Monday, August 29, 2016
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Facebook 'Trending' To Rely Less On Humans
Apple Patches iOS Security Flaws Discovered In Spyware Targeting Activist
LG To Showcase Latest OLED TVs Compatible With HDR Technologies At IFA
NHK Join Forces With Panasonic And Sony To Win The 8K TV Race
Intel Introduces New 3D NAND SSDs
Facebook To Use Personal Data From WhatsApp To Bring You Personalized Ads
Amazon Introduces Car Research Portal
Google Uses Artificial Intelligence To Compress Images
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > PC Parts > Hynix C...
Last 7 Days News : SU MO TU WE TH FR SA All News

Wednesday, May 02, 2007
Hynix Claims Industry's First DDR3 Validations


Hynix Semiconductor today announced it has received the industry?s first validation on its DDR3 memory components and modules from Intel.

Hynix?s newly-validated DDR3 products are 1Gigabit DDR3 SDRAM component manufactured on the Company?s 80nm process technology, 1Gigabyte and 2Gigabyte DDR3 Unbuffered-DIMMs. These devices boast operating speeds of 800MHz and 1066MHz at 1.5V power supply. These speeds are offered in latency combinations of 5-5-5 and 6-6-6 for 800MHz, and 7-7-7 for 1066MHz, to suit the needs of a wide range of PCs, workstations and other applications.

DDR3 also features reduced current consumption of almost 25%, compared to the present generation DDR2. Hynix says that its 'three-dimensional transistor' architecture minimizes current leakage to further reduce overall current consumption and ensure data integrity.

DDR3 is expected to succeed the current mainstream DDR2 products. Demand for DDR3 is expected to emerge towards the end of the year.

Mass production of the 1Gb DDR3 on the 80nm line will begin in the third quarter of this year. Hynix plans to manufacture the product on the new 66nm process beginning in late 2007.


Previous
Next
Google Expands Personalization With iGoogle        All News        Microsoft Releases Test Version of Silverlight Media Player
IBM Uses Self-assembling Material in Chip Advance     PC Parts News      OCZ Unleashes VBoost USB 2.0 Flash Drive

Get RSS feed Easy Print E-Mail this Message

Related News
SK Hynix Challenges Samsung With Mass Production Of UFS 2.1 3D Memory Solution
SK Hynix to Promote Its MDS Technology
SK Hynix To Reduce Investments In Memory Chips
SK Hynix Starts Mass Production Of 3D NAND Memory
SK Hynix to Proceed With Development Of 10nm DRAM
18nm DRAM Coming Next Year
Samsung, Sk Hynix To Present HBM2 DRAM Development
SK Hynix Rejects Chinese Take-over Offer
JEDEC Updates Standards for LPDDR3 And LPDDR4
SK Hynix To Reduce Investments
SK Hynix To Produce V-NAND In 2016
SK Hynix to Heavily Invest In New Chip Plants

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2016 - All rights reserved -
Privacy policy - Contact Us .