiba, and others.


Previous
Next
Oracle, IBM, NEC to market Linux in Japan        All News        Yahoo Offers Web-based Instant Messaging
AMD Unveils 65nm AMD Turion Dual-Core Mobile Processors     PC Parts News      Hynix Claims Industry's First DDR3 Validations

Get RSS feed Easy Print E-Mail this Message

Related News
Western Digital Buys Storage And Memory Patents From IBM
IBM Forecasts Weak Earnings For 2016
IBM Remains First In Patents, Study Finds
IBM Opens Watson IoT Global Headquarters In Germany
IBM’s Watson Forecasts Products for Holiday Season
IBM, Xilinx target Intel With Chip Collaboration
IBM To Buy The Weather Company's Product and Technology Businesses
IBM Takes On Intel's x86 Systems With New Linux Servers
Research Breakthrough Paves Way for Post-Silicon Future
IBM and ARM Collaborate to Accelerate Delivery of Internet of Things
IBM Unveils Linux Mainframe System
Watson to Gain Ability to See with Acquisition of Merge Healthcare

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2016 - All rights reserved -
Privacy policy - Contact Us .