Akita Elpida Memory, Inc. said it has developed the world's thinnest Multi Chip Package (MCP) with 20 stacked dies.
To achieve 30 ?m thick chips the company used grinding technology and developed handling technology for such thin die. Akita Elpida also developed 40-micron low-loop wire-bonding technology and the means to inject resin into narrow gap.
Akita Elpida said it plans from now on to put this package technology to work to establish high-yield and low-cost manufacturing technology for multi-chip stacked packages such as existing 5- and 7-die multi-chip stacked packages.
Akita Elpida was created in July 2006 by DRAM maker Elpida Memory Inc. with a business scope focusing on semiconductor back-end processes.