Saturday, October 21, 2017
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
DVDFab Debuts 4K Ultra HD Copy Software
Razer Unveils New Broadcasting Camera and Microphone
Microsoft's Cortana Gets Into Smart Speakers Market With Harman Kardon Invoke
Samsung, LG Electronics are Lagging in Autonomous Car Race
TSMC Raises Forecasts for 2017 Due to 10nm Demand, Outlines 7 and 5nm Roadmap
Samsung Said to Have Placed Huge EUV Equipment Order From ASML
Samsung Launches the Ruggedized Galaxy Tab Active2 for Business
Intel Capital Announces $60 million of New Investments in Data-Focused Startups
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > PC Parts > Hynix C...
Last 7 Days News : SU MO TU WE TH FR SA All News

Wednesday, May 02, 2007
Hynix Claims Industry's First DDR3 Validations


Hynix Semiconductor today announced it has received the industry?s first validation on its DDR3 memory components and modules from Intel.

Hynix?s newly-validated DDR3 products are 1Gigabit DDR3 SDRAM component manufactured on the Company?s 80nm process technology, 1Gigabyte and 2Gigabyte DDR3 Unbuffered-DIMMs. These devices boast operating speeds of 800MHz and 1066MHz at 1.5V power supply. These speeds are offered in latency combinations of 5-5-5 and 6-6-6 for 800MHz, and 7-7-7 for 1066MHz, to suit the needs of a wide range of PCs, workstations and other applications.

DDR3 also features reduced current consumption of almost 25%, compared to the present generation DDR2. Hynix says that its 'three-dimensional transistor' architecture minimizes current leakage to further reduce overall current consumption and ensure data integrity.

DDR3 is expected to succeed the current mainstream DDR2 products. Demand for DDR3 is expected to emerge towards the end of the year.

Mass production of the 1Gb DDR3 on the 80nm line will begin in the third quarter of this year. Hynix plans to manufacture the product on the new 66nm process beginning in late 2007.


Previous
Next
Google Expands Personalization With iGoogle        All News        Microsoft Releases Test Version of Silverlight Media Player
IBM Uses Self-assembling Material in Chip Advance     PC Parts News      OCZ Unleashes VBoost USB 2.0 Flash Drive

Get RSS feed Easy Print E-Mail this Message

Related News
SK Hynix to Invest 395 billion yen in Toshiba chip unit
SK hynix Reports Record Q2 Results on Strong Chip Sales
SK Hynix and Micron Try To Catch up With Samsung in 10nm DRAM Production
Broadcom, KKR and SK Hynix - Bain Join Final Bidding Round for Toshiba's Memory Unit
SK Hynix Reports Strong First Quarter Results
SK Hynix Introduces First 72-Layer 3D NAND Flash
SK Hynix Offers More Than $9 billion for Toshiba Chip Unit: report
Toshiba Informs SK hynix of New Plan to Sell Memory Business
SK hynix Bids for Stake in Toshiba's Memory Chip Business
SK Hynix Chalks Operating Profit in 4Q, Outlines Plans For 2017
SK Expands Semiconductor Business By Acquiring LG Siltron
SK Hynix Launches First 8GB LPDDR4X For Mobile Devices

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2017 - All rights reserved -
Privacy policy - Contact Us .