Thursday, July 31, 2014
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Kaleidescape Joins the One-Blue Licensing Program
AMD Opteron 64-Bit ARM-Based Developer Kits Now Available
Samsung Galaxy Note 4 Coming On September 3
Google To Show Ratings to Search-Results Ads
Samsung And Apple See Their Smartphone Market Shares Plunging
Twitter Says Its User base Increased
Microsoft Details Windows Phone 8.1 Update, Brings Cortana To New Markets
Facebook to Shut Down Gifts Service
Active Discussions
help questions structure DVDR
Made video, won't play back easily
Questions durability monitor LCD
Questions fungus CD/DVD Media, Some expert engineer in optical media can help me?
CD, DVD and Blu-ray burning for Android in development
IBM supercharges Power servers with graphics chips
Werner Vogels: four cloud computing trends for 2014
Video editing software.
 Home > News > PC Parts > IBM Use...
Last 7 Days News : SU MO TU WE TH FR SA All News

Thursday, May 03, 2007
IBM Uses Self-assembling Material in Chip Advance


IBM has developed a way to make microchips run up to one-third faster or use 15 percent less power by using an exotic material that "self-assembles" in a similar way to a seashell or snowflake.

The company said the new process allows the wiring on a chip to be insulated with vacuum, replacing the glass-like substances used for decades but which have become less effective as chips steadily shrink.

It is the latest achievement for IBM researchers, who have announced a number of advances in recent months allowing chips to get smaller despite challenges posed by physical laws at those tiny dimensions.

"This is one of the biggest breakthroughs I've seen in the last decade," said John Kelly, IBM's senior vice president of technology and intellectual property.

"The holy grail of insulators is to use vacuum ... and we've broken the code on how to do this," Kelly said.

The technique works by coating a silicon wafer with a layer of a special polymer that when baked, naturally forms trillions of uniformly tiny holes just 20 nanometers, or millionth of a millimeter, across.

The resulting pattern is used to create the copper wiring on top of a chip and the insulating gaps that let electricity flow smoothly. A similar process is seen in nature during the formation of snowflakes, tooth enamel and seashells, IBM said.

"The problem they needed to solve was how to create lots of deep little wells in the insulation area between the wires," said Nathan Brookwood, who runs Insight 64, an industry consultancy.

"Typically, whenever they tried, they ended up making a chip that was like Swiss cheese and had no mechanical integrity," Brookwood said.

Kelly said that while IBM plans to use the process in its chips in 2009, it has already made prototypes based on existing designs and it could employ the technique sooner.

IBM will also "selectively license" the technology to partners, Kelly said. IBM has research efforts with No. 2 computer processor maker AMD, Toshiba, and others.


Previous
Next
Oracle, IBM, NEC to market Linux in Japan        All News        Yahoo Offers Web-based Instant Messaging
AMD Unveils 65nm AMD Turion Dual-Core Mobile Processors     PC Parts News      Hynix Claims Industry's First DDR3 Validations

Get RSS feed Easy Print E-Mail this Message

Related News
IBM Talks With Globalfoundries Stall Over Price: report
Apple and IBM Partner On Enterprise Mobility
IBM Announces $3 Billion Investment In Future Chip Research
IBM To Help China Deliver on Ambitious Energy and Environmental Goals
China Clears IBM, Lenovo Server Deal
IBM Hopes Nanotube Transistors Are Coming Aroud 2020
IBM May Sell Chip-Making Unit to Globalfoundries: report
IBM Ships POWER8 Power System Servers
IBM Patent Helps Eliminate Fraudulent Behavior in the Cloud
IBM And Fujifilm Squeeze Really Big Data In Magnetic Tapes
Researchers Discover New 'Self-healing' Industrial Polymers
IBM Develops Ultra-fast Phase Change Memory System

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2014 - All rights reserved -
Privacy policy - Contact Us .